Electrochemical device
First Claim
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1. An electrochemical device adapted to be mounted by soldering, wherein the electrochemical device comprises:
- a package that is constructed with a film or films and has a sealed portion formed by sealing edge portions of the film(s) superimposed on each other;
an electric storage element that is enclosed in the package; and
a support that has higher rigidity than the film(s) and covers and contacts entirely and liquid-tightly at least the sealed portion of the package including portions from which electrode terminals are led out, wherein the support covers solely the sealed portion of the package.
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Abstract
Provided is an electrochemical device compatible with high-temperature reflow soldering using a lead-free solder. An electrical double layer capacitor 10-1 includes a package 14 that is constructed with a film or films and has sealed parts 14a1 to 14a3 formed by sealing parts, in which films are superimposed on each other, by, for example, heat sealing. The entireties of the sealed parts 14a1 to 14a3 of the package 14 are covered in a close-contact state with a support 16 that has higher rigidity than the film(s) constructing the package 14.
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Citations
6 Claims
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1. An electrochemical device adapted to be mounted by soldering, wherein the electrochemical device comprises:
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a package that is constructed with a film or films and has a sealed portion formed by sealing edge portions of the film(s) superimposed on each other; an electric storage element that is enclosed in the package; and a support that has higher rigidity than the film(s) and covers and contacts entirely and liquid-tightly at least the sealed portion of the package including portions from which electrode terminals are led out, wherein the support covers solely the sealed portion of the package. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification