Methods and systems for material bonding
First Claim
1. A method of realizing electrical contact between a first conducting material on a first substrate and a second conducting material on a second substrate, the method comprising:
- (a) receiving a first intermetallic layer on the first conducting material on the first substrate, wherein the first intermetallic layer is brittle and has a roughness such that it breaks upon contacting a solder material with a low pressure, wherein excess metal on the first intermetallic layer is removed;
(b) receiving a solder material on the second conducting material, wherein the solder material has a lower melting point than the first and second conducting materials and the first intermetallic layer, wherein the solder material is softer than the first intermetallic layer;
(c) bringing the solder material in contact with the first intermetallic layer at a temperature below the melting temperature of the solder material such that the first intermetallic layer breaks;
(d) bringing the solder material in closer contact with the first intermetallic layer at a temperature below the melting temperature of the solder material such that the solder material fills at least part of the holes in the surface of the first intermetallic layer after breaking the first intermetallic layer; and
(e) forming a second intermetallic layer at the interface between the solder material and the first intermetallic layer at a temperature below the melting temperature of the solder material.
1 Assignment
0 Petitions
Accused Products
Abstract
A device and a method for realizing reliable electrical contacts at low temperature and low pressure between conducting materials on, for example, different substrates are disclosed. In one aspect, a rough and brittle intermetallic layer is formed on a conducting material on a first substrate. A soft solder material layer on the other substrate is used for contacting the brittle and rough intermetallic layer that will break. As the solder material is relatively soft, contact between the broken intermetallic layer and the solder material can be realized over a large portion of the surface area. At that stage, a second intermetallic layer is formed between the solder material and the first intermetallic layer realizing electrical contact.
-
Citations
13 Claims
-
1. A method of realizing electrical contact between a first conducting material on a first substrate and a second conducting material on a second substrate, the method comprising:
-
(a) receiving a first intermetallic layer on the first conducting material on the first substrate, wherein the first intermetallic layer is brittle and has a roughness such that it breaks upon contacting a solder material with a low pressure, wherein excess metal on the first intermetallic layer is removed; (b) receiving a solder material on the second conducting material, wherein the solder material has a lower melting point than the first and second conducting materials and the first intermetallic layer, wherein the solder material is softer than the first intermetallic layer; (c) bringing the solder material in contact with the first intermetallic layer at a temperature below the melting temperature of the solder material such that the first intermetallic layer breaks; (d) bringing the solder material in closer contact with the first intermetallic layer at a temperature below the melting temperature of the solder material such that the solder material fills at least part of the holes in the surface of the first intermetallic layer after breaking the first intermetallic layer; and (e) forming a second intermetallic layer at the interface between the solder material and the first intermetallic layer at a temperature below the melting temperature of the solder material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
-
Specification