Electronic device and manufacturing method therefor

• US 8,525,333 B2
• Filed: 03/17/2009
• Issued: 09/03/2013
• Est. Priority Date: 03/17/2008
• Status: Active Grant

• Current Assignee: Renesas Electronics Corporation
• Original Assignee: Renesas Electronics Corporation
• Inventors: Kanetaka, Yoshifumi
• Primary Examiner(s): CHU, CHRIS C
• Application Number:
  US12/736,191
• Publication Number:
  US 20110006433A1
• Time in Patent Office: 1,631 Days
• Field of Search: 257/E21.499, 257/E23.141, 257/773, 257/737, 257/738, 257/778, 257/776, 257/784, 257/786, 257/693, 257/E23.021, 257/E23.069, 257/780, 438/125, 438612-614
• US Class Current: 257/738
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H05K 2201/094 Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
• CPC Class Codes: H05K 2201/09781 Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
• CPC Class Codes: H05K 3/321 by conductive adhesives
• CPC Class Codes: H05K 3/3436 having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

An electronic device includes the electronic element, the interposer substrate, on one surface of which the electronic element is mounted, and the interconnection substrate, on one surface of which the interposer substrate is mounted. One portion of the connection parts is an electrical connection part that electrically interconnects the interposer substrate and the interconnection substrate. The remaining portion is a dummy connection part that produces no functional deficiency even when the dummy connection part does not electrically interconnect the interposer substrate with the interconnection substrate. The dummy connection part includes at least one of the connection parts that at least partially overlap with the electronic element in a plan projection and are preferably arranged along an outer rim of the plan projection of the electronic element.

Claims

1. An electronic device, comprising:

an electronic element;

an interposer substrate having mounted on one surface thereof said electronic element;

an interconnection substrate, comprising on one surface thereof, said interposer substrate; and

a plurality of connection parts interconnecting said interposer substrate and said interconnection substrate,

wherein one portion of said connection parts comprises an electrical connection part that electrically interconnects said interposer substrate with said interconnection substrate, and a remaining portion comprises a dummy connection part that produces no functional deficiency even when said dummy connection part fails to electrically interconnect said interposer substrate with said interconnection substrate,

wherein said dummy connection part comprises at least one out of said connection parts at least partially overlapping with said electronic element in a plan projection,

wherein said dummy connection part overlaps the electronic element at a location on the element which is farthest from a center of said electronic element,

wherein the plurality of connection parts comprises a connection material, and a Young'"'"'s modulus of said connection material in said dummy connection part is greater than a Young'"'"'s modulus of said connection material in said electrical connection part,

wherein the electrical connection part comprises a first electrical connection part overlapping the electronic element and a second electrical connection part not overlapping the electronic element in the plan projection,

wherein the one surface of the interconnection substrate has a substantially rectangular shape and an imaginary diagonal line, and

wherein a distance between the dummy connection part and the first electrical connection part which is next to the dummy connection part is shorter than a distance between the dummy connection part and the second electrical connection part which is next to the dummy connection part along the imaginary diagonal line.

2. The electronic device according to claim 1, wherein, among said connection parts that at least partially overlap with said electronic element in the plan projection, said dummy connection part comprises at least one of said connection parts that are arranged along an outer rim of said electronic element in said plan projection.

3. The electronic device according to claim 2, wherein, among said connection parts that at least partially overlap with said electronic element in the plan projection, said dummy connection part comprises at least one of said connection parts that are provided closest to angular parts of said electronic element in said plan projection.

4. The electronic device according to claim 2, wherein said connection parts include a first electrode formed on an other surface of said interposer substrate, a second electrode formed on said one surface of said interconnection substrate,

wherein the connection material interconnects said first and second electrodes,

wherein, in said electrical connection part, said connection material comprises an electrically conductive material electrically connecting said first and second electrodes to each other, and

wherein, in said dummy connection part, said connection material comprises an electrically conductive material electrically connecting one of said first and second electrodes to each other and a joining material that joins said first and second electrodes to each other.

5. The electronic device according to claim 1, wherein, among said connection parts that at least partially overlap with said electronic element in the plan projection, said dummy connection part comprises at least one of said connection parts that are provided closest to angular parts of said electronic element in said plan projection.

6. The electronic device according to claim 5, wherein said connection parts include a first electrode formed on an other surface of said interposer substrate, a second electrode formed on said one surface of said interconnection substrate,

wherein the connection material interconnects said first and second electrodes,

wherein, in said electrical connection part, said connection material comprises an electrically conductive material electrically connecting said first and second electrodes to each other, and

wherein, in said dummy connection part, said connection material comprises an electrically conductive material electrically connecting one of said first and second electrodes to each other and a joining material that joins said first and second electrodes to each other.

7. The electronic device according to claim 1, wherein said connection parts further include a first electrode formed on an other surface of said interposer substrate, a second electrode formed on said one surface of said interconnection substrate,

wherein the connection material interconnects said first and second electrodes,

wherein, in said electrical connection part, said connection material comprises an electrically conductive material electrically connecting said first and second electrodes to each other, and

wherein, in said dummy connection part, said connection material comprises an electrically conductive material electrically connecting said first and second electrodes to each other or a joining material that joins said first and second electrodes to each other.

8. The electronic device according to claim 7, wherein the connection material in said dummy connection part comprises one of a resin, an electrically conductive resin, and an electrically conductive paste.

9. The electronic device according to claim 1, wherein said dummy connection part is continuously formed along an outer rim of the plan projection of said electronic element in a region at least partially overlapping with said electronic element in the plan projection.

10. The electronic device according to claim 9, wherein the connection material in said dummy connection part comprises one of a resin, an electrically conductive resin, and an electrically conductive paste.

11. A semiconductor device, comprising:

an electronic element;

an interposer substrate having mounted on a surface thereof said electronic element;

an interconnection substrate comprising, on a surface thereof, said interposer substrate;

a plurality of connection parts interconnecting said interposer substrate and said interconnection substrate;

an electrical connection part that electrically interconnects said interposer substrate with said interconnection substrate; and

a dummy connection part, said dummy connection part comprising a connection material comprising a resin, said dummy connection part being configured to produce no functional deficiency when said dummy connection part fails to electrically interconnect said interposer substrate with said interconnection substrate, said dummy connection part being arranged to at least partially overlap with said electronic element in a plan view,

wherein said dummy connection part overlaps the electronic element at a location on the element which is provided along an outer rim of the electronic element,

wherein the electrical connection part comprises a first electrical connection part overlapping the electronic element and a second electrical connection part not overlapping the electronic element in the plan projection,

wherein the surface of the interconnection substrate has a substantially rectangular shape and an imaginary diagonal line, and

wherein a distance between the dummy connection part and the first electrical connection part which is next to the dummy connection part is shorter than a distance between the dummy connection part and the second electrical connection part which is next to the dummy connection part along the imaginary diagonal line.

12. The semiconductor device according to claim 11, wherein said dummy connection part is provided continuously, encircling a grid array of the electrical connection parts.

13. The semiconductor device according to claim 11, wherein said dummy connection part is provided along the outer rim of the region overlapping the electronic element, in the plan view.