In situ plating and etching of materials covered with a surface film

• US 8,529,738 B2
• Filed: 06/22/2007
• Issued: 09/10/2013
• Est. Priority Date: 02/08/2005
• Status: Expired due to Fees

• Current Assignee: Trustees Of Columbia University In The City Of New York (Columbia University)
• Original Assignee: Trustees Of Columbia University In The City Of New York (Columbia University)
• Inventors: Von Gutfeld, Robert J., West, Alan C.
• Primary Examiner(s): Smith, Nicholas A
• Application Number:
  US11/767,461
• Publication Number:
  US 20080142367A1
• Time in Patent Office: 2,272 Days
• Field of Search: 204/242, 204/275.1, 205/205, 205/660
• US Class Current: 204/275.1
• CPC Class Codes: C25D 17/00 Constructional parts, or assemblies thereof, of cells for electrolytic coating
• CPC Class Codes: C25D 17/02 Tanks; Installations therefor
• CPC Class Codes: C25D 5/022 using masking means
• CPC Class Codes: C25D 5/08 Electroplating with moving electrolyte e.g. jet electroplating using locally applied jets of electrolyte C25D5/026
• CPC Class Codes: C25D 5/18 Electroplating using modulated, pulsed or reversing current
• CPC Class Codes: C25D 5/22 Electroplating combined with mechanical treatment during the deposition

Abstract

Systems and methods for plating and/or etching of hard-to-plate metals are provided. The systems and methods are designed to overcome the deleterious effect of superficial coating or oxide layers that interfere with the plating or etching of certain metal substrates. The systems and methods involve in situ removal of coating materials from the surfaces of the metal substrates while the substrates are either submerged in plating or etching solutions, or are positioned in a proximate enclosure just prior to submersion in the plating or etching solutions. Further, the substrates can be in contact with a suitable patterning mask to obtain patterned oxide-free regions for plating or etching. This in situ removal of coating layers may be achieved by pulse heating or photoablation of the substrate and the inhibiting coating layers. Electrical energy or laser light energy may be used for this purpose. Additionally or alternatively, the coating materials may be removed by mechanical means.

Claims

1. A system for metal-plating and etching a substrate by action of a chemical solution in a tank containing the chemical solution, the substrate covered by an interfering surface metal oxide layer, the system comprising:

a substrate-holding fixture disposed relative to the tank so that the portions of the substrate are submerged in the contained chemical solution;

a laser pulse source adapted to emit a plurality of laser pulses, each having a duration between 1 picosecond and 10 milliseconds and spaced apart by at least approximately 1 millisecond, and adapted to remove the interfering surface metal oxide layer and expose uncoated substrate surfaces to the action of the contained chemical solution,

whereby metal-plating and etching can occur directly on the substrate without interference by the interfering surface metal oxide layer,

wherein the substrate-holding fixture is further configured as an electrode and a counter-electrode is disposed in the tank forming an electrolytic cell, whereby the chemical solution contained in the tank can act to electroplate or electroetch exposed clean substrate surfaces, and

wherein the electrolytic cell and the laser pulse source are configured for one of sequential operation and concurrent operation, and wherein the substrate-holding fixture is further configured to move the substrate with respect to the laser pulse source, thereby exposing a pattern of uncoated substrate surfaces on the substrate.

2. A system for metal-plating and etching a substrate by action of a chemical solution in a tank containing the chemical solution, the substrate covered by an interfering surface metal oxide layer, the system comprising:

a substrate-holding fixture disposed relative to the tank so that the portions of the substrate are submerged in the contained chemical solution;

a laser pulse source adapted to emit a plurality of laser pulses, each having a duration between 1 picosecond and 10 milliseconds and spaced apart by at least approximately 1 millisecond, and adapted to remove the interfering surface metal oxide layer and expose uncoated substrate surfaces to the action of the contained chemical solution,

whereby metal-plating and etching can occur directly on the substrate without interference by the interfering surface metal oxide layer,

wherein the substrate-holding fixture is further configured as an electrode and a counter-electrode is disposed in the tank forming an electrolytic cell, whereby the chemical solution contained in the tank can act to electroplate or electroetch exposed clean substrate surfaces, and

wherein the chemical solution contained in the tank acts to electroplate exposed clean substrate surfaces thereby forming plated substrate surfaces, the system further comprising;

a second tank containing a second chemical solution;

a substrate transferor configured to move the substrate from the first fluid holding tank to the second fluid holding tank, the transferor disposed relative to the tanks so that the plated substrate surfaces are exposed to the action of the second contained chemical solution in the second fluid holding tank,

whereby metal-plating can occur directly on the plated substrate surfaces without interference by the interfering surface metal oxide layer.