Method for mounting electronic parts

• US 8,528,197 B2
• Filed: 09/14/2012
• Issued: 09/10/2013
• Est. Priority Date: 08/04/2009
• Status: Expired due to Fees

• Current Assignee: LG Display Co., Ltd.
• Original Assignee: LG Display Co., Ltd.
• Inventors: Park, Jun-Kyu, Shin, Sang-Mun, Park, Gweon-Young, Lee, Byung-Chul
• Primary Examiner(s): ANGWIN, DAVID PATRICK
• Application Number:
  US13/619,726
• Publication Number:
  US 20130008017A1
• Time in Patent Office: 361 Days
• Field of Search: 298/32, 298/31, 298/34
• US Class Current: 29/832
• CPC Class Codes: H05K 13/022 with orientation of the elements
• CPC Class Codes: H05K 13/028 Simultaneously loading a plurality of loose objects, e.g. by means of vibrations, pressure differences, magnetic fields
• CPC Class Codes: Y10T 29/49004 including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49133 with component orienting
• CPC Class Codes: Y10T 29/53174 Means to fasten electrical component to wiring board, base, or substrate
• CPC Class Codes: Y10T 29/53178 Chip component

Abstract

An electronic part mounting method including introducing electronic parts in a bulk form into a bulk feeder, transferring the introduced electronic parts to at least one inspection unit by use of a rotatably installed positioning wheel, inspecting and aligning the electronic parts, transferring the inspected and aligned electronic parts to a part insertion unit by use of the positioning wheel, inserting the electronic parts, determined as good ones by the inspection unit, into the part insertion unit, and picking up the electronic parts received in the part insertion unit to mount the electronic parts on a board.

Claims

1. An electronic part mounting method comprising:

introducing electronic parts in a bulk carrier into a bulk feeder, wherein the bulk feeder includes a bowl shaped first feeder and a straight second feeder;

transferring the introduced electronic parts to at least one inspection unit by use of a rotatably installed positioning wheel;

inspecting and aligning the electronic parts;

transferring an inspected and aligned electronic part to a part insertion unit by use of the positioning wheel;

inserting the electronic part, determined as a good one by the inspection unit, into an inserting space of the part insertion unit after completing the transferring step; and

picking up the electronic part received in the part insertion unit to mount the electronic parts on a board after completing the inserting step.

2. The electronic part mounting method according to claim 1, wherein the introduction of the electronic parts in a bulk carrier into the bulk feeder includes:

feeding the electronic part, classified according to a predetermined standard, into the bowl shaped first feeder; and

feeding the electronic part fed into the first feeder to the straight second feeder located between an outermost end of the first feeder and the positioning wheel.

3. The electronic part mounting method according to claim 2, further comprising providing the electronic part with air in order to align the electronic part fed into the bowl shaped first feeder based on orientation of front and rear surfaces thereof.

4. The electronic part mounting method according to claim 1, wherein the inspection and alignment of the electronic parts include:

determining whether the electronic part fed from the bulk feeder are defective or good;

discharging the electronic part determined as a defective one; and

rotating or inverting each electronic part to align polarity of the electronic part.

5. The electronic part mounting method according to claim 4, wherein the inspection and alignment of the electronic parts include determining whether to rotate or invert the electronic part according to whether the electronic part responds to a voltage applied thereto or not, or according to information acquired by comparing image information of the electronic part with image information stored in a database.