Partitioned through-layer via and associated systems and methods
First Claim
1. A method for electrically routing component contacts of one or more electronic components using a circuit board system of one or more circuit board layers, the method comprising:
- coupling a first contact of a component to a first exposed contact of a circuit board layer associated with a circuit board system, the first exposed contact being coupled to a first signal path of the circuit board system routed through a via hole in at least one dielectric layer of the circuit board system; and
coupling a second contact of the component to a second exposed contact of the circuit board layer, the second exposed contact being coupled to a second signal path of the circuit board system routed through the via hole and electrically isolated from the first signal path.
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Accused Products
Abstract
Partitioned vias, interconnects, and substrates that include such vias and interconnects are disclosed herein. In one embodiment, a substrate has a non-conductive layer and a partitioned via formed in a portion of the non-conductive layer. The non-conductive layer includes a top side, a bottom side, and a via hole extending between the top and bottom sides and including a sidewall having a first section a second section. The partitioned via includes a first metal interconnect within the via on the first section of the sidewall and a second metal interconnect within the via hole on the second section of the sidewall and electrically isolated from the first metal interconnect. In another embodiment, the first metal interconnect is separated from the second metal interconnect by a gap within the via hole.
466 Citations
6 Claims
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1. A method for electrically routing component contacts of one or more electronic components using a circuit board system of one or more circuit board layers, the method comprising:
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coupling a first contact of a component to a first exposed contact of a circuit board layer associated with a circuit board system, the first exposed contact being coupled to a first signal path of the circuit board system routed through a via hole in at least one dielectric layer of the circuit board system; and coupling a second contact of the component to a second exposed contact of the circuit board layer, the second exposed contact being coupled to a second signal path of the circuit board system routed through the via hole and electrically isolated from the first signal path. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification