Wireless communication device and metal article
First Claim
1. A wireless communication device comprising:
- a wireless IC device configured to process a high-frequency signal;
a first conductor coupled to the wireless IC device;
a second conductor connected to the first conductor; and
a metal plate including first and second main surfaces arranged such that the second conductor is coupled to the first main surface and a portion that defines a radiation element;
whereinthe metal plate includes a current path portion arranged to conduct a high-frequency signal current on a first main surface side to a second main surface side of the metal plate when a high-frequency signal is supplied from the wireless IC device through the first conductor and the second conductor; and
a conductive member electrically conducting the first main surface and the second main surface of the metal plate to each other is provided in the metal plate; and
the current path portion is located in a surface boundary portion between the conductive member and the metal plate.
1 Assignment
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Accused Products
Abstract
A wireless communication device includes a wireless IC device, a dielectric substrate, and a metal plate. A radiation conductor coupled to the wireless IC device is provided on the front surface of the dielectric substrate, and a ground conductor connected to the radiation conductor through an interlayer connection conductor is provided on a back surface. The dielectric substrate is fixed to the metal plate via an insulating adhesive, and is crimped by a conductive member. The front and back surfaces of the metal plate are electrically connected to each other by the conductive member, and when a high-frequency signal is supplied from the wireless IC device, a high-frequency signal current on the front surface side of the metal plate is conducted to the back surface side of the metal plate through a surface boundary portion between the conductive member and the metal plate, and radiated as a high-frequency signal.
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Citations
8 Claims
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1. A wireless communication device comprising:
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a wireless IC device configured to process a high-frequency signal; a first conductor coupled to the wireless IC device; a second conductor connected to the first conductor; and a metal plate including first and second main surfaces arranged such that the second conductor is coupled to the first main surface and a portion that defines a radiation element;
whereinthe metal plate includes a current path portion arranged to conduct a high-frequency signal current on a first main surface side to a second main surface side of the metal plate when a high-frequency signal is supplied from the wireless IC device through the first conductor and the second conductor; and a conductive member electrically conducting the first main surface and the second main surface of the metal plate to each other is provided in the metal plate; and the current path portion is located in a surface boundary portion between the conductive member and the metal plate. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A metal article comprising:
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a wireless communication device; and a metal plate;
whereinthe wireless communication device includes; a wireless IC device configured to process a high-frequency signal; a first conductor coupled to the wireless IC device, and a second conductor connected to the first conductor;
whereinthe metal plate includes a current path portion arranged to conduct a high-frequency signal current on a first main surface side to a second main surface side of the metal plate when a high-frequency signal is supplied from the wireless IC device through the first conductor and the second conductor; and a conductive member electrically conducting the first main surface and the second main surface of the metal plate to each other is provided in the metal plate; and the current path portion is located in a surface boundary portion between the conductive member and the metal plate.
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Specification