Field serviceable CPU module
First Claim
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1. A computer apparatus comprising:
- a computer chassis;
a computer module, said computer module supporting a computer-on-module (COM) format and including a plurality of electrical components, a bus for input/output peripherals, and computer module connectors;
a baseboard disposed in said computer chassis, said baseboard including baseboard connectors that are coupled to the computer module connectors, said baseboard breaking out said bus of said computer module to peripheral connectors for said input/output peripherals;
a heat sink assembly attached to said computer module to form a computer module-heat sink assembly, said heat sink assembly being disposed on a first side of said computer module-heat sink assembly and said computer module being disposed on a second side of said computer module-heat sink assembly, said second side being opposite said first side, said electrical components and said computer module connectors of said computer module facing outwardly from said second side, each of said electrical components being removable from said computer module without detaching said computer module from said heat sink assembly, and said computer module connectors extending from said second side into the coupling with the baseboard connectors,wherein said computer module-heat sink assembly is configured to be alternately removed or attached to said computer chassis, and when said computer module-heat sink assembly is attached to said computer chassis, said heat sink assembly forms part of an integral exterior structure of said computer chassis.
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Abstract
A computer apparatus comprising a computer chassis, a baseboard component disposed within the computer chassis and a computer module electronically coupled to the baseboard component is disclosed. A heat sink assembly is attached to the computer module to form a computer module heat sink assembly, wherein the heat sink assembly forms part of an integral exterior structure of the computer chassis. The chassis may comprise a compartment disposed through an exterior surface of the chassis for receiving the computer module heat sink assembly in mated fashion. The computer module heat sink assembly forms a water and air tight seal with the internal compartment of the chassis in mated fashion.
77 Citations
17 Claims
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1. A computer apparatus comprising:
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a computer chassis; a computer module, said computer module supporting a computer-on-module (COM) format and including a plurality of electrical components, a bus for input/output peripherals, and computer module connectors; a baseboard disposed in said computer chassis, said baseboard including baseboard connectors that are coupled to the computer module connectors, said baseboard breaking out said bus of said computer module to peripheral connectors for said input/output peripherals; a heat sink assembly attached to said computer module to form a computer module-heat sink assembly, said heat sink assembly being disposed on a first side of said computer module-heat sink assembly and said computer module being disposed on a second side of said computer module-heat sink assembly, said second side being opposite said first side, said electrical components and said computer module connectors of said computer module facing outwardly from said second side, each of said electrical components being removable from said computer module without detaching said computer module from said heat sink assembly, and said computer module connectors extending from said second side into the coupling with the baseboard connectors, wherein said computer module-heat sink assembly is configured to be alternately removed or attached to said computer chassis, and when said computer module-heat sink assembly is attached to said computer chassis, said heat sink assembly forms part of an integral exterior structure of said computer chassis. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 12)
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11. The apparatus of clam 10, wherein the computer module heat sink assembly forms a water and air tight seal with the internal compartment of the chassis in mated fashion.
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13. A method of manufacturing an electronic device, comprising:
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providing a computer chassis, a computer module, a baseboard, and a heat sink assembly, said computer module supporting a computer-on-module (COM) format and including a plurality of electrical components, a bus for input/output peripherals, and computer module connectors, said baseboard disposed in said computer chassis and including baseboard connectors; attaching said heat sink assembly to said computer module to form a computer module-heat sink assembly, said heat sink assembly being disposed on a first side of said computer module-heat sink assembly and said computer module being disposed on a second side of said computer module-heat sink assembly, said second side being opposite said first side, said electrical components and said computer module connectors of said computer module facing outwardly from said second side, each of said electrical components being removable from said computer module without detaching said computer module from said heat sink assembly, and said computer module connectors extending from said second side; and removably attaching said computer module-heat sink assembly to said computer chassis so that said heat sink assembly forms part of an integral exterior structure of said computer chassis and so that said computer module connectors are coupled with said baseboard connectors, said baseboard being coupled to said computer module to break out said bus of said computer module to peripheral connectors for said input/output peripherals. - View Dependent Claims (14, 15, 17)
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16. The method of clam 15, further comprising:
forming a water and air tight seal with the internal compartment of the chassis via the computer module heat sink assembly.
Specification