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Scalable up and down nesting integrated electronic enclosures with form factors including asteroids and/or dumbbells and/or approximated tessellation(s)/tiling(s) or combinations thereof with thermal management, wiring, sliding fit, manual and/or automated full range vertical to horizontal positioning, access and structural systems for individual modules and intra-and inter-planar stacks, columns, rows, arrays and associated infrastructures

  • US 8,542,492 B2
  • Filed: 12/10/2009
  • Issued: 09/24/2013
  • Est. Priority Date: 12/10/2009
  • Status: Expired
First Claim
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1. A modular enclosure system based on the approximated tessellation(s)/tiling(s) of standard shapes including the triangle, square, hexagon, octagon and dodecagon, for routing and re-routing of data, fail over, feedback, command and control of computers, bus based systems, networks, machinery and machine farms, process control with or without feedback and signaling/signal conditioning to include with appropriate hardware and software comprising:

  • nesting enclosure(s) with inter-module side wall bulkhead to sidewall bulkhead and end cap basket to end cap cover sliding fit,optional integrated manual module positioning cable gripper actuator assembly,master cooling/wiring plenum stack support system for deploying enclosures,hot swap based wiring system,external inter-module signal/signal conditioning/interconnect systemcard cage,integrated thermal management system,structural integrity/assembly system,explosion proofing system,structural building system,upholstery system,automated/manual enclosure/module stack and array physical support, deployment, mobilization and work room generation system,hydraulic positioning system.

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