Millimeter wave multi-layer packaging including an RFIC cavity and a radiating cavity therein

• US 8,536,954 B2
• Filed: 06/02/2010
• Issued: 09/17/2013
• Est. Priority Date: 06/02/2010
• Status: Active Grant

• Current Assignee: Siklu Communication Ltd.
• Original Assignee: Siklu Communication Ltd.
• Inventors: Leiba, Yigal, Dayan, Elad
• Primary Examiner(s): LEE, BENNY T
• Application Number:
  US12/791,936
• Publication Number:
  US 20110299256A1
• Time in Patent Office: 1,203 Days
• Field of Search: 333/26, 333/33, 333/247, 257/664, 257/728
• US Class Current: 333/26
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45014 Ribbon connectors, e.g. rectangular cross-section
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/30111 : matching
• CPC Class Codes: H01Q 1/2283 : mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H05K 1/0219 : Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
• CPC Class Codes: H05K 1/0243 : Printed circuits associated with mounted high frequency components
• CPC Class Codes: H05K 1/025 : Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance H05K1/024 and H05K1/0243 take precedence; for semiconductor devices H01L23/66
• CPC Class Codes: H05K 1/185 : Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit semiconductor chips encapsulated by interconnect and support structures H01L23/5389, H01L24/00
• CPC Class Codes: H05K 2201/09618 : Via fence, i.e. one-dimensional array of vias
• CPC Class Codes: H05K 2201/09727 : Varying width along a single conductor; Conductors or pads having different widths
• CPC Class Codes: H05K 2201/10098 : Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
• CPC Class Codes: H05K 3/4629 : laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
• CPC Class Codes: H05K 3/4697 : having cavities, e.g. for mounting components H05K3/4691 takes precedence
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base

Abstract

Millimeter wave radio-frequency integrated circuit device comprises a housing and a millimeter wave radio frequency integrated circuit, the housing comprising a plurality of layers laminated together and two cavities defined by apertures within the layers which are positioned to correspond as the layers are laminated together. The radio frequency integrated circuit is located within the first cavity, and the second cavity serves as a radiating cavity. The RFIC is bonded to a transmission line which connects to the radiating cavity.

Claims

1. Millimeter wave radio-frequency integrated circuit device, comprising

a housing and a radio frequency integrated circuit (RFIC);

the housing comprising a plurality of layers laminated together and a first cavity defined within said plurality of layers laminated together, the radio frequency integrated circuit being located within said first cavity, the layers being non-ceramic and the device further comprising a second cavity defined within said layers, said second cavity forming a radiating cavity for connection to a waveguide, wherein at least some of the plurality of layers laminated together are separated by additional layers, said additional layers being isolating laminate layers.

2. The device of claim 1, wherein said first cavity is sealed with a sealing cap.

3. The device of claim 2, wherein said sealing cap comprising radiation absorbing material.

4. The device of claim 1, wherein at least some of said layers are clad with metal.

5. The device of claim 1, wherein said radiating cavity is capped by a laminated backshort.

6. The device of claim 1, further comprising conducting vias extending through at least some of said plurality of layers laminated together.

7. The device of claim 6, comprising a grid of vias extending below said first cavity to conduct heat away from said RFIC.

8. The device of claim 1, further comprising conducting vias extending through at least some of said plurality of layers laminated together and a cage of vias surrounding said radiating cavity.

9. The device of claim 1, further comprising a mechanical laminate layer providing a floor to said first cavity.

10. The device of claim 1, further comprising a radiating element extending into said second cavity.

11. The device of claim 10, wherein said radio frequency integrated circuit is connected to said radiating element via a printed passive radio frequency component.

12. The device of claim 11, wherein said radio frequency integrated circuit is connected to said printed passive radio frequency component or to said radiating element by at least one member of the group comprising bonding wires and a flip chip connection.

13. Millimeter wave radio-frequency integrated circuit device, comprising:

a housing and a radio frequency integrated circuit (RFIC);

the housing comprising a plurality of layers laminated together and a first cavity defined within said plurality of layers laminated together, the radio frequency integrated circuit being located within said first cavity, the layers being non-ceramic and the device further comprising a second cavity defined within said layers, said second cavity forming a radiating cavity for connection to a waveguide, wherein said non-ceramic layers comprise PTFE based laminate materials.

14. The device of claim 13, wherein said PTFE-based laminate materials are manufactured using PCB manufacturing technology.

15. Millimeter wave radio-frequency integrated circuit device, comprising

a housing and a radio frequency integrated circuit (RFIC);

the housing comprising a plurality of layers laminated together and a first cavity defined within said plurality of layers laminated together, the radio frequency integrated circuit being located within said first cavity, wherein at least some of the plurality of layers laminated together are separated by additional layers, said additional layers being isolating laminate layers.

16. Millimeter wave radio-frequency integrated circuit device, comprising:

a housing and a radio frequency integrated circuit (RFIC);

the housing comprising a plurality of layers laminated together and a first cavity defined within said plurality of layers laminated together, the radio frequency integrated circuit being located within said first cavity, the layers being non-ceramic and the device further comprising a second cavity defined within said layers, said second cavity forming a radiating cavity for connection to a waveguide, the device further incorporating a bond matching structure for providing a bond at a point of connection of said radio frequency integrated circuit to a transmission line leading to said second cavity, wherein said bond comprises a signal connection and first and second ground connections on either side of said signal connection at said radio frequency integrated circuit, said first and second ground connections being connected to first and second ground pads disposed on either side of an extension of said transmission line, said signal connection being connected to said extension of said transmission line, said bond matching structure comprising convex bulges on either side of said extension faced by opposing matched concave intrusions on said first and second ground pads.

17. A method of manufacturing a radio-frequency integrated circuit device, comprising:

machining apertures into a series of non-ceramic laminate layers;

laminating together said series of non-ceramic laminate layers such that said apertures form a first cavity;

placing a radio frequency integrated circuit into said first cavity; and

sealing said first cavity;

machining further apertures into said series of laminate layers such that when said series of laminate layers are laminated together, a second, radiating, cavity is formed for connection to a waveguide, and printing a transmission line to connect between said first cavity and said second cavity;

providing bond matching at a connection of said radio frequency integrated circuit to said transmission line, and wherein providing said connection comprises;

providing a signal connection and first and second ground connections on either side of said signal connection on said radio frequency integrated circuit;

connecting said first and second ground connections and said signal connection respectively to ground pads and an extension of said transmission line;

providing convex bulges on either side of said extension;

providing opposing matched concave intrusions on said ground pads opposite said convex bulges.

18. Housing for a millimeter wave radio-frequency integrated circuit device, comprising:

a plurality of layers laminated together, the layers being non-ceramic;

a first cavity defined within said plurality of layers laminated together, said millimeter wave radio frequency integrated circuit being locatable within said first cavity;

a second cavity defined within said layers, said second cavity forming a radiating cavity for connection to a waveguide;

a transmission line printed on one of said plurality of layers laminated together for connecting said radio frequency integrated circuit to said radiating cavity, wherein said transmission line is a relatively low impedance transmission line, and is configured to match a relatively high impedance bond of said radio frequency integrated circuit, said transmission line being configured to match said high impedance bond of said radio frequency integrated circuit comprises convex bulges on either side of an extension of said transmission line faced by opposing matched concave intrusions on ground pads.