Technique for the growth of planar semi-polar gallium nitride

• US 8,524,012 B2
• Filed: 01/24/2012
• Issued: 09/03/2013
• Est. Priority Date: 03/10/2005
• Status: Active Grant

• Current Assignee: Japan Science And Technology Agency, Regents of the University of California (University of California)
• Original Assignee: Japan Science And Technology Agency, Regents of the University of California (University of California)
• Inventors: Baker, Troy J., Haskell, Benjamin A., Fini, Paul T., DenBaars, Steven P., Speck, James S., Nakamua, Shuji
• Primary Examiner(s): FOURSON III, GEORGE R
• Application Number:
  US13/357,432
• Publication Number:
  US 20120119222A1
• Time in Patent Office: 588 Days
• Field of Search: 438/46, 438/47, 438/479, 438/938, 148/33, 257/E21.113, 257/E21.463, 117/101
• US Class Current: 148/33
• CPC Class Codes: C30B 25/02 Epitaxial-layer growth
• CPC Class Codes: C30B 25/18 characterised by the substrate
• CPC Class Codes: C30B 29/406 Gallium nitride
• CPC Class Codes: H01L 21/0242 Crystalline insulating materials
• CPC Class Codes: H01L 21/02433 Crystal orientation
• CPC Class Codes: H01L 21/0254 Nitrides
• CPC Class Codes: H01L 21/02658 Pretreatments cleaning in general H01L21/02041
• CPC Class Codes: H01L 33/007 comprising nitride compounds
• CPC Class Codes: Y10S 438/938 Lattice strain control or utilization

Abstract

A method for growing planar, semi-polar nitride film on a miscut spinel substrate, in which a large area of the planar, semi-polar nitride film is parallel to the substrate'"'"'s surface. The planar films and substrates are: (1) {1011} gallium nitride (GaN) grown on a {100} spinel substrate miscut in specific directions, (2) {1013} gallium nitride (GaN) grown on a {110} spinel substrate, (3) {1122} gallium nitride (GaN) grown on a {1100} sapphire substrate, and (4) {1013} gallium nitride (GaN) grown on a {1100} sapphire substrate.

Claims

1. A device, comprising:

a semi-polar III-nitride layer, wherein;

the semi-polar oriented III-nitride layer has a surface area of at least 10 mm by 10 mm,

the surface area has a semi-polar orientation, and

the semi-polar III-nitride layer has a crystal quality suitable for subsequent growth of a semi-polar device layer structure on the surface area.

2. The device of claim 1, wherein the crystal quality is such that the surface area has a root mean square surface roughness of no more than 3.5 nanometers over an area of at least 5 micrometers by 5 micrometers.

3. The device of claim 1, wherein the crystal quality is such that the surface area has a root mean square surface roughness of no more than 5.5 nanometers over an area of at least 5 micrometers by 5 micrometers.

4. The device of claim 1, wherein the semi-polar III-nitride layer comprises Gallium Nitride with the crystal quality characterized by basal plane stacking faults having a density of no more than 2×

10⁵ cm<sup>−

1</sup>.

5. The device of claim 1, wherein the semi-polar III-nitride layer comprises Gallium Nitride with the crystal quality characterized by a threading dislocation density of no more than 9×

10⁸ cm<sup>−

2</sup>.

6. The device of claim 1, wherein:

the semi-polar III-nitride layer has the crystal quality characterized by an on-axis rocking curve having a peak for the semi-polar orientation with a full width at half maximum (FWHM) of;

no more than 900 arcseconds for rocking towards a [0002] direction, and

no more than 750 arcseconds, for rocking toward a [1-210] direction, and wherein the rocking curve is measured by X-ray diffraction.

7. The device of claim 1, wherein the semi-polar III-nitride is single crystal.

8. The device of claim 1, wherein the surface area is planar.

9. The device of claim 1, wherein the surface area has a stable semi-polar orientation.

10. The device of claim 1, wherein the semi-polar oriented III-nitride layer and surface area have a {10-11} orientation.

