SSC chip, fiber array attached with SSC, PLC module attached with SSC and method for manufacturing SSC

• US 8,538,213 B2
• Filed: 11/25/2009
• Issued: 09/17/2013
• Est. Priority Date: 11/26/2008
• Status: Active Grant

• Current Assignee: Furukawa Electric Company Limited
• Original Assignee: Furukawa Electric Company Limited
• Inventors: Uchida, Yasuyoshi, Nara, Kazutaka
• Primary Examiner(s): Stahl, Mike
• Application Number:
  US12/625,581
• Publication Number:
  US 20100142900A1
• Time in Patent Office: 1,392 Days
• Field of Search: None
• US Class Current: 385/43
• CPC Class Codes: G02B 6/305 and having an integrated mode-size expanding section, e.g. tapered waveguide
• CPC Class Codes: G02B 6/4249 comprising arrays of active devices and fibres

Abstract

There is provided a SSC chip whose yield may be improved and whose processing steps may be simplified as compare to those of a prior art PLC chip having a light waveguide circuit to which a spot-size converter (SSC) is added, a fiber array attached with the SSC chip, a PLC module attached with the SSC chip and a method for manufacturing the SSC chip. The SSC chip has four spot-size converters and is fabricated separately from a PLC chip. Each SSC has a straight waveguide having the same core width and height with an end of an input/output waveguide of the PLC chip, a horizontally tapered waveguide in which the core width is enlarged in a tapered shape in the horizontal direction from the core width of the straight waveguide, a vertically tapered waveguide in which the core height is enlarged in a tapered shape in the vertical direction from the core height of the horizontally tapered waveguide and a spot-size enlarged portion whose core width and core height are both enlarged. Because it is unnecessary to fabricate the SSC at the end of the input/output waveguide of the PLC chip, a yield of the PLC chip may be improved.

Claims

1. A spot-size converter (SSC) chip having one or a plurality of spot-size converters, each said spot-size converter being a light waveguide composed of a clad and a core, comprising, in an order formed:

a straight waveguide whose core width and core height are constant;

a horizontally tapered waveguide whose core width is enlarged in a tapered shape in the horizontal direction from the core width of the straight waveguide;

a vertically tapered waveguide whose core height is enlarged in a tapered shape in the vertical direction from the core height of the straight waveguide; and

a spot-size enlarged portion whose core height and core width are both enlarged, wherein

said clad and core are made of a silica material, and

said core has a uniform refraction index and square or rectangular cross sections of respective parts of said core.

3. An apparatus comprising:

the SSC chip of claim 1; and

a fiber array in which a plurality of fibers are arrayed and disposed, wherein

an end face of said SSC chip is coupled with an end face of the fiber array so that each spot-size enlarged portion of said plurality of spot-size converters is coupled with each end face of said plurality of fibers respectively with minimum coupling loss.

4. An apparatus, comprising:

the SSC chip of claim 1,

a PLC chip having a planar lightwave circuit connected to a plurality of input/output waveguides, and

a fiber array in which a plurality of fibers are arrayed and disposed, wherein

an end face of said SSC chip is coupled with an end face of the PLC chip so that each end face of said straight waveguides of said plurality of spot-size converters is coupled with each end face of said plurality of input/output waveguides of said planar lightwave circuit respectively with minimum coupling loss; and

an other end face of said SSC chip is coupled with an end face of the fiber array so that each spot-size enlarged portion of said plurality of spot-size converters is coupled with each end face of said plurality of fibers respectively with minimum coupling loss.

5. A method for manufacturing the SSC chip of claim 1, comprising steps of:

forming an under cladding layer on a substrate by means of flame hydrolysis deposition;

forming a first core layer on said substrate;

disposing a shadow mask having a plurality of openings at a predetermined position on said first core layer to form a second core layer having a vertically tapered structure in which core height is enlarged in a tapered shape at the predetermined position on said first core layer by means of plasma chemical vapor deposition (CVD);

forming a plurality of waveguide patterns by means of photolithography and etching with a photo mask which includes a first straight portion for a horizontal shape of the straight waveguide, an inclined portion for a horizontal shape of the horizontally tapered waveguide and a second straight portion for a horizontal shape of the vertically tapered waveguide; and

forming an upper cladding layer on said plurality of waveguide patterns by means of flame hydrolysis deposition.

