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Semiconductor light emitting diodes including multiple bond pads on a single semiconductor die

  • US 8,524,515 B2
  • Filed: 11/03/2010
  • Issued: 09/03/2013
  • Est. Priority Date: 06/11/2007
  • Status: Active Grant
First Claim
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1. A light emitting device comprising:

  • a semiconductor light emitting diode that comprises a single semiconductor die; and

    at least eight cathode bond pads on the single semiconductor die.

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  • 3 Assignments
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