Medical device having bonding regions and method of making the same

• US 8,535,806 B2
• Filed: 09/22/2010
• Issued: 09/17/2013
• Est. Priority Date: 09/30/2008
• Status: Active Grant

• Current Assignee: Cordis Corporation (Cardinal Health, Inc.)
• Original Assignee: Cordis Corporation (Cardinal Health, Inc.)
• Inventors: Huang, I Mark, Williamson, Michael V.
• Primary Examiner(s): Ahmed, Sheeba
• Application Number:
  US12/888,091
• Publication Number:
  US 20110008626A1
• Time in Patent Office: 1,091 Days
• Field of Search: None
• US Class Current: 428/411.1
• CPC Class Codes: B32B 9/04 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material next to a glass layer B32B17/06; layered products with at least two ceramic layers composed mainly of ceramic B32B18/00
• CPC Class Codes: C04B 37/00 Joining burned ceramic articles with other burned ceramic articles or other articles by heating soldering and welding materials B23K35/24; laminated products B32B, E04C
• CPC Class Codes: C09J 2400/166 in the pretreated surface to be joined
• CPC Class Codes: C09J 5/02 involving pretreatment of the surfaces to be joined
• CPC Class Codes: C09J 5/06 involving heating of the applied adhesive
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 428/12979 Containing more than 10% nonferrous elements [e.g., high alloy, stainless]
• CPC Class Codes: Y10T 428/31504 Composite [nonstructural laminate]
• CPC Class Codes: Y10T 428/31544 Addition polymer is perhalogenated
• CPC Class Codes: Y10T 428/31678 Of metal

Abstract

Medical devices having bonded joints are disclosed. The bonded joints include two surfaces bonded by a layer of phenoxy resin therebetween. In the preferred embodiments, bonded surfaces include materials that are suitable for medical devices. Most preferably, Nitinol includes at least one bonded surface, however, other preferred materials may include, but are not limited to cobalt chromium, stainless steel, titanium, tantalum, and plastic. An intraluminal device including a plurality of locations with a phenoxy resin layer is also disclosed wherein the phenoxy resin further includes a radioopaque additive, a lubricious additive, or both radioopaque and lubricious additives. Also disclosed is an intraluminal device having contiguous heterogeneous structural elements of metallic members and non-metallic sections that are bonded together by a layer of phenoxy resin therebetween.

Claims

1. A medical device comprising:

a first member made from nitinol having a first surface with an available surface oxygen;

a second member made from nitinol having a second surface with an available surface oxygen;

a bonding agent comprised of polyhydroxyl ether having a plurality of secondary hydroxyl functional groups with an affinity to form hydrogen bonds with oxygen, the bonding agent being cooperatively associated with the first member and the second member in such a manner as to cause the bonding agent to contact the first surface and the second surface, the bonding agent configured to affix the first member relative to the second member by forming a covalent bond between the available surface oxygen on the first and the second surfaces and the hydroxyl functional groups of the bonding agent.

2. The medical device of claim 1 wherein at least one of the first member and the second member have an oxide surface.

3. The medical device of claim 2 wherein the oxide surface is a passivated oxide surface.

4. The medical device of claim 1 wherein the nitinol is in a martinsitic phase at zero applied stress.

5. The medical device of claim 4 wherein the nitinol has an A_f temperature greater than about 37 degrees Celsius.

6. The medical device of claim 1 wherein the nitinol is in an austenitic phase at zero applied stress.

7. The medical device of claim 6 wherein the nitinol has an A_f temperature between about 10 degrees Celsius and about 37 degrees Celsius.

8. The medical device of claim 1 wherein the polyhydroxyl ether is a phenoxy resin.