System and method for providing a low and narrow-profile radio frequency identification (RFID) tag

• US 8,531,335 B2
• Filed: 04/14/2011
• Issued: 09/10/2013
• Est. Priority Date: 07/05/2006
• Status: Active Grant

• Current Assignee: Technologies ROI LLC
• Original Assignee: Technologies ROI LLC
• Inventors: King, Patrick F.
• Primary Examiner(s): PHAN, THO GIA
• Application Number:
  US13/086,760
• Publication Number:
  US 20110210176A1
• Time in Patent Office: 880 Days
• Field of Search: 343/700, 343/702, 343/873, 343/895, 340/572.1, 340/572.7
• US Class Current: 343/700.MS
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07771 the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 1/52 Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure absorbing means H01Q17/00
• CPC Class Codes: H01Q 9/16 with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole H01Q9/44 takes precedence
• CPC Class Codes: H01Q 9/30 with feed to end of elongated active element, e.g. unipole H01Q9/44 takes precedence
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49018 with other electrical component

Abstract

Methods and systems for wireless devices are disclosed. According to one system, a radio frequency identification (RFID) tag includes an RFID circuit packaged within a chip carrier package. The chip carrier package bonds out a first antenna connection for the RFID circuit. An antenna including a conductive lead is interfaced with the first antenna connection. The chip carrier package and the first conductive lead are coupled to a first side of a first spacer. A second spacer having a second dielectric constant greater than the first dielectric constant is coupled to a second side of the first spacer. The second spacer isolates the RFID circuit from a metal surface.

Claims

1. A wireless communication device, comprising:

a radio frequency identification (RFID) tag, comprising;

an RFID circuit packaged within a chip carrier package, wherein the chip carrier package bonds out at least a first antenna connection for the RFID circuit and defining a chip cavity area that occupies a major fraction of package area;

an antenna including at least a first conductive lead interfaced with the at least the first antenna connection;

a first spacer having a first dielectric constant, wherein the chip carrier package and the at least the first conductive lead are coupled to a first side of the first spacer; and

a second spacer having a second dielectric constant greater than the first dielectric constant and coupled to a second side of the first spacer, wherein the second spacer is adapted to isolate the RFID circuit from a metal surface.

2. The wireless communication device of claim 1 wherein the antenna further comprises an antenna selected from a group consisting of a monopole antenna and a dipole antenna.

3. The wireless communication device of claim 1 wherein the antenna further comprises an antenna selected from a group consisting of a braided wire antenna, a single wire spring antenna, and a single wire antenna.

4. The wireless communication device of claim 1 further comprising a circuit board upon which the chip carrier package is mounted and wherein the at least the first conductive lead is interfaced with the at least the first antenna connection via at least a first circuit connection on the circuit board.

5. The wireless communication device of claim 4 wherein the chip carrier package is coupled to the first side of the first spacer via the circuit board.

6. The wireless communication device of claim 1 wherein the at least the first conductive lead of the antenna further comprises a solid wire.

7. The wireless communication device of claim 1 wherein the at least the first conductive lead of the antenna further comprises braided wires.

8. The wireless communication device of claim 1 wherein the at least the first conductive lead of the antenna further comprises a spring-shaped wire.

9. The wireless communication device of claim 1 wherein the at least the first conductive lead includes a first and second end and, in being interfaced with the at least the first antenna connection, the at least the first conductive lead is interfaced at the respective first end.

10. The wireless communication device of claim 9 wherein the second end of the at least the first conductive lead further comprises a metal tab, wherein the metal tab is adapted to be cut to allow frequency tuning of the RFID circuit.

11. The wireless communication device of claim 1 further comprising at least one wire coupled to the RFID tag and adapted to cause the RFID tag to remain formed in a shape to which the at least one wire is bent.

12. The wireless communication device of claim 11 wherein the at least one wire is coupled to the RFID tag on a second side of the second spacer.

13. The wireless communication device of claim 11 further comprising an environmental encapsulate adapted to enclose at least a portion of the at least one wire.

14. The wireless communication device of claim 1 further comprising an environmental encapsulate enclosing at least a portion of the RFID tag and adapted to protect the RFID tag from at least one of a contaminant, water, temperature, and impact.

15. The wireless communication device of claim 14 wherein the environmental encapsulate further comprises at least one of shrink wrap and a pre-mold case.

16. The wireless communication device of claim 14 wherein the environmental encapsulate further comprises a slotted mechanical impact barrier.

17. The wireless communication device of claim 16 wherein the slotted mechanical impact barrier is further adapted to allow radio frequency energy to pass through RF slots in the slotted mechanical impact barrier, and the RF slots are approximately perpendicular to a length of the slotted mechanical impact barrier.

18. The wireless communication device of claim 17 wherein the RF slots in the slotted mechanical impact barrier are filled with at least one of silicone and epoxy.

19. The wireless communication device of claim 16 wherein the slotted mechanical impact barrier further comprises at least one strap slot adapted to receive a strap useable for strapping the slotted mechanical impact barrier to an object to be identified, wherein the at least one strap slot is approximately parallel to a length of the slotted mechanical impact barrier.

20. The wireless communication device of claim 19 wherein the environmental encapsulate further comprises at least one encapsulate slot adapted to receive the strap, and the at least one encapsulate slot is approximately parallel to a length of the RFID tag.

21. The wireless communication device of claim 14 wherein the environmental encapsulate further comprises vulcanized rubber.

22. The wireless communication device of claim 21 wherein the environmental encapsulate further comprises an o-ring integrated into the vulcanized rubber.

23. The wireless communication device of claim 21 wherein the environmental encapsulate further comprises reinforced pre-hardened rubber strips.

24. The wireless communication device of claim 14 wherein the environmental encapsulate further comprises a rubber encapsulate, wherein the RFID tag and the rubber encapsulate are formed and secured to form a ring.

25. The wireless communication device of claim 24 wherein the RFID tag and the rubber encapsulate are secured via at least one of tape and shrink wrap.

26. The wireless communication device of claim 14 wherein the environmental encapsulate further comprises a rolled flexible cylindrical material suitable for mounting the RFID tag on a cylindrical surface.

27. The wireless communication device of claim 26 wherein the RFID tag is mounted on an inside surface of the rolled flexible cylindrical material.

28. A method of manufacture for a wireless communication device, comprising the steps of:

manufacturing a radio frequency identification (RFID) tag, wherein the RFID tag is manufactured by;

placing an RFID circuit within a chip carrier package, wherein the chip carrier package bonds out at least a first antenna connection for the RFID circuit and defines a chip cavity area occupying a major fraction of package area;

attaching an antenna to the RFID circuit, wherein the antenna includes at least a first conductive lead interfaced with the at least the first antenna connection;

coupling a first side of a first spacer having a first dielectric constant to the chip carrier package and the at least the first conductive lead; and

coupling a second spacer having a second dielectric constant greater than the first dielectric constant to a second side of the first spacer, wherein the second spacer is adapted to isolate the RFID circuit from a metal surface.