Fan for cooling multiple processors housed in a sub-chassis

• US 8,526,177 B2
• Filed: 05/04/2010
• Issued: 09/03/2013
• Est. Priority Date: 05/04/2010
• Status: Active Grant

• Current Assignee: Hewlett Packard Enterprise Development LP (Hewlett-Packard Enterprise Company)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Paquin, David M., Nguyen, John D., Sabotta, Michael L., Wilson, Larry E.
• Primary Examiner(s): PAPE, ZACHARY
• Application Number:
  US12/773,629
• Publication Number:
  US 20110273841A1
• Time in Patent Office: 1,218 Days
• Field of Search: 361/679.46, 36167948-67951, 361/695, 361724-727, 165 802- 803, 454/184
• US Class Current: 361/679.49
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: H05K 7/20727 within server blades for removing heat from heat source

Abstract

A chassis comprises a printed circuit board (PCB) and a sub-chassis housing multiple processors that couple to the PCB. The sub-chassis is disposed above and parallel to the PCB. The multiple processors are cooled by a fan disposed on the sub-chassis.

Claims

1. A chassis, comprising:

a printed circuit board (PCB); and

a sub-chassis housing multiple processors that couple to the PCB, said sub-chassis is disposed above and parallel to said PCB;

wherein said multiple processors are cooled by a sub-chassis fan disposed on an extension that connects to an enclosure of said sub-chassis that houses said multiple processors, the enclosure comprising a pair of side members, front and back members, and a top member; and

wherein the extension is formed outside of the side members, the front and back members, and the top member of the enclosure, and wherein the extension has a first major surface which abuts the bottom of the sub-chassis fan, wherein the first major surface of the extension is in a plane that is substantially parallel to, and faces the top member of, the enclosure.

2. The chassis of claim 1, wherein the chassis comprises a 2U server chassis.

3. The chassis of claim 1, wherein said multiple processors are cooled by a chassis fan, at least part of said chassis fan is disposed below said sub-chassis.

4. The chassis of claim 3, wherein said chassis fan is disposed anterior to said sub-chassis and said sub-chassis fan is disposed anterior to said multiple processors.

5. The chassis of claim 1, wherein a riser card is disposed between said sub-chassis and the PCB.

6. A system chassis, comprising:

a chassis fan; and

a server node disposed posterior to said chassis fan and capable of being cooled by said chassis fan, the server node comprising;

a printed circuit board (PCB);

a sub-chassis, disposed above and parallel to said PCB, comprising an enclosure housing processors that couple to said PCB, the enclosure comprising a pair of side members, front and back members, and a top member; and

sub-chassis fans disposed on an extension that connects to the enclosure of said sub-chassis, anterior to said processors and above said PCB, said sub-chassis fans adapted to cool said processors;

wherein the extension is horizontally formed outside of the side members, the front and back members, and the to member of the enclosure;

wherein the sub-chassis fans propel air through an orifice and into said enclosure; and

wherein the chassis comprises a 2U server chassis.

7. The system chassis of claim 6, wherein the system chassis comprises multiple instances of said node.

8. The system chassis of claim 6, wherein said extension is parallel to at least one surface of the enclosure.

9. The system chassis of claim 6, wherein said sub-chassis fans are disposed superior to said chassis fan.

10. The system chassis of claim 6, wherein a height of at least one of said sub-chassis fans is within 1 centimeter of a height of said sub-chassis.

11. The system chassis of claim 6, wherein a riser card is disposed between said sub-chassis and said PCB.

12. An apparatus, comprising:

an enclosure that houses multiple processors, the enclosure comprising a pair of side members, front and back members, and a top member;

means for coupling a printed circuit board (PCB) to said processors;

a horizontal extension that protrudes outwardly away from said enclosure, wherein the extension is formed outside of the side members, the front and back members, and the to a member; and

means for cooling said multiple processors, the means for cooling mounted on said extension entirely outside of the enclosure and propagating airflow into said enclosure via an orifice;

wherein the enclosure is disposed superior to said PCB.

13. The apparatus of claim 12, wherein said means for cooling has a height that is within 1 centimeter of a height of said enclosure and wherein said means for cooling has a width that is within 1 centimeter of a width of said enclosure.

14. The apparatus of claim 12, wherein said extension is parallel to at least one surface of said enclosure.