Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace
First Claim
1. A semiconductor chip assembly, comprising:
- a semiconductor device;
an adhesive that includes an opening;
a heat spreader that includes a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction, covers the post in the downward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions;
a substrate that includes a first conductive segment, a second conductive segment and a dielectric layer, wherein the first conductive segment is attached to and extends above the dielectric layer, the second conductive segment is attached to and extends below the dielectric layer, the dielectric layer contacts and is sandwiched between the conductive segments and an aperture extends through the substrate; and
a conductive trace that includes a pad, a terminal, a conductive pattern, a first via and a second via, wherein the conductive pattern is a part of the substrate and includes the first and/or second conductive segment, the first via extends through the adhesive and extends to the conductive pattern, the second via extends through the adhesive and extends to the conductive pattern and an electrically conductive path between the pad and the terminal includes the conductive pattern and the vias, an electrically conductive path between the pad and the conductive pattern includes the first via and an electrically conductive path between the terminal and the conductive pattern includes the second via;
wherein the semiconductor device overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the post and thereby thermally connected to the base;
wherein the adhesive is mounted on and extends above the base, extends above and below the substrate, extends laterally from the post to or beyond the terminal and is sandwiched between the post and the substrate, between the base and the substrate, between the pad and the substrate and between the terminal and the substrate;
wherein the substrate is mounted on the adhesive and extends above the base;
wherein the post extends into the opening, extends through the aperture and extends above and below the substrate; and
wherein the base extends below the semiconductor device and the substrate.
1 Assignment
0 Petitions
Accused Products
Abstract
A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace, a substrate and an adhesive. The heat spreader includes a post and a base. The conductive trace includes a pad, a terminal, a conductive pattern and first and second vias. The substrate includes the conductive pattern and a dielectric layer. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The post extends upwardly from the base into an opening in the adhesive and an aperture in the substrate, and the base extends laterally from the post. The conductive trace provides signal routing between the pad and the terminal using the conductive pattern and the vias.
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Citations
35 Claims
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1. A semiconductor chip assembly, comprising:
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a semiconductor device; an adhesive that includes an opening; a heat spreader that includes a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction, covers the post in the downward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; a substrate that includes a first conductive segment, a second conductive segment and a dielectric layer, wherein the first conductive segment is attached to and extends above the dielectric layer, the second conductive segment is attached to and extends below the dielectric layer, the dielectric layer contacts and is sandwiched between the conductive segments and an aperture extends through the substrate; and a conductive trace that includes a pad, a terminal, a conductive pattern, a first via and a second via, wherein the conductive pattern is a part of the substrate and includes the first and/or second conductive segment, the first via extends through the adhesive and extends to the conductive pattern, the second via extends through the adhesive and extends to the conductive pattern and an electrically conductive path between the pad and the terminal includes the conductive pattern and the vias, an electrically conductive path between the pad and the conductive pattern includes the first via and an electrically conductive path between the terminal and the conductive pattern includes the second via; wherein the semiconductor device overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the post and thereby thermally connected to the base; wherein the adhesive is mounted on and extends above the base, extends above and below the substrate, extends laterally from the post to or beyond the terminal and is sandwiched between the post and the substrate, between the base and the substrate, between the pad and the substrate and between the terminal and the substrate; wherein the substrate is mounted on the adhesive and extends above the base; wherein the post extends into the opening, extends through the aperture and extends above and below the substrate; and wherein the base extends below the semiconductor device and the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A semiconductor chip assembly, comprising:
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a semiconductor device; an adhesive that includes an opening; a heat spreader that includes a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction, covers the post in the downward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; a substrate that includes a first conductive segment, a second conductive segment and a dielectric layer, wherein the first conductive segment is attached to and extends above the dielectric layer, the second conductive segment is attached to and extends below the dielectric layer, the dielectric layer contacts and is sandwiched between the conductive segments and an aperture extends through the substrate; and a conductive trace that includes a pad, a terminal, a conductive pattern, a first via and a second via, wherein the pad is located above the substrate, the terminal is located below the substrate, the conductive pattern is a part of the substrate and includes the first and/or second conductive segment, the first via is located above the conductive pattern and extends through the adhesive and extends to the conductive pattern, the second via is located below the conductive pattern and extends through the adhesive and extends to the conductive pattern and an electrically conductive path between the pad and the terminal includes the conductive pattern and the vias, an electrically conductive path between the pad and the conductive pattern includes the first via and an electrically conductive path between the terminal and the conductive pattern includes the second via; wherein the semiconductor device overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the post and thereby thermally connected to the base; wherein the adhesive is mounted on and extends above the base, extends above and below the substrate, extends laterally from the post to or beyond the terminal and is sandwiched between the post and the substrate, between the base and the substrate, between the pad and the substrate and between the terminal and the substrate; wherein the substrate is mounted on the adhesive and extends above the base; wherein the post extends into the opening, extends through the aperture and extends above and below the substrate; and wherein the base extends below the semiconductor device and the substrate. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30)
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31. A semiconductor chip assembly, comprising:
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a semiconductor device; an adhesive that includes an opening; a heat spreader that includes a post, a base and a cap, wherein the post is adjacent to and integral with the base, extends above the base in an upward direction and thermally connects the base and the cap, the base extends below the post in a downward direction opposite the upward direction, covers the post in the downward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions, and the cap extends above and is adjacent to and covers in the upward direction and extends laterally from a top of the post; a substrate that includes a first conductive segment, a second conductive segment and a dielectric layer, wherein the first conductive segment is attached to and extends above the dielectric layer, the second conductive segment is attached to and extends below the dielectric layer, the dielectric layer contacts and is sandwiched between the conductive segments and an aperture extends through the substrate; and a conductive trace that includes a pad, a terminal, a conductive pattern, a first via and a second via, wherein the pad is located above the substrate and extends above the adhesive, the terminal is located below the substrate and extends below the adhesive, the conductive pattern is a part of the substrate and includes the first and/or second conductive segment, the first via is located above the conductive pattern and extends through the adhesive and extends to the conductive pattern, the second via is located below the conductive pattern and extends through the adhesive and extends to the conductive pattern and an electrically conductive path between the pad and the terminal includes the conductive pattern and the vias, an electrically conductive path between the pad and the conductive pattern includes the first via and an electrically conductive path between the terminal and the conductive pattern includes the second via; wherein the semiconductor device is mounted on the cap, overlaps the post, the base and the cap, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the cap and thereby thermally connected to the base; wherein the adhesive is mounted on and extends above the base, extends above and below the substrate, contacts and is sandwiched between the post and the substrate, between the base and the substrate, between the pad and the substrate and between the terminal and the substrate, contacts the conductive pattern, the vias and the dielectric layer, extends laterally from the post to or beyond the terminal and extends to peripheral edges of the assembly; wherein the substrate is mounted on the adhesive and extends above the base; wherein the post extends into the opening, extends through the aperture and extends above and below the substrate; wherein the base extends below the semiconductor device and the substrate; wherein the cap contacts and overlaps the adhesive; wherein the pad and the cap have the same thickness where closest to one another, have different thickness where the cap is adjacent to the post and are coplanar with one another at a surface that faces in the upward direction; and wherein the base and the terminal have the same thickness and are coplanar with one another at a surface that faces in the downward direction. - View Dependent Claims (32, 33, 34, 35)
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Specification