11. The device of claim 1, wherein the semi-polar oriented III-nitride layer and the surface area have a {10-13} orientation.

12. The device of claim 1, wherein the semi-polar oriented III-nitride layer and the surface area have a {10-14} orientation.

13. The device of claim 1, wherein the semi-polar oriented III-nitride layer and the surface area have a {11-22} orientation.

14. The device of claim 1, wherein the semi-polar oriented III-nitride layer and the surface area have a {20-21} orientation.

15. The device of claim 1, wherein the semi-polar III-nitride layer is Gallium Nitride.

16. The device of claim 1, wherein the semi-polar III-nitride layer is Aluminum Nitride.

17. The device of claim 1, wherein the semi-polar III-nitride layer is heteroepitaxially on a foreign substrate.

18. The device of claim 17, wherein the foreign substrate is sapphire.

19. The device of claim 17, wherein the foreign substrate is spinel.

20. The device of claim 1, further comprising a light emitting diode structure deposited on the surface area.

21. The device of claim 20, wherein the light emitting diode structure is a green light emitting diode structure.

22. The device of claim 1, wherein the semi-polar III-nitride layer reduces polarization in the device layer structure grown on the surface area, as compared to a device layer structure grown on a c-plane polar nitride film, the polarization resulting from the device layer structure and the films having dissimilar compositions and therefore different lattice constants.

23. A method of fabricating a device, comprising:

growing a semi-polar III-nitride layer, wherein;

the semi-polar oriented III-nitride layer has a surface area of at least 10 mm by 10 mm,

the surface area has a semi-polar orientation, and

the semi-polar III-nitride layer is suitable for subsequent growth of a semi-polar device layer structure on the surface area.

24. The method of claim 23, wherein growing the semi-polar III-nitride layer comprises:

(a) choosing a substrate and an orientation of a surface of the substrate based on a desired semi-polar orientation for the semi-polar III-nitride layer;

(b) loading the substrate in a reactor;

(c) ramping a temperature of the reactor; and

(d) during the ramping, flowing a combination of gases over the surface of the substrate, wherein;

(i) the combination of gases comprises one or more of ammonia, hydrogen, and nitrogen; and

(ii) the combination of gases is selected based on the substrate and the desired semi-polar orientation; and

(e) when a growth temperature is reached, growing the semi-polar III-nitride layer on the surface of the substrate, using a vapor phase epitaxy or vapor deposition, wherein;

a growth surface of the semi-polar III-nitride layer is planar and stable, and

the growth surface of the semi-polar nitride film has the surface area of at least 10 mm×

10 mm parallel to the surface of the substrate.

25. The method of claim 24, wherein:

(f) when the substrate is sapphire and the surface is a {1 100} surface of the sapphire,

(i) the gas flows comprise the nitrogen and the hydrogen flowed as the reactor'"'"'s temperature is ramped up to the growth temperature, so that the ammonia flows at the growth temperature, to obtain a planar, semi-polar GaN film that is {10 13} GaN, or

(ii) the gas flows comprise ammonia flowed as the reactor'"'"'s temperature is ramped up to the growth temperature, so that the ammonia flows at a low temperature, to obtain the planar semi-polar GaN film that is {11 22} GaN;

(g) when the substrate is a spinel substrate and the surface is a {110} surface of the spinel, the ramping of the temperature is under conditions to encourage nitridization of the surface of the spinel, to obtain the planar semi-polar GaN film that is {10 13} GaN; and

(h) when the substrate is a spinel substrate and the surface is a {100} surface of the spinel miscut in a <

011>

direction, the ramping of the temperature is under conditions to encourage nitridization of the surface of the spinel, to obtain a planar semi-polar GaN film that is {10 11} GaN.

26. A device structure, comprising:

a semi-polar III-nitride layer, wherein;

the semi-polar oriented III-nitride layer has a surface area of at least 10 mm by 10 mm,

the surface area has a semi-polar orientation, and

a III-nitride light emitting diode (LED) structure deposited on the surface area.