Leads with high surface resistance

• US 8,538,551 B2
• Filed: 08/23/2012
• Issued: 09/17/2013
• Est. Priority Date: 12/06/2007
• Status: Expired due to Fees

• Current Assignee: Cardiac Pacemakers Incorporated (Boston Scientific Corporation)
• Original Assignee: Cardiac Pacemakers Incorporated (Boston Scientific Corporation)
• Inventors: Li, Yingbo, Ameri, Masoud
• Primary Examiner(s): Layno, Carl H
• Assistant Examiner(s): Morales, Jon Eric C
• Application Number:
  US13/592,588
• Publication Number:
  US 20120323297A1
• Time in Patent Office: 390 Days
• Field of Search: 607/2, 607/63, 607/115, 607/116
• US Class Current: 607/63
• CPC Class Codes: A61N 1/05 for implantation or insertion into the body, e.g. heart electrode A61N1/06 takes precedence
• CPC Class Codes: A61N 1/056 Transvascular endocardial electrode systems
• CPC Class Codes: A61N 1/086 Magnetic resonance imaging [MRI] compatible leads
• CPC Class Codes: A61N 1/3718 Monitoring of or protection against external electromagnetic fields or currents

Abstract

Implantable medical leads having resistance characteristics adapted to dissipate radio frequency (RF) electromagnetic energy during medical procedures such as magnetic resonance imaging (MRI) are disclosed. An illustrative medical device includes a lead having an inner electrical conductor operatively coupled to an electrode and a pulse generator, and one or more outer resistive shields that radially surround the inner conductor and dissipate RF energy into the surrounding body tissue along the length of the lead.

Claims

1. An implantable medical lead for use in a magnetic resonance imaging (MRI) environment, the lead comprising:

a lead having a proximal portion configured to be coupled to a pulse generator, a distal portion having an electrode, and a conductor wire that extends from the proximal portion to the distal portion to electrically connect with the electrode for conducting energy between the electrode and the pulse generator;

the lead having a resistivity that increases across a width of the lead between a center portion of the conductor wire and an outer portion of the lead such that the resistivity is greatest at the outer surface of the lead; and

wherein the outer portion of the lead is configured to dissipate RF electromagnetic energy received by an MRI device along a length of the lead.

2. The lead of claim 1, wherein the resistivity increases at a plurality of finite locations across the width of the lead.

3. The lead of claim 1, wherein the lead comprises a plurality of conductive layers radially surrounding the conductor wire.

4. The lead of claim 3, wherein the conductive layers successively increase in resistivity across the width of the lead.

5. The lead of claim 3, wherein the plurality of conductive layers comprises a first outer conductor layer with a first resistivity, a second outer conductor layer with a second resistivity greater than the first resistivity, and a third outer conductor layer with third resistivity greater than the first and second resistivities.

6. The lead of claim 1, wherein the conductor wire is surrounded radially by a plurality of outer resistive shields that successively increase in resistivity.

7. The lead of claim 1, wherein the conductor wire is the only conductor wire that extends along the length of the lead, the conductor wire having a variable resistivity across its width that increases from the center portion of the conductor wire.

8. The lead of claim 7, wherein the conductor wire continuously increases in resistivity from the center portion of the conductor wire.

9. The lead of claim 1, wherein the outer surface of the conductor wire is the outer surface of the lead.

10. The lead of claim 1, wherein the lead is configured to attenuate RF energy from an MRI scan by the increasing resistivity across the width of the lead inhibiting alternating currents from being transmitted to the center portion of the conductor wire and to the electrode on the distal portion of the lead.

11. An implantable medical lead for use in a magnetic resonance imaging (MRI) environment, the lead comprising:

a lead having a proximal portion configured to be coupled to a pulse generator, a distal portion having an electrode, and a conductor wire that extends from the proximal portion to the distal portion to electrically connect with the electrode for conducting energy between the electrode and the pulse generator;

the conductor wire having a resistivity that increases across a width of the conductor wire between a center portion of the conductor wire and an outer portion of the conductor wire such that the resistivity is greatest at the outer portion of the conductor wire; and

wherein the outer portion of the conductor wire is configured to dissipate RF electromagnetic energy received by an MRI device.

12. The lead of claim 11, wherein the resistivity increases along the width of the conductor wire at a plurality of finite locations.

13. The lead of claim 11, wherein the conductor wire comprises a plurality of conductive layers radially surrounding the center portion of the conductor wire.

14. The lead of claim 13, wherein the conductive layers successively increase in resistivity across the width of the conductor wire.

15. The lead of claim 13, wherein the plurality of conductive layers comprises a first outer conductor layer with a first resistivity, a second outer conductor layer with a second resistivity greater than the first resistivity, and a third outer conductor layer with third resistivity greater than the first and second resistivities.

16. The lead of claim 11, wherein the conductor wire comprises an inner wire core surrounded radially by a plurality of outer resistive shields that successively increase in resistivity.

17. The lead of claim 11, wherein the conductor wire is the only conductor wire that extends along the length of the lead.

18. The lead of claim 11, wherein the conductor wire continuously increases in resistivity from the center portion of the conductor wire to an outer surface of the conductor wire.

19. The lead of claim 11, wherein an outer surface of the conductor wire defines an outer surface of the lead.

20. The lead of claim 11, wherein the conductor wire is configured to attenuate RF energy from an MRI scan by the increasing resistivity across the width of the conductor wire inhibiting alternating currents from being transmitted to the center portion of the conductor wire and to the electrode on the distal portion of the lead.