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Partitioned through-layer via and associated systems and methods

  • US 8,536,046 B2
  • Filed: 02/01/2013
  • Issued: 09/17/2013
  • Est. Priority Date: 08/31/2007
  • Status: Active Grant
First Claim
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1. A method for electrically routing component contacts of one or more electronic components using a circuit board system of one or more circuit board layers, the method comprising:

  • coupling a first contact of a component to a first exposed contact of a circuit board layer associated with a circuit board system, the first exposed contact being coupled to a first signal path of the circuit board system routed through a via hole in at least one dielectric layer of the circuit board system; and

    coupling a second contact of the component to a second exposed contact of the circuit board layer, the second exposed contact being coupled to a second signal path of the circuit board system routed through the via hole and electrically isolated from the first signal path.

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