Method for fixing an electronic component on a printed circuit board and system comprising a printed circuit board and at least one electronic component
First Claim
1. A process for attaching an electronic component on a circuit board or contacting the electronic component with the circuit board, comprising the steps of:
- providing the circuit board with a plurality of contact or connection surfaces;
providing the electronic component with a number of contact or connection sites corresponding to the plurality of contact or connection surfaces of the circuit board, at mutual distances reduced relative to the distances of the contact or connection surfaces of the circuit board; and
forming between the contact or connection surfaces of the circuit board and the contact or connection sites of the electronic component at least one intermediate layer for disentangling the contact or connection sites of the electronic component;
wherein, after the structuring of the intermediate layer, an additional support layer for the attachment or contacting of the electronic component is applied on the intermediate layer for disentanglement and provided with contacts for the electronic component;
wherein the additional support layer covers both the intermediate layer and portions of the circuit board;
wherein the intermediate layer is merely formed in the region of the contact or connection surfaces of the circuit board as well as the contact or connection sites of the electronic component; and
wherein the intermediate layer is created as a part of a substrate of the circuit board by adding a layer to the circuit board.
1 Assignment
0 Petitions
Accused Products
Abstract
A method for fixing an electronic component on a printed circuit board, and contact-connecting the electronic component to the printed circuit board, the following steps are provided:—providing the printed circuit board having a plurality of contact and connection pads,—providing the electronic component having a number of contact and connection locations corresponding to the plurality of contact and connection pads, with a mutual spacing reduced in comparison with the spacing of the contact and connection pads, and—arranging or forming at least one interlayer for routing the contact and connection locations of the electronic component between the contact and connection pads and the contact and connection locations of the electronic component. A method for producing an interlayer for routing and a system having a printed circuit board and an electronic component using the interlayer for routing are also provided.
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Citations
21 Claims
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1. A process for attaching an electronic component on a circuit board or contacting the electronic component with the circuit board, comprising the steps of:
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providing the circuit board with a plurality of contact or connection surfaces; providing the electronic component with a number of contact or connection sites corresponding to the plurality of contact or connection surfaces of the circuit board, at mutual distances reduced relative to the distances of the contact or connection surfaces of the circuit board; and forming between the contact or connection surfaces of the circuit board and the contact or connection sites of the electronic component at least one intermediate layer for disentangling the contact or connection sites of the electronic component; wherein, after the structuring of the intermediate layer, an additional support layer for the attachment or contacting of the electronic component is applied on the intermediate layer for disentanglement and provided with contacts for the electronic component; wherein the additional support layer covers both the intermediate layer and portions of the circuit board; wherein the intermediate layer is merely formed in the region of the contact or connection surfaces of the circuit board as well as the contact or connection sites of the electronic component; and wherein the intermediate layer is created as a part of a substrate of the circuit board by adding a layer to the circuit board. - View Dependent Claims (2, 3, 4, 5)
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6. A process for producing an intermediate layer for disentangling contact or connection sites of an electronic component from contact or connection surfaces of a circuit board, comprising the steps of:
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providing the circuit board with a plurality of contact or connection surfaces; forming a base material of the intermediate layer merely in the region of the contact or connection surfaces of the circuit board; structuring the intermediate layer to form conductive tracks or structures and contact sites for contacting with contact or connection surfaces of the circuit board and with contact or connection sites of an electronic component to be attached on the circuit board; wherein, after the structuring of the intermediate layer, an additional support layer for the attachment or contacting of the electronic component is applied on the intermediate layer for disentanglement and provided with contacts for the electronic component; wherein the additional support layer covers both the intermediate layer and portions of the circuit board; and wherein the intermediate layer is created as a part of a substrate of the circuit board by adding a layer to the circuit board. - View Dependent Claims (7, 8, 9, 10, 11, 19)
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12. A system including a circuit board and at least one electronic component, wherein at least one intermediate layer for the disentanglement of contact or connection sites of the electronic component from contact or connection surfaces of the circuit board is formed between the contact or connection sites of the electronic component and the contact or connection surfaces of the circuit board, and that the contact or connection sites of the electronic component comprise mutual distances reduced relative to the contact or connection sites of the circuit board;
- wherein an additional support layer for the attachment and contacting of the electronic component is applied on the intermediate layer for disentanglement and provided with contacts for the electronic component;
wherein the intermediate layer is merely formed in the region of the contact or connection surfaces of the circuit board as well as the contact or connection sites of the electronic component;
wherein the additional support layer covers both the intermediate layer and portions of the circuit board; and
wherein the intermediate layer is created as part of a substrate of the circuit board by adding a layer to the circuit board. - View Dependent Claims (13, 14, 15, 16, 17, 18, 20, 21)
- wherein an additional support layer for the attachment and contacting of the electronic component is applied on the intermediate layer for disentanglement and provided with contacts for the electronic component;
Specification