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Metal mesh lid MEMS package and method

  • US 8,536,663 B1
  • Filed: 04/28/2011
  • Issued: 09/17/2013
  • Est. Priority Date: 04/28/2011
  • Status: Active Grant
First Claim
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1. A package comprising:

  • a substrate;

    a Micro Electro Mechanical Systems (MEMS) electronic component coupled to the substrate; and

    a metal mesh lid coupled to the substrate, the metal mesh lid comprising;

    a lid body having a top port formed therein;

    a metal mesh cap coupled to the lid body, wherein the metal mesh cap covers the top port;

    a lid plate parallel to the substrate; and

    lid sidewalls extending perpendicularly from the lid plate and terminating at a lid base of the metal mesh lid, wherein the metal mesh cap is bent at the lid base and is exposed at the entire lid base.

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