6. The method for manufacturing the SSC chip according to claim 5, wherein the first core layer is formed by the means of plasma CVD.

7. The method for manufacturing the SSC chip according to claim 5, wherein the first core layer is formed by the means of flame hydrolysis deposition.

8. An apparatus comprising:

the SSC chip of claim 1, and

a PLC chip having a planar lightwave circuit whose core width and core height are constant.

9. An apparatus comprising:

the SSC chip of claim 1, and

a PLC chip having a planar lightwave circuit whose core width and core height are constant, wherein

a horizontally tapered waveguide whose core width is enlarged in a tapered shape in the horizontal direction is formed at an end of the core of the planar lightwave circuit.

2. A spot-size converter (SSC) chip having one or a plurality of spot-size converters, each said spot-size converter being a light waveguide composed of a clad and a core, comprising, in an order formed:

a straight waveguide whose core width and core height are constant;

a vertically tapered waveguide whose core height is enlarged in a tapered shape in the vertical direction from the core height of the straight waveguide;

a horizontally tapered waveguide whose core width is enlarged in a tapered shape in the horizontal direction from the core width of the straight waveguide; and

a spot-size enlarged portion whose core height and core width are both enlarged, wherein

said clad and core are made of a silica material, and

said core has a uniform refraction index and square or rectangular cross sections of respective parts of said core.

10. An apparatus comprising:

the SSC chip of claim 2 and

a fiber array in which a plurality of fibers are arrayed and disposed, wherein

an end face of said SSC chip is coupled with an end face of the fiber array so that each spot-size enlarged portion of said plurality of spot-size converters is coupled with each end face of said plurality of fibers respectively with minimum coupling loss.

11. An apparatus comprising:

the SSC chip of claim 2,

a PLC chip having a planar lightwave circuit connected to a plurality of input/output waveguides, and

a fiber array in which a plurality of fibers are arrayed and disposed, wherein an end face of said SSC chip is coupled with an end face of the PLC chip so that each end face of said straight waveguides of said plurality of spot-size converters is coupled with each end face of said plurality of input/output waveguides of said planar lightwave circuit respectively with minimum coupling loss; and

an other end face of said SSC chip is coupled with an end face of the fiber array so that each spot-size enlarged portion of said plurality of spot-size converters is coupled with each end face of said plurality of fibers respectively with minimum coupling loss.

12. A method for manufacturing the SSC chip of claim 2, comprising steps of:

forming an under cladding layer on a substrate by means of flame hydrolysis deposition;

forming a first core layer on said substrate;

disposing a shadow mask having a plurality of openings at a predetermined position on said first core layer to form a second core layer having a vertically tapered structure in which core height is enlarged in a tapered shape at the predetermined position on said first core layer by means of plasma chemical vapor deposition (CVD);

forming a plurality of waveguide patterns by means of photolithography and etching with a photo mask which includes a first straight portion for a horizontal shape of the straight waveguide, a second straight portion for a horizontal shape of the vertically tapered waveguide and an inclined portion for a horizontal shape of the horizontally tapered waveguide; and

forming an upper cladding layer on said plurality of waveguide patterns by means of flame hydrolysis deposition.

13. The method for manufacturing the SSC chip according to claim 12, wherein the first core layer is formed by means of plasma CVD.

14. The method for manufacturing the SSC chip according to claim 12, wherein the first core layer is formed by means of flame hydrolysis deposition.

15. An apparatus comprising:

the SSC chip of claim 2, and

a PLC chip having a planar lightwave circuit whose core width and core height are constant.

16. An apparatus comprising:

the SSC chip of claim 2, and

a PLC chip having a planar lightwave circuit whose core width and core height are constant, wherein

a horizontally tapered waveguide whose core width is enlarged in a tapered shape in the horizontal direction is formed at an end of the core of the planar lightwave circuit.