Metal mesh lid MEMS package and method

• US 8,536,663 B1
• Filed: 04/28/2011
• Issued: 09/17/2013
• Est. Priority Date: 04/28/2011
• Status: Active Grant

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Kuo, Bob Shih-Wei, Shumway, Russell, Troche, Louis B. Jr.
• Primary Examiner(s): YEUNG LOPEZ, FEIFEI
• Application Number:
  US13/096,359
• Time in Patent Office: 873 Days
• Field of Search: None
• US Class Current: 257/414
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2201/0264 Pressure sensors
• CPC Class Codes: B81B 2207/09 Packages
• CPC Class Codes: B81B 7/0032 Packages or encapsulation processes for packaging MEMS B81C1/00261; packaging of smart-MEMS B81C1/0023
• CPC Class Codes: B81B 7/0061 suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
• CPC Class Codes: B81B 7/0064 for protecting against electromagnetic or electrostatic interferences
• CPC Class Codes: B81B 7/0074 3D packaging, i.e. encapsulation containing one or several MEMS devices arranged in planes non-parallel to the mounting board
• CPC Class Codes: B81C 1/00261 Processes for packaging MEMS devices MEMS packages B81B7/0032, packaging of smart-MEMS B81C1/0023
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate
• CPC Class Codes: B81C 2203/01 Packaging MEMS
• CPC Class Codes: B81C 2203/0109 Bonding an individual cap on the substrate
• CPC Class Codes: B81C 2203/0154 Moulding a cap over the MEMS device
• CPC Class Codes: B81C 2203/0163 Reinforcing a cap, e.g. with ribs
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48111 the wire connector extending above another semiconductor or solid-state body
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 2224/73265 : Layer and wire connectors
• CPC Class Codes: H01L 2224/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/16151 : Cap comprising an aperture, e.g. for pressure control, encapsulation
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Abstract

A metal mesh lid MEMS package includes a substrate, a MEMS electronic component coupled to the substrate, and a metal mesh lid coupled to the substrate with a lid adhesive. The metal mesh lid includes a polymeric lid body having a top port formed therein and a metal mesh cap coupled to the lid body. The metal mesh cap covers the top port and serves as both a particulate filter and a continuous conductive shield for EMI/RF interferences. Further, the metal mesh cap provides a locking feature for the lid adhesive to maximize the attach strength of the metal mesh lid to the substrate.

Claims

1. A package comprising:

a substrate;

a Micro Electro Mechanical Systems (MEMS) electronic component coupled to the substrate; and

a metal mesh lid coupled to the substrate, the metal mesh lid comprising;

a lid body having a top port formed therein;

a metal mesh cap coupled to the lid body, wherein the metal mesh cap covers the top port;

a lid plate parallel to the substrate; and

lid sidewalls extending perpendicularly from the lid plate and terminating at a lid base of the metal mesh lid, wherein the metal mesh cap is bent at the lid base and is exposed at the entire lid base.

2. The package of claim 1 further comprising a metal mesh cap bonding material coupling the metal mesh cap to the lid body.

3. The package of claim 1 wherein the metal mesh cap comprises connected strands of electrically conductive material.

4. The package of claim 3 wherein the metal mesh cap comprises holes therein through which external stimulus can pass.

5. The package of claim 4 wherein the lid body seals the holes of the metal mesh cap.

6. The package of claim 1 wherein the lid body comprises a polymeric material.

7. The package of claim 1 wherein the metal mesh cap forms a filtration structure that prevents contaminants from passing through the top port.

8. The package of claim 1 further comprising a lid adhesive coupling the metal mesh lid to the substrate, wherein the metal mesh cap forms a locking feature for the lid adhesive.

9. The package of claim 1 further comprising an electrically conductive lid adhesive coupling the metal mesh cap to ground terminals of the substrate.

10. A method comprising:

forming a metal mesh cap array comprising metal mesh caps; and

coupling the metal mesh cap array to a lid body array comprising lid bodies having top ports formed therein such that the metal mesh caps cover the top ports, wherein the metal mesh cap array and the lid body array collectively form a metal mesh lid array comprising metal mesh lids, the metal mesh lids comprising;

lid plates;

lid sidewalls extending perpendicularly from the lid plates and terminating at lid bases of the metal mesh lids, wherein the metal mesh caps are bent at the lid bases and are exposed at the entire lid bases.

11. The method of claim 10 wherein the coupling comprises:

applying a metal mesh cap bonding material to the lid body array; and

moving the metal mesh cap array into contact with the metal mesh cap bonding material.

14. The method of claim 10 wherein the coupling comprises:

molding the lid body array to the metal mesh cap array.

15. The method of claim 14 wherein the metal mesh cap array is at an inner surface of the lid body array.

16. The method of claim 14 wherein the metal mesh cap array is embedded within the lid body array.

17. The method of claim 16 wherein metal mesh cap bases of the metal mesh cap array are exposed from the lid body array.

18. The method of claim 10 further comprising:

coupling Micro Electro Mechanical Systems (MEMS) electronic components to substrates; and

mounting the metal mesh lid array to the substrates such that the MEMS electronic components are located within lid cavities of the metal mesh lids.

12. A method comprising:

forming a metal mesh cap array comprising metal mesh caps; and

coupling the metal mesh cap array to a lid body array comprising lid bodies having top ports formed therein such that the metal mesh caps cover the top ports comprising;

applying top port plugs to the metal mesh cap array at top port hole areas;

forming the lid body array on the metal mesh cap array; and

removing the top port plugs to form the top ports in the lid body array.

13. The method of claim 12 wherein the removing comprises melting the top port plugs.

19. A method comprising:

forming a lid body array comprising lid bodies having top ports formed therein; and

simultaneously forming and bonding a metal mesh cap array to the lid body array, the metal mesh cap array comprising metal mesh caps covering the top ports, wherein the metal mesh cap array and the lid body array collectively form a metal mesh lid array comprising metal mesh lids, the metal mesh lids comprising;

lid plates;

lid sidewalls extending perpendicularly from the lid plates and terminating at lid bases of the metal mesh lids, wherein the metal mesh caps are bent at the lid bases and are exposed at the entire lid bases.

20. The method of claim 19 wherein the simultaneously forming and bonding a metal mesh cap array to the lid body array comprises:

placing the lid body array on a lower hot press plate of a hot forming press;

placing a metal mesh sheet above the lid body array; and

pressing the metal mesh sheet with an upper hot press plate of the hot forming press into the lid body array.