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Heat sinks having a thermal interface for cooling electronic devices

  • US 8,535,787 B1
  • Filed: 06/29/2009
  • Issued: 09/17/2013
  • Est. Priority Date: 06/29/2009
  • Status: Active Grant
First Claim
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1. An apparatus, comprising:

  • a first material defining a first layer of the apparatus, the first material being any one of an aluminized polyester film or an aluminized polyimide film;

    a second material being deformable and thermally conductive, the second material being at least one of a thermally conductive gel, a thermally conductive grease or a phase-change material configured to change phase at an operating temperature above approximately 40 degrees Celsius; and

    a third material different from the second material, the third material being an adhesive material,the second material and the third material collectively defining a second layer of the apparatus having a first region and a second region, the first region formed from the second material, the second region formed from the third material.

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