Electrochemical device

• US 8,536,465 B2
• Filed: 03/16/2009
• Issued: 09/17/2013
• Est. Priority Date: 03/18/2008
• Status: Expired due to Fees

• Current Assignee: Taiyo Yuden Company Limited (Taiyo Yuden Co)
• Original Assignee: Taiyo Yuden Company Limited (Taiyo Yuden Co)
• Inventors: Ishida, Katsuei, Hagiwara, Naoto, Yawata, Kazushi, Kobayashi, Motoki
• Primary Examiner(s): NGUYEN, HOA CAO
• Application Number:
  US12/933,263
• Publication Number:
  US 20110056737A1
• Time in Patent Office: 1,646 Days
• Field of Search: 174/50.5, 174/50.51, 174/301.1, 174/301.3, 174/502, 174/520, 174/524, 174/517, 174/518, 174/523, 174/541, 174/260, 174/527, 174/528, 174/549, 174/551, 174/553, 174/554, 174/564, 361/301.1, 361/301.3
• US Class Current: 174/520
• CPC Class Codes: H01G 11/76 specially adapted for integration in multiple or stacked hybrid or EDL capacitors
• CPC Class Codes: H01G 11/78 Cases; Housings; Encapsulations; Mountings
• CPC Class Codes: H01G 11/82 Fixing or assembling a capacitive element in a housing, e.g. mounting electrodes, current collectors or terminals in containers or encapsulations
• CPC Class Codes: H01G 2/10 Housing; Encapsulation
• CPC Class Codes: H01G 9/10 Sealing, e.g. of lead-in wires
• CPC Class Codes: H01M 50/103 prismatic or rectangular H01M50/109, H01M50/11 take precedence
• CPC Class Codes: Y02E 60/10 Energy storage using batteries
• CPC Class Codes: Y02E 60/13 Energy storage using capacitors
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

Provided is an electrochemical device compatible with high-temperature reflow soldering using a lead-free solder. An electrical double layer capacitor 10-1 includes a package 14 that is constructed with a film or films and has sealed parts 14a1 to 14a3 formed by sealing parts, in which films are superimposed on each other, by, for example, heat sealing. The entireties of the sealed parts 14a1 to 14a3 of the package 14 are covered in a close-contact state with a support 16 that has higher rigidity than the film(s) constructing the package 14.

Claims

1. An electrochemical device adapted to be mounted by soldering, wherein the electrochemical device comprises:

a package that is constructed with a film or films and has a sealed portion formed by sealing edge portions of the film(s) superimposed on each other;

an electric storage element that is enclosed in the package; and

a support that has higher rigidity than the film(s) and covers and contacts entirely and liquid-tightly at least the sealed portion of the package including portions from which electrode terminals are led out, wherein the support covers solely the sealed portion of the package.

2. The electrochemical device according to claim 1, wherein the contour of the package is rectangular, and the sealed portion of the package is formed at least on three sides of the rectangular package.

3. The electrochemical device according to claim 1, wherein an interior inside the package enclosing the electric storage element is filled with an electrolyte.

4. The electrochemical device according to claim 1, wherein the film(s) is/are constituted by a laminated film comprising an outer protective layer, a barrier layer, an insulating layer, and an inner sealing layer.

5. The electrochemical device according to claim 1, further comprising a positive-electrode terminal and a negative-electrode terminal led out from the electric storage element and jutting out from the support through the sealed portion of the package.

6. The electrochemical device according to claim 1, wherein the support is made of a material having higher rigidity than a material of the film(s), said material being selected from the group consisting of a ceramic including alumina, a surface-insulated metal including an alloy or cold-rolled aluminum, and a plastic including an epoxy resin, an aramid resin, or a polyimide resin.