Fusible substrate

• US 8,525,633 B2
• Filed: 04/17/2009
• Issued: 09/03/2013
• Est. Priority Date: 04/21/2008
• Status: Active Grant

• Current Assignee: Littelfuse Incorporated, Purdue Research Foundation (Purdue University)
• Original Assignee: Littelfuse Incorporated
• Inventors: Whitney, Stephen J., Youngblood, Jeffrey P., Travis, William, Book, Sarah M., Barriball, Edward D., Kittle, Milea J.
• Primary Examiner(s): Vortman, Anatoly
• Application Number:
  US12/425,527
• Publication Number:
  US 20100066477A1
• Time in Patent Office: 1,600 Days
• Field of Search: 337/142, 337/290, 337/297, 337/382, 337/393
• US Class Current: 337/290
• CPC Class Codes: H01H 2085/0412 specially adapted for being mounted on a printed circuit board
• CPC Class Codes: H01H 85/0073 Expansion or rupture of the insulating support for the fusible element
• CPC Class Codes: H01H 85/0411 Miniature fuses

Abstract

A fuse element includes a substrate disposed between first and second terminals. The substrate includes an electrically insulative material. A conductive film is disposed on a first surface of the substrate and in electrical contact with the first terminal and second terminals.

Claims

1. A fuse element comprising:

a first terminal;

a second terminal;

a substrate disposed between the first and second terminals, the substrate having a rectangular cross-section with four outer surfaces extending between the first and second terminals, the substrate comprising an electrically insulative material having a first thermal expansion coefficient; and

a conductive film having a second thermal expansion coefficient and disposed on only one of the four outer surfaces of the substrate defining an interface therebetween, the conductive film in electrical contact with the first terminal and second terminals, wherein the other three outer surfaces of the substrate are not coated with said conductive film, and wherein a difference in the first and second thermal expansion coefficient causes the conductive film to expand at a different rate than the substrate and impart stress at the interface forcing the conductive film to fracture and break apart from the substrate at a critical temperature to increase an arcing voltage between the first and second terminals.

2. The fuse element of claim 1 wherein the substrate comprises a ceramic material.

3. The fuse element of claim 1 wherein the film comprises a metal selected from the group consisting of copper, gold and mixtures thereof.

4. The fuse element of claim 1, wherein the first thermal expansion coefficient is lower than the second thermal expansion coefficient.

5. The fuse element of claim 1 further comprising an intermediate layer disposed between the conductive film and the substrate.

6. The fuse element of claim 1 wherein the intermediate layer is a sol-gel material.

7. The fuse element of claim 1, wherein the intermediate layer undergoes a phase transformation when an operating parameter is exceeded.