Vertically mounted multi-hybrid module and heat sink

• US 8,542,490 B2
• Filed: 06/16/2011
• Issued: 09/24/2013
• Est. Priority Date: 06/16/2011
• Status: Active Grant

• Current Assignee: Hamilton Sundstrand Corporation (Raytheon Technologies Corporation d/b/a RTX)
• Original Assignee: Hamilton Sundstrand Corporation (Raytheon Technologies Corporation d/b/a RTX)
• Inventors: Kokas, Jay W., Roy, Kevin P., Schwartz, Judy, Maynard, Michael, Pennell, John D., Fitzpatrick, Matthew S., Speziale, Richard M.
• Primary Examiner(s): Datskovskiy, Michail V
• Application Number:
  US13/161,842
• Publication Number:
  US 20120320530A1
• Time in Patent Office: 831 Days
• Field of Search: 361/679.46, 361/679.54, 361704-712, 361/715, 361/719, 361721-724, 361/736, 361/737, 361/749, 361/760, 361/785, 361/788, 361/796, 165/80.3, 165/104.33, 165/185, 174/16.3, 174/50, 174/51, 174/54, 174/520, 174/252, 257/713, 257/718, 312/223.2, 312/223.3, 312/236
• US Class Current: 361/715
• CPC Class Codes: H05K 7/20545 Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards

Abstract

A multi-hybrid module includes a plurality of hybrid assemblies that are perpendicularly mounted with respect to a plane of a circuit board. The hybrid assemblies are mounted on opposing sides of a heat sink. The heat sink has a first column disposed at a first end, a second column disposed at a second opposing end, and a generally flat center wall extending between the first column and the second column to which the hybrid assemblies are mounted. During operation the hybrid assemblies are mounted on edge perpendicular with respect to the circuit board to minimize an area profile of the multi-hybrid module on the circuit board.

Claims

1. An electronic assembly comprising:

a first electronic hybrid assembly, wherein the first electronic hybrid assembly includes a first outer cover;

a second electronic hybrid assembly, wherein the second electronic hybrid assembly includes a second outer cover; and

a heat sink having a center wall, the first hybrid assembly and the second hybrid assembly mounted on opposing sides of the center wall from one another and extending away from the heat sink.

2. The electronic assembly of claim 1, wherein the heat sink includes a first column disposed at a first end of the heat sink, a second column disposed at a second opposing end of the heat sink with the center wall extending between the first column and the second column.

3. The electronic assembly of claim 2, wherein the first hybrid assembly and the second hybrid assembly are affixed to either side of the center wall of the heat sink between the first column and the second column.

4. The electronic assembly of claim 2, wherein the first column and second column have threaded holes to receive a fastener that connects the electronic assembly to a circuit board.

5. The electronic assembly of claim 4, wherein the heat sink is mounted on the circuit board so as to extend generally perpendicular with respect to a plane of the circuit board, and wherein the first hybrid assembly and the second hybrid assembly are mounted on the heat sink so as to be edge mounted with respect to the circuit board.

6. The electronic assembly of claim 1, wherein:

a first substrate is contained within the first hybrid assembly and connected the heat sink; and

a second substrate is contained within the second hybrid assembly and connected to the heat sink;

wherein the first hybrid assembly houses at least one electronic component mounted to the first substrate and the second hybrid assembly houses at least one electronic component mounted to the second substrate.

7. The electronic assembly of claim 6, further comprising a plurality of compliant lead terminations disposed around a bottom portion of the first substrate and second substrate, the lead terminations having multiple bends which allow the lead terminations to contact and be co-planar with a surface of a circuit board to which the electronic assembly is mounted.

8. An assembly comprising:

a first hybrid assembly;

a second hybrid assembly; and

a heat sink fastened to a first circuit board and extending generally perpendicular with respect to a plane of the first circuit board, and wherein the first hybrid assembly and the second hybrid assembly are mounted on either side of the heat sink so as to be disposed generally perpendicularly with respect to the plane of the first circuit board,

wherein the first hybrid assembly and the second hybrid assembly extend generally vertically between the first circuit board and a second circuit board, and wherein the heat sink has a center wall disposed between the first hybrid assembly and the second hybrid assembly.

9. The assembly of claim 8, wherein the heat sink includes a first column disposed at a first end of the heat sink, a second column disposed at a second opposing end of the heat sink, and the center wall extends between the first column and the second column, together the first column and second column form a pocket in which the first hybrid assembly and the second hybrid assembly are mounted to the center wall.

10. The assembly of claim 9, wherein the first column and second column have threaded holes to receive a fastener that connects the electronic assembly to a circuit board.

11. The assembly of claim 9, wherein the first hybrid assembly and the second hybrid assembly are affixed to either side of the center wall of the heat sink between the first column and the second column and contact the circuit board via lead terminations.

12. The assembly of claim 8, wherein the first hybrid assembly and the second hybrid assembly includes:

a first substrate mounted to the heat sink, a first outer cover of the first hybrid assembly covering the first substrate; and

a second substrate mounted to the heat sink, a second outer cover of the second hybrid assembly covering the second substrate;

wherein the first hybrid assembly houses at least one electronic component mounted to the first substrate and the second hybrid assembly houses at least one electronic component mounted to the second substrate.

13. The assembly of claim 12, further comprising a plurality of compliant lead terminations disposed around a bottom portion of the first substrate and second substrate, the lead terminations having multiple bends which allow the lead terminations to contact and be co-planar with a surface of the circuit board.

14. The assembly of claim 8, further comprising:

an electronic box housing the electronic assembly and the circuit board, the electronic box additionally housing a plurality of circuit boards with one or more electronic assemblies mounted thereto.

15. A heat sink for an electronic assembly comprising:

a first column, the first column having a substantially cylindrical shape;

a second column disposed at a second opposing end from the first column, the second column having a substantially cylindrical shape; and

a generally flat center wall extending between the first column and the second column.

16. The heat sink of claim 15, wherein first column and second column have threaded holes to receive a fastener that connects the heat sink to a circuit board.

17. The heat sink of claim 16, further comprising a first hybrid assembly and a second hybrid assembly that are affixed to either side of the center wall of the heat sink between the first column and the second column.

18. The heat sink of claim 17, wherein the heat sink is mounted on a circuit board so as to extend generally perpendicular to a plane of the circuit board, and wherein the heat sink has a center wall disposed between the first hybrid assembly and the second hybrid assembly.

19. The heat sink of claim 17, wherein the first hybrid assembly and the second hybrid assembly includes:

a first substrate mounted to the heat sink and disposed under the first hybrid assembly;

a second substrate mounted to the heat sink and disposed under the second hybrid assembly; and

wherein the first hybrid assembly houses at least one electronic component mounted to the first substrate and the second hybrid assembly houses at least one electronic component mounted to the second substrate.