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IC thermal management system

  • US 8,531,841 B2
  • Filed: 10/26/2010
  • Issued: 09/10/2013
  • Est. Priority Date: 10/26/2010
  • Status: Active Grant
First Claim
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1. A method of dissipating heat from a dc-dc power converter, the method comprising the steps of:

  • (a) placing a compressible electrically insulating underfill thermal interface material in contact with the button of the power converter; and

    (b) placing the compressible electrically insulating underfill thermal interfaces material contacting the bottom of the power converter in contact with a motherboard;

    whereinthe compressible electrically insulating underfill thermal interface material fills space between the bottom of the power converter and the surface of the motherboard and thereby provides a heat conductive path that transfers heat from the power converter to the motherboard printed wiring;

    the compressible electrically insulating underfill thermal interface material is in the form of a compliant compressible thermal pad; and

    double sided adhesive tape is attached to components on the power converter to provide a non-intrusive method of attaching the power converter to the motherboard while providing compression for the thermal pad.

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