Packaging structure for plural bare chips

• US 8,530,920 B2
• Filed: 04/13/2011
• Issued: 09/10/2013
• Est. Priority Date: 03/02/2011
• Status: Expired due to Fees

• Current Assignee: Sunonwealth Electric Machine, Ind. Co., Ltd.
• Original Assignee: Sunonwealth Electric Machine, Ind. Co., Ltd.
• Inventors: Tsai, Chong-Han
• Primary Examiner(s): Richards, N Drew
• Assistant Examiner(s): SINGAL, ANKUSH K
• Application Number:
  US13/085,572
• Publication Number:
  US 20120224366A1
• Time in Patent Office: 881 Days
• Field of Search: 257 98-100, 257/E33.061, 257/E33.066, 257/E21.506
• US Class Current: 257/98
• CPC Class Codes: G02B 6/0038 Linear indentations or grooves, e.g. arc-shaped grooves or meandering grooves, extending over the full length or width of the light guide
• CPC Class Codes: G02B 6/0068 Arrangements of plural sources, e.g. multi-colour light sources
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

A packaging structure for plural bare chips includes a substrate, a plurality of bare light-emitting chips, and a transparent light guide. The substrate has a supporting surface. The bare light-emitting chips are disposed on the supporting surface of the substrate. The transparent light guide covers and seals up the bare light-emitting chips, with a side of the transparent light guide facing away from the supporting surface forming a light-outputting layer with a light gathering member. Alternatively, a reflective layer can be arranged on the supporting surface and covered by the transparent light guide. Accordingly, a packaging structure for plural bare chips with high illuminous efficiency, high heat-dissipating efficiency, and low cost of manufacture is provided.

Claims

1. A packaging structure for plural bare chips, comprising:

a substrate having a supporting surface;

a reflective layer arranged on the supporting surface and having a plurality of through holes;

a plurality of bare light-emitting chips arranged on the reflective layer and corresponding to the through holes; and

a transparent light guide covering the bare light-emitting chips and the reflective layer, with the transparent light guide having a light-outputting layer on a side of the transparent light guide facing away from the supporting surface, with the light-outputting layer parallel to the supporting surface and having a light gathering member, with the light gathering member being in a form of plural ridges, wherein an included angle of a tip of each ridge is in a range between a first angle and a second angle, with the first angle being twice a sum of a critical angle and 20 degrees, and with the second angle being twice a difference of the critical angle and 20 degrees, wherein the critical angle is in the transparent light guide for a boundary between the transparent light guide and air.

2. The packaging structure for plural bare chips as claimed in claim 1, wherein the included angle is 90 degrees while the refractive index of the transparent light guide is 1.42.

3. The packaging structure for plural bare chips as claimed in claim 1, wherein the included angle is 78 degrees while the refractive index of the transparent light guide is 1.5.

4. The packaging structure for plural bare chips as claimed in claim 1 wherein each ridge has a cross section of an isosceles triangle having a base parallel to the supporting surface.

5. The packaging structure for plural bare chips as claimed in claim 4, wherein the plural ridges are concentric and annular.

6. The packaging structure for plural bare chips as claimed in claim 4, wherein the transparent light guide covers the reflective layer totally and couples with the supporting surface of the substrate.

7. The packaging structure for plural bare chips as claimed in claim 4, wherein the transparent light guide covers the reflective layer partially, with the reflective layer extending and protruding out of the transparent light guide along the supporting surface.

8. The packaging structure for plural bare chips as claimed in claim 4, wherein a maximum height of the plural ridges of the transparent light guide is equal to or smaller than 20 times of a height of any one of the bare light-emitting chips.

9. A packaging structure for plural bare chips, comprising:

a substrate having a supporting surface;

a plurality of bare light-emitting chips supported by the supporting surface; and

a transparent light guide covering the bare light-emitting chips, with the transparent light guide having a light-outputting layer on a side of the transparent light guide facing away from the supporting surface, and with the light-outputting layer parallel to the supporting surface and having a light gathering member, wherein the light gathering member is in a form of plural ridges, and an included angle of a tip of each ridge is in a range between a first angle and a second angle, with the first angle being twice a sum of a critical angle and 20 degrees, with the second angle being twice a difference of the critical angle and 20 degrees, wherein the critical angle is in the transparent light guide for a boundary between the transparent light guide and air.

10. The packaging structure for plural bare chips as claimed in claim 9, wherein the included angle of the tip of each ridge is twice the critical angle.

11. The packaging structure for plural bare chips as claimed in claim 9, wherein the included angle is 90 degrees while the refractive index of the transparent light guide is 1.42.

12. The packaging structure for plural bare chips as claimed in claim 9, wherein the included angle is 78 degrees while the refractive index of the transparent light guide is 1.5.

13. The packaging structure for plural bare chips as claimed in claim 9, wherein each ridge has a cross section of an isosceles triangle having a base parallel to the supporting surface.

14. The packaging structure for plural bare chips as claimed in claim 9, wherein a reflective layer arranged on the supporting surface is adjacent to the bare light-emitting chips;

and wherein the transparent light guide covers the reflective layer.

15. The packaging structure for plural bare chips as claimed in claim 14, wherein the transparent light guide covers the reflective layer totally and couples with the supporting surface of the substrate.

16. The packaging structure for plural bare chips as claimed in claim 14, wherein the transparent light guide covers the reflective layer partially, with the reflective layer extending and protruding out of the transparent light guide along the supporting surface.

17. The packaging structure for plural bare chips as claimed in claim 14, wherein a maximum height of the plural ridges of the transparent light guide is equal to or smaller than 20 times of a height of any one of the bare light-emitting chips.

18. The packaging structure for plural bare chips as claimed in claim 13, wherein a maximum height of the plural ridges of the transparent light guide is equal to or smaller than 20 times of a height of any one of the bare light-emitting chips.

19. The packaging structure for plural bare chips as claimed in claim 13, wherein the plural ridges are concentric and annular.