Method of forming a bi-directional transistor with by-pass path
First Claim
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1. A method of forming a bi-directional transistor comprising:
- forming a first MOS transistor on a semiconductor substrate of a first conductivity type wherein the first MOS transistor is a vertical transistor formed on the semiconductor substrate;
forming a body region of the first MOS transistor on a surface of the semiconductor substrate and isolated from a first current carrying electrode region of the first MOS transistor by a first P-N junction and isolated from a second current carrying electrode region of the first MOS transistor by a second P-N junction;
forming a second MOS transistor coupled to selectively couple the body region of the first MOS transistor to the first current carrying electrode of the first MOS transistor wherein the second MOS transistor is a vertical MOS transistor formed on the semiconductor substrate; and
forming a third MOS transistor on a surface of the semiconductor substrate and coupled to form a current flow path in parallel with the first MOS transistor.
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Abstract
In one embodiment, a transistor is formed to have a first current flow path to selectively conduct current in both directions through the transistor and to have a second current flow path to selectively conduct current in one direction.
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Citations
3 Claims
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1. A method of forming a bi-directional transistor comprising:
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forming a first MOS transistor on a semiconductor substrate of a first conductivity type wherein the first MOS transistor is a vertical transistor formed on the semiconductor substrate; forming a body region of the first MOS transistor on a surface of the semiconductor substrate and isolated from a first current carrying electrode region of the first MOS transistor by a first P-N junction and isolated from a second current carrying electrode region of the first MOS transistor by a second P-N junction; forming a second MOS transistor coupled to selectively couple the body region of the first MOS transistor to the first current carrying electrode of the first MOS transistor wherein the second MOS transistor is a vertical MOS transistor formed on the semiconductor substrate; and forming a third MOS transistor on a surface of the semiconductor substrate and coupled to form a current flow path in parallel with the first MOS transistor. - View Dependent Claims (2, 3)
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Specification