Semiconductor device
First Claim
1. A semiconductor device comprising:
- a first coil over a substrate, the first coil being configured so that an electromagnetic induction is generated between the first coil and a first device;
a first power supply circuit electrically connected to the first coil;
a second coil over the substrate, the second coil being configured so that an electromagnetic induction is generated between the second coil and a second device; and
a second power supply circuit electrically connected to the second;
coil,wherein the second coil is lateral to the first coil, andwherein the second coil does not overlap with the first coil.
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Accused Products
Abstract
In an RF tag, a mask ROM or a flash memory is used for storing data such as an ID number. Although the mask ROM can be realized at a low price, rewriting is not possible. In addition, in the flash memory, although electric rewriting is possible, production cost increases. Accordingly, it is difficult to provide an RF tag by which data rewriting is possible at a low price. An RF tag is provided with a power supply circuit having a function to generate a power supply voltage from a weak radio signal and a memory which can hold data stored in a data holding portion by the power supply voltage. With the above structure, a high-performance RF tag capable of rewriting data such as an ID number after production can be provided at a low price.
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Citations
28 Claims
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1. A semiconductor device comprising:
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a first coil over a substrate, the first coil being configured so that an electromagnetic induction is generated between the first coil and a first device; a first power supply circuit electrically connected to the first coil; a second coil over the substrate, the second coil being configured so that an electromagnetic induction is generated between the second coil and a second device; and a second power supply circuit electrically connected to the second;
coil,wherein the second coil is lateral to the first coil, and wherein the second coil does not overlap with the first coil. - View Dependent Claims (2, 3, 4)
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5. A semiconductor device comprising:
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a first coil over a substrate, the first coil being configured so that an electromagnetic induction is generated between the first coil and a first device; a first circuit electrically connected to the first coil, the first circuit comprising a first capacitor and a first diode; a second coil over the substrate, the second coil being configured so that an electromagnetic induction is generated between the second coil and a second device; and a second circuit electrically connected to the second coil, the second circuit comprising a second capacitor and a second diode, wherein the second coil is lateral to the first coil, and wherein the second coil does not overlap with the first coil. - View Dependent Claims (6, 7, 8)
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9. A semiconductor device comprising:
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a first coil over a substrate, the first coil being configured so that an electromagnetic induction is generated between the first coil and a first device; a first circuit electrically connected to the first coil, the first circuit comprising a first capacitor and a first diode; a second coil over the substrate, the second coil being configured so that an electromagnetic induction is generated between the second coil and a second device; and a second circuit electrically connected to the second coil, the second circuit comprising a second capacitor and a second diode, wherein the substrate comprises a first region and a second region, wherein the first circuit is located over the first region, wherein the first coil is located over a periphery of the first region so that the first coil does not overlap with the first circuit, wherein the second circuit is located over the second region, and wherein the second coil is located over a periphery of the second region so that the second coil does not overlap with the second circuit. - View Dependent Claims (10, 11)
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12. A semiconductor device comprising:
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a first coil over a substrate, the first coil being configured so that a first energy transmission between the first coil and a first device is caused by an electromagnetic induction; a first power supply circuit electrically connected to the first coil; a second coil over the substrate, the second coil being configured so that a second energy transmission between the second coil and a second device is caused by an electromagnetic induction; and a second power supply circuit electrically connected to the second coil, wherein the second coil is lateral to the first coil, and wherein the second coil does not overlap with the first coil. - View Dependent Claims (13, 14, 15, 16, 17)
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18. A semiconductor device comprising:
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a first coil over a substrate, the first coil being configured so that a first energy transmission between the first coil and a first device is caused by an electromagnetic induction; a first circuit electrically connected to the first coil, the first circuit comprising a first capacitor and a first diode; a second coil over the substrate, the second coil being configured so that a second energy transmission between the second coil and a second device is caused by an electromagnetic induction; and a second circuit electrically connected to the second coil, the second circuit comprising a second capacitor and a second diode, wherein the second coil is lateral to the first coil, and wherein the second coil does not overlap with the first coil. - View Dependent Claims (19, 20, 21, 22, 23)
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24. A semiconductor device comprising:
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a first coil over a substrate, the first coil being configured so that a first energy transmission between the first coil and a first device is caused by an electromagnetic induction; a first circuit electrically connected to the first coil, the first circuit comprising a first compacitor and a first diode; a second coil over the substrate, the second coil being configured so that a second energy transmission between the second coil and a second device is caused by an electromagnetic induction; and a second circuit electrically connected to the second coil, the second circuit comprising a second capacitor and a second diode, wherein the substrate comprises a first region and a second region, wherein the first circuit is located over the first region, wherein the first coil is located over a periphery of the first region so that the first coil does not overlap with the first circuit, wherein the second circuit is located over the second region, and wherein the second coil is located over a periphery of the second region so that the second coil does not overlap with the second circuit. - View Dependent Claims (25, 26, 27, 28)
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Specification