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Large panel leadframe

  • US 8,535,988 B2
  • Filed: 05/25/2012
  • Issued: 09/17/2013
  • Est. Priority Date: 11/01/2011
  • Status: Expired due to Fees
First Claim
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1. A method of manufacturing integrated circuit packages, the method comprising:

  • mounting a large panel leadframe having a substantially square shape to a ring, wherein the large panel leadframe includes a plurality of die pads and a corresponding plurality of leads arranged in a matrix pattern;

    attaching an integrated circuit chip to each of the die pads;

    applying an encapsulant material over the integrated circuit chips and at least a portion of the large panel leadframe; and

    separating the plurality of die pads and the corresponding leads from the large panel leadframe to form the integrated circuit packages, wherein the steps of attaching the integrated circuit chips and applying the encapsulant material are performed while the large panel leadframe is mounted to the ring.

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