Laminated electronic card assembly
First Claim
1. An electronic card assembly, comprising:
- a top and a bottom graphic layer, a top and a bottom thermal sensitive adhesion tape and an inlay assembly laminated together, said inlay assembly having an inlay assembly top surface and an inlay assembly bottom surface, the top thermal sensitive adhesion tape being located between the top graphic layer and the inlay assembly top surface, the bottom thermal sensitive adhesion tape being located between the bottom graphic layer and the inlay assembly bottom surface;
wherein the inlay assembly is comprised of;
an inlay sub-assembly comprising a printed circuit board (“
PCB”
) assembly having a PCB base and one or more electronic components mounted to the PCB base, an inlay sub-assembly thermal sensitive adhesion tape and a stiffening substrate laminated together, said inlay sub-assembly thermal sensitive adhesion tape being located between the PCB base and the stiffening substrate;
a battery mounted to the inlay sub-assembly in a battery opening of the stiffening substrate on top of the inlay sub-assembly thermal sensitive adhesion tape and in electrical connection with the PCB base; and
a battery insert mounted in the battery cavity on top of the inlay sub-assembly thermal sensitive adhesion tape between the battery and the stiffening substrate;
wherein the stiffening substrate has a thermal coefficient that is substantially the same as that of the PCB base; and
wherein the battery insert has a greater bending flexibility than the stiffening substrate.
0 Assignments
0 Petitions
Accused Products
Abstract
An electronic card is assembled from top and bottom graphic layers, top and bottom thermal sensitive adhesion tapes and an inlay assembly laminated together. The inlay assembly is made of a sub-assembly of a PCB base with one or more electronic components mounted to it, thermal sensitive adhesion tape and a stiffening substrate, all laminated together, while a battery insert and possible additional inserts made of PVC are mounted in openings in the sub-assembly around electronic components such as the battery. The stiffening substrate has a thermal coefficient substantially the same as that of the PCB base. The card need not contain any solder connections and is ISO 7810 compliant. Lamination is performed at a warm, not hot, temperature that does not damage the battery or melt any components together.
238 Citations
20 Claims
-
1. An electronic card assembly, comprising:
-
a top and a bottom graphic layer, a top and a bottom thermal sensitive adhesion tape and an inlay assembly laminated together, said inlay assembly having an inlay assembly top surface and an inlay assembly bottom surface, the top thermal sensitive adhesion tape being located between the top graphic layer and the inlay assembly top surface, the bottom thermal sensitive adhesion tape being located between the bottom graphic layer and the inlay assembly bottom surface; wherein the inlay assembly is comprised of; an inlay sub-assembly comprising a printed circuit board (“
PCB”
) assembly having a PCB base and one or more electronic components mounted to the PCB base, an inlay sub-assembly thermal sensitive adhesion tape and a stiffening substrate laminated together, said inlay sub-assembly thermal sensitive adhesion tape being located between the PCB base and the stiffening substrate;a battery mounted to the inlay sub-assembly in a battery opening of the stiffening substrate on top of the inlay sub-assembly thermal sensitive adhesion tape and in electrical connection with the PCB base; and a battery insert mounted in the battery cavity on top of the inlay sub-assembly thermal sensitive adhesion tape between the battery and the stiffening substrate; wherein the stiffening substrate has a thermal coefficient that is substantially the same as that of the PCB base; and wherein the battery insert has a greater bending flexibility than the stiffening substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
-
-
10. An electronic card assembly, comprising:
-
a top and a bottom graphic layer, a top and a bottom thermal sensitive adhesion tape and an inlay assembly laminated together, said inlay assembly having an inlay assembly top surface and an inlay assembly bottom surface, the top thermal sensitive adhesion tape being located between the top graphic layer and the inlay assembly top surface, the bottom thermal sensitive adhesion tape being located between the bottom graphic layer and the inlay assembly bottom surface; wherein the inlay assembly is comprised of; an inlay sub-assembly comprising a printed circuit board (“
PCB”
) assembly having a PCB base and one or more electronic components surface mounted to the PCB base, an inlay sub-assembly thermal sensitive adhesion tape and a stiffening substrate laminated together, said inlay sub-assembly thermal sensitive adhesion tape being located between the PCB base and the stiffening substrate;a battery mounted to the inlay sub-assembly in a battery opening of the stiffening substrate on top of the inlay sub-assembly thermal sensitive adhesion tape and in electrical connection with the PCB base; a battery insert mounted in the battery cavity on top of the inlay sub-assembly thermal sensitive adhesion tape between the battery and the stiffening substrate; and an electronic component insert mounted in an electronic component cavity in the stiffening substrate on top of the inlay sub-assembly thermal sensitive adhesion tape between a first of the one or more electronic components and the stiffening substrate; wherein the stiffening substrate has a thermal coefficient that is substantially the same as that of the PCB base; wherein the battery insert and electronic component insert are comprised of a polyvinyl chloride (“
PVC”
) material; andwherein the card is ISO 7810 compliant. - View Dependent Claims (11)
-
-
12. A process for manufacturing an electronic card assembly, comprising:
-
laminating an inlay sub-assembly thermal sensitive adhesion tape and a stiffening substrate together with a printed circuit board (“
PCB”
) assembly comprised of one or more electronic components mounted to a PCB base in a first lamination step to form an inlay sub-assembly in which the inlay sub-assembly thermal sensitive adhesion tape is located between the PCB base and the stiffening substrate;mounting a battery on top of the inlay sub-assembly thermal sensitive adhesion tape in a battery opening of the stiffening substrate; inserting a battery insert in the battery opening between the stiffening substrate and the battery to form an inlay assembly; and laminating a top and a bottom graphic layer and a top and a bottom thermal sensitive adhesion tape to the inlay assembly in a second lamination step to form the card assembly, said inlay assembly having an inlay assembly top surface and an inlay assembly bottom surface, the top thermal sensitive adhesion tape being located between the top graphic layer and the inlay assembly top surface, the bottom thermal sensitive adhesion tape being located between the bottom graphic layer and the inlay assembly bottom surface; wherein the stiffening has a thermal coefficient that is substantially the same as that of the PCB base. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
-
Specification