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Semiconductor device

  • US 8,525,294 B2
  • Filed: 07/02/2009
  • Issued: 09/03/2013
  • Est. Priority Date: 09/18/2008
  • Status: Active Grant
First Claim
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1. A semiconductor device comprising:

  • a semiconductor package including a main plane and a connection electrode protruding from said main plane, anda coil having at least a portion provided at said semiconductor package,said coil having an axis inclined with respect to a normal line of said main plane,wherein said coil is configured to be directly connected to a wiring of a substrate where said semiconductor package is mounted, and to be electrically connected to a coil of another semiconductor device through said wiring.

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