Wireless IC device

• US 8,531,346 B2
• Filed: 07/28/2009
• Issued: 09/10/2013
• Est. Priority Date: 04/26/2007
• Status: Expired due to Fees

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Kato, Noboru, Kimura, Mikiko
• Primary Examiner(s): Choi, Jacob Y
• Assistant Examiner(s): SMITH, GRAHAM P
• Application Number:
  US12/510,338
• Publication Number:
  US 20090278760A1
• Time in Patent Office: 1,505 Days
• Field of Search: 343/860
• US Class Current: 343/860
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07756 the connection being non-galvanic, e.g. capacitive
• CPC Class Codes: H01Q 1/2208 associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems methods or arrangements for sensing record carriers, e.g. for reading patterns G06K7/00; record carrier for use with machines and with at least a part designed to carry digital markings G06K19/00
• CPC Class Codes: H05K 1/0269 for visual or optical inspection
• CPC Class Codes: H05K 2201/09918 Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
• CPC Class Codes: H05K 2201/09954 More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
• CPC Class Codes: H05K 2201/10636 Leadless chip, e.g. chip capacitor or resistor
• CPC Class Codes: H05K 2201/10727 Leadless chip carrier [LCC], e.g. chip-modules for cards
• CPC Class Codes: H05K 2203/166 Alignment or registration; Control of registration
• CPC Class Codes: H05K 3/303 Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A wireless IC device includes a wireless IC chip; a feeder circuit board which has the wireless IC chip located thereon, is magnetically coupled to a radiation plate, supplies electric power to the wireless IC chip, and relays signals between the wireless IC chip and the radiation plate; and a substrate on which the feeder circuit board is placed. On the substrate, there are formed a plurality of positioning markers indicating the boundaries of a plurality of positioning areas in which the feeder circuit board is selectively placed.

Claims

1. A wireless IC device comprising:

a wireless IC chip;

a feeder circuit board on which the wireless IC chip is disposed, and including a feeder circuit including at least one of a resonance circuit and a matching circuit, the feeder circuit being electromagnetically coupled to a pair of radiation plates; and

a substrate on which the feeder circuit board is placed and including the pair of radiation plates disposed thereon or therein;

wherein

a plurality of positioning markers are provided on the substrate, the plurality of positioning markers being concentric figures and arranged at different areas of the substrate that define a plurality of positioning areas in which the feeder circuit board can be selectively placed with respect to the pair of radiation plates to provide the wireless IC device with a desired communication range or a desired radiation intensity;

the pair of radiation plates are arranged adjacent to each other; and

the plurality of positioning markers surround one end portion of each of the pair of radiation plates when the plurality of positioning markers are viewed in plan view.

2. The wireless IC device according to claim 1, wherein the substrate has a sheet-shaped configuration.

3. The wireless IC device according to claim 1, wherein the positioning markers are concentric closed figures.

4. The wireless IC device according to claim 1, wherein the positioning markers are provided on a principal surface of the substrate on which the feeder circuit board is placed.

5. The wireless IC device according to claim 1, wherein an adhesive layer is located between the feeder circuit board and the substrate, and an upper surface of the adhesive layer is spaced at a distance from the substrate as far as or farther than an upper surface of the positioning markers.

6. The wireless IC device according to claim 2, wherein the pair of radiation plates are disposed on a principal surface of the substrate on which the feeder circuit board is placed.

7. The wireless IC device according to claim 2, wherein the pair of radiation plates are disposed on a principal surface of the substrate different from a principal surface on which the feeder circuit board is provided.

8. The wireless IC device according to claim 1, wherein the feeder circuit is electrically coupled with the pair of radiation plates.

9. The wireless IC device according to claim 1, wherein the feeder circuit is magnetically coupled with the pair of radiation plates.

10. The wireless IC device according to claim 1, wherein the feeder circuit is electrically and magnetically coupled with the pair of radiation plates.

11. The wireless IC device according to claim 1, wherein the resonance circuit includes one of an inductance element or a matching circuit.

12. The wireless IC device according to claim 1, wherein the resonance circuit includes an inductance element and a matching circuit.