Wireless power circuit board and assembly
First Claim
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1. A circuit board assembly comprising:
- a multiple layer substrate, having a first layer and a second layer;
a wireless power transmit coil disposed on or in the first layer and coupled via a conductive line or trace to a power source that provides power to the wireless power transmit coil to generate wireless power;
an integrated circuit (IC) mounted on the second layer; and
a wireless power receive coil disposed between the wireless power transmit coil and the IC and disposed to have the IC substantially residing atop the wireless power receive coil, in which the wireless power receive coil is coupled to the IC, wherein when the wireless power receive coil receives the wireless power from the wireless power transmit coil, the wireless power receive coil is operable to utilize the wireless power to supply circuit power to the IC and wherein the multiple layer substrate with the IC, wireless power transmit coil and the wireless power receive coil form a unitary component.
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Abstract
A circuit board assembly includes a multiple layer substrate, a wireless power transmitter control module, a wireless power coil assembly, and a plurality of ICs. The wireless power transmitter control module is supported by a layer of the multiple layer substrate and the wireless power coil assembly is fabricated on an inner layer of the multiple layer substrate. The ICs are mounted on an outer layer of the multiple layer substrate, wherein an IC of the plurality of IC is aligned to substantially overlap a coil of the wireless power coil assembly and is wirelessly powered by the wireless power transmitter control module via the coil.
53 Citations
20 Claims
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1. A circuit board assembly comprising:
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a multiple layer substrate, having a first layer and a second layer; a wireless power transmit coil disposed on or in the first layer and coupled via a conductive line or trace to a power source that provides power to the wireless power transmit coil to generate wireless power; an integrated circuit (IC) mounted on the second layer; and a wireless power receive coil disposed between the wireless power transmit coil and the IC and disposed to have the IC substantially residing atop the wireless power receive coil, in which the wireless power receive coil is coupled to the IC, wherein when the wireless power receive coil receives the wireless power from the wireless power transmit coil, the wireless power receive coil is operable to utilize the wireless power to supply circuit power to the IC and wherein the multiple layer substrate with the IC, wireless power transmit coil and the wireless power receive coil form a unitary component. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A circuit board assembly comprising:
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a multiple layer substrate having a first layer, a second layer and a third layer; a wireless power transmit coil disposed on or in the first layer and coupled via a conductive line or trace to a power source that provides power to the wireless power transmit coil to generate wireless power; a wireless power receive coil disposed on or in the second layer overlying the first layer; an integrated circuit (IC) disposed on the third layer and overlying the second layer, wherein the IC is substantially residing atop the wireless power receive coil; and conductive connections coupling the wireless power receive coil to the IC, wherein when the wireless power receive coil receives the wireless power from the wireless power transmit coil, the wireless power receive coil is operable to utilize the wireless power to supply circuit power to the IC and wherein the multiple layer substrate with the IC, wireless power transmit coil and the wireless power receive coil form a unitary component. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
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Specification