Method of manufacturing a power module

• US 8,528,190 B2
• Filed: 08/21/2008
• Issued: 09/10/2013
• Est. Priority Date: 11/10/2004
• Status: Active Grant

• Current Assignee: Altera Corporation (Intel Corporation)
• Original Assignee: Enpirion, Inc. (MediaTek, Inc.)
• Inventors: Lotfi, Ashraf W., Wilkowski, Mathew, Weld, John D.
• Primary Examiner(s): Tugbang, A. Dexter
• Application Number:
  US12/196,062
• Publication Number:
  US 20080301929A1
• Time in Patent Office: 1,846 Days
• Field of Search: 296/021, 296/04, 296/06, 296/07, 298/41, 298/55, 298/56, 264/272.1, 264/272.11, 264/272.13, 264/272.19, 336/82, 336/83, 336/90, 336/92, 336/200
• US Class Current: 29/602.1
• CPC Class Codes: H01F 17/043 with two, usually identical or nearly identical parts enclosing completely the coil (pot cores)
• CPC Class Codes: H01F 27/027 specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
• CPC Class Codes: H01F 27/255 made from particles H01F27/26 takes precedence
• CPC Class Codes: H01F 27/36 Electric or magnetic shields or screens movable for varying inductance H01F21/10
• CPC Class Codes: H01F 27/363 made of electrically conductive material
• CPC Class Codes: H01F 41/005 Impregnating or encapsulating insulating of windings H01F41/12
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49069 Data storage inductor or core
• CPC Class Codes: Y10T 29/49073 by assembling coil and core
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49146 with encapsulating, e.g., potting, etc.
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49171 with encapsulating

Abstract

A method of manufacturing a power module on a substrate. In one embodiment, the method includes providing power conversion circuitry including providing a magnetic device having a magnetic core and at least one switch on the substrate. The method also includes placing a shielding structure with a baffle over the magnetic core to create a chamber thereabout. The method also includes depositing an encapsulant about the power conversion circuitry. The shielding structure limits the encapsulant entering the chamber and the baffle directs the encapsulant away from the magnetic core thereby limiting an amount of the encapsulant that contacts the magnetic core within the chamber.

Claims

1. A method of manufacturing a power module on a substrate, comprising:

providing power conversion circuitry, including;

providing a magnetic device having a magnetic core on said substrate,

placing a shielding structure with a baffle over said magnetic core to create a chamber thereabout, and

providing at least one switch on said substrate; and

depositing an encapsulant about said power conversion circuitry, said shielding structure limiting said encapsulant entering said chamber and said baffle directing said encapsulant away from said magnetic core thereby limiting an amount of said encapsulant that contacts said magnetic core within said chamber.

2. The method as recited in claim 1 further comprising allowing at least a portion of said encapsulant to exit said chamber via said shielding structure as said encapsulant cures.

3. The method as recited in claim 1 wherein said baffle is coupled to a sidewall of said shielding structure.

4. The method as recited in claim 1 wherein said shielding structure creates a partial seal about said magnetic core.

5. The method as recited in claim 1 wherein said shielding structure creates an opening between a junction of said shielding structure and said substrate.

6. The method as recited in claim 1 wherein said shielding structure is a protective cap.

7. The method as recited in claim 1 wherein said shielding structure is formed from a material selected from the group consisting of:

a ceramic material,

aluminum,

copper, and

molded plastic.

8. The method as recited in claim 1 further comprising locating a stand off on said substrate, said stand off being between said magnetic core and said substrate.

9. The method as recited in claim 1 further comprising providing electrical leads protruding from sidewalls of said substrate.

10. The method as recited in claim 1 further comprising placing at least one conductive winding about said magnetic core.

11. The method as recited in claim 1 further comprising placing at least one planar conductive winding about said magnetic core.

12. The method as recited in claim 11 further comprising providing electrical leads protruding from sidewalls of said substrate to accommodate through hole mounting or surface mounting of said magnetic device to another substrate.

13. The method as recited in claim 1 wherein said shielding structure is configured to limit an exposure of said magnetic core to said encapsulant.

14. The method as recited in claim 1 wherein said magnetic core is formed from ferrite.

15. The method as recited in claim 1 wherein said substrate is a printed wiring board.

16. The method as recited in claim 1 wherein said encapsulant is an epoxy molding compound.

17. The method as recited in claim 1 further comprising providing electrical leads protruding from opposing sidewalls of said substrate to allow said magnetic device to be mounted to another substrate.

18. The method as recited in claim 1 wherein said baffle is selected from the group consisting of:

a plate,

a wall, and

a screen.

19. The method as recited in claim 1 wherein said baffle is located on a side of said magnetic core and said shielding structure comprises another baffle located on another side of said magnetic core with respect to said baffle.

20. The method as recited in claim 1 wherein said baffle is coupled to said substrate.