Method for attaching a first carrier device to a second carrier device and micromechanical components

• US 8,530,260 B2
• Filed: 04/12/2010
• Issued: 09/10/2013
• Est. Priority Date: 04/14/2009
• Status: Active Grant

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Gonska, Julian, Grosse, Axel, Weber, Heribert, Hausner, Ralf
• Primary Examiner(s): Tran, Minh-Loan T
• Assistant Examiner(s): Erdem, Fazli
• Application Number:
  US12/798,868
• Publication Number:
  US 20100258884A1
• Time in Patent Office: 1,247 Days
• Field of Search: None
• US Class Current: 438/51
• CPC Class Codes: B81C 2203/019 characterised by the material or arrangement of seals between parts
• CPC Class Codes: B81C 3/001 Bonding of two components

Abstract

A method for attaching a first carrier device to a second carrier device includes forming at least one first bond layer and/or solder layer on a first exterior of the first carrier device, a partial surface being framed by the at least one first bond layer and/or solder layer, and placing the first carrier device on the second carrier device and fixedly bonding or soldering the first carrier device to the second carrier device. The at least one first bond layer and/or solder layer includes a first cover area which is larger than a first contact area.

Claims

1. A method for attaching a first carrier device to a second carrier device, comprising:

forming a recess in a first exterior of a first carrier device;

filling the recess with at least one of a first bond layer and a first solder layer so that a contacting side of that at least one of the first bond layer and the first solder layer facing away from the first carrier device has an indentation, wherein the at least one of the first bond layer and the first solder layer includes a first cover area at least partially covering the first exterior of the first carrier device, and wherein a partial surface of the first exterior of the first carrier device is framed by the at least one of the first bond layer and the first solder layer;

placing the first carrier device having the at least one of the first bond layer and the first solder layer on the second carrier device in such a way that a first contact area of the at least one of the first bond layer and the first solder layer contacts a second contact area of the second carrier device; and

one of fixedly bonding or fixedly soldering the first carrier device to the second carrier device;

wherein the at least one of the first bond layer and the first solder layer is formed in such a way that the first cover area is shaped larger than the first contact area.

2. The method as recited in claim 1, wherein the second contact area is formed by forming at least one of a second bond layer and a second solder layer on a second exterior of the second carrier device, and wherein the at least one of the second bond layer and the second solder layer includes a second cover area at least partially covering the second exterior of the second carrier device, and wherein the at least one of the second bond layer and the second solder layer is formed in such a way that the second contact area is shaped to be smaller than the second cover layer.

3. The method as recited in claim 2, wherein:

before forming the at least one of the first bond layer and the first solder layer, at least one surface unevenness is formed on the first exterior; and

the at least one surface unevenness is covered by the at least one of the first bond layer and the first solder layer.

4. The method as recited in claim 3, wherein the at least one of the first bond layer and the first solder layer is formed using a varying layer thickness.

5. The method as recited in claim 4, wherein at least one gas escape trench is formed on the at least one of the first bond layer and the first solder layer, and wherein the at least one gas escape trench faces away from the partial surface of the first exterior of the first carrier device.

6. The method as recited in claim 2, wherein before placing the first carrier device on the second carrier device, at least one of bond-temperature-resistant flow-protection surface unevenness and solder-temperature-resistant flow-protection surface unevenness is formed on at least one of the first exterior and the second exterior, and wherein the at least one of the bond-temperature-resistant flow-protection surface unevenness and the solder-temperature-resistant flow-protection surface unevenness frames the partial surface of the first exterior of the first carrier device after the first carrier device is placed on the second carrier device.

9. The method as recited in claim 1, further comprising positioning the recess when forming the recess so the indentation is at least partially situated beneath a contacting side of at least one of a second bond layer and a second solder layer affixed to the second carrier device after one of fixedly bonding or fixedly solder the first carrier device to the second carrier device.

7. A method for attaching a first carrier device to a second carrier device, comprising:

forming a recess in a first exterior of a first carrier device;

filling the recess with at least one of a first bond layer and a first solder layer so that a contacting side of that at least one of the first bond layer and the first solder layer facing away from the first carrier device has an indentation, wherein a partial surface of the first exterior of the first carrier device is framed by the at least one of the first bond layer and the first solder layer;

placing the first carrier device having the at least one of the first bond layer and the first solder layer on the second carrier device in such a way that a first contact area of the at least one of the first bond layer and the first solder layer contacts a second contact area of the second carrier device; and

one of fixedly bonding or fixedly soldering the first carrier device to the second carrier device;

wherein before placing the first carrier device on the second carrier device, at least one of bond-temperature-resistant flow-protection surface unevenness and solder-temperature-resistant flow-protection surface unevenness is formed on at least one of the first exterior and the second exterior, and wherein the at least one of the bond-temperature-resistant flow-protection surface unevenness and the solder-temperature-resistant flow-protection surface unevenness frames the partial surface of the first exterior of the first carrier device after the first carrier device is placed on the second carrier device.

8. The method as recited in claim 7, wherein the at least one flow-protection surface unevenness includes at least one of an exterior flow-protection wall, an interior flow-protection wall, an exterior flow-protection trench and an interior flow-protection trench.