Systems, methods, and devices for sealing LED light sources in a light module

• US 8,545,049 B2
• Filed: 11/24/2010
• Issued: 10/01/2013
• Est. Priority Date: 11/25/2009
• Status: Active Grant

• Current Assignee: Signify Holding B.V. (Signify N.V.)
• Original Assignee: Cooper Technologies Company (Eaton Corporation PLC.)
• Inventors: Davis, Matthew A., Bradford, Reed Alan, Patrick, Ellis
• Primary Examiner(s): BRUCE, DAVID VERNON
• Application Number:
  US12/954,074
• Publication Number:
  US 20110157891A1
• Time in Patent Office: 1,042 Days
• Field of Search: 362/218, 362/217.02, 362/237, 362/244, 362/249.02
• US Class Current: 362/244
• CPC Class Codes: B29C 45/14467 Joining articles or parts of a single article B29C45/14377, B29C45/14385, B29C45/14581, B29C45/14614 and B29C45/006 take precedence
• CPC Class Codes: B29C 45/14639 for obtaining an insulating effect, e.g. for electrical components
• CPC Class Codes: B29C 65/48 using adhesives , i.e. using supplementary joining material; solvent bonding
• CPC Class Codes: B29C 65/483 Reactive adhesives, e.g. chemically curing adhesives
• CPC Class Codes: B29C 66/45 Joining of substantially the whole surface of the articles methods or apparatus for laminating B32B37/00
• CPC Class Codes: B29C 66/474 said single elements being substantially non-flat
• CPC Class Codes: F21K 9/90 Methods of manufacture
• CPC Class Codes: F21S 2/005 of modular construction
• CPC Class Codes: F21S 4/28 rigid, e.g. LED bars
• CPC Class Codes: F21V 17/101 permanently, e.g. welding, gluing or riveting
• CPC Class Codes: F21V 31/03 with provision for venting for vehicle head lights F21S45/33; for vehicle rear lights F21S41/192
• CPC Class Codes: F21V 5/04 of lens shape
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2105/16 square or rectangular, e.g. for light panels
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H05K 3/30 Assembling printed circuits with electric components, e.g. with resistor
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

A light module includes one or more LEDs coupled to a circuit board, a lens disposed over at least one LED, and an adhesive layer disposed between each LED and the lens. A flange extends from at least one side of the lens. The adhesive layer fixes the lens in an optical alignment over the corresponding LED. The adhesive layer includes at least one of a non-permeable layer with an adhesive material on the top and bottom surfaces, a gas-permeable layer with an adhesive material on the top and bottom surfaces, a deposited material, and an over mold material. An alignment tool including one or more optical recesses and one or more alignment features is used in the assembly of at least one of an optical assembly and a light module that includes the optical assembly. The alignment tool facilitates precise alignment of the lenses over the LEDs.

Claims

1. A light module, comprising:

a plurality of light emitting diodes (LEDs) coupled to a circuit board;

at least one lens, each lens disposed over at least one LED of the plurality of LEDs, wherein the lens includes a flange extending from at least one side of the lens; and

an adhesive layer between the circuit board and the lens, wherein the adhesive layer fixes the lens in an optical alignment over the corresponding LED, and wherein the adhesive layer comprises a gas-permeable layer.

2. The light module of claim 1, wherein the adhesive layer comprises a deposited adhesive material.

3. The light module of claim 2, wherein the adhesive material is silicone.

4. The light module of claim 1, wherein the plurality of LEDs comprise an array of LED die packages.

5. The light module of claim 4, wherein the light module is coupled to a light fixture housing.

6. The light module of claim 1, further comprising a cover, the cover comprising one or more apertures, each aperture allowing at least a portion of the at least one lens to extend therethrough.

7. The light module of claim 1, wherein the adhesive layer comprises:

a first adhesive material disposed on the bottom side; and

a second adhesive material disposed on the top side,

wherein the gas-permeable layer comprises a top side and a bottom side, and is disposed between the circuit board and each lens.

8. The light module of claim 1, wherein the adhesive layer comprises at least one of a silicone adhesive material and an acrylic adhesive material.

9. A light module, comprising:

a plurality of light emitting diodes (LEDs) coupled to a circuit board;

at least one lens, each lens disposed over at least one LED of the plurality of LEDs, wherein the lens includes a flange extending from at least one side of the lens; and

an adhesive layer between the circuit board and the lens, wherein the adhesive layer fixes the lens in an optical alignment over the corresponding LED;

wherein the lens comprises a mirror portion.

10. A light module, comprising:

a plurality of light emitting diodes (LEDs) coupled to a circuit board;

at least one lens, each lens disposed over at least one LED of the plurality of LEDs, wherein the lens includes a flange extending from at least one side of the lens;

an adhesive layer between the circuit board and the lens, wherein the adhesive layer fixes the lens in an optical alignment over the corresponding LED; and

a gap filler, wherein the gap filler is coupled to the adhesive layer and surrounds the flange portion extending from at least one side of the lens.

11. A light module, comprising:

a plurality of light emitting diodes (LEDs) coupled to a circuit board;

at least one lens, each lens disposed over at least one LED of the plurality of LEDs, wherein the lens includes a flange extending from at least one side of the lens; and

an adhesive layer between the circuit board and the lens, wherein the adhesive layer fixes the lens in an optical alignment over the corresponding LED;

wherein the adhesive layer comprises;

a tape layer comprising a top side and a bottom side, the tape layer disposed between the circuit board and each lens;

a first adhesive material disposed on the bottom side; and

a second adhesive material disposed on the top side.

12. The light module of claim 11, wherein the tape layer further comprises a first portion and a second portion, the second portion extending longitudinally along a generally central portion of the light module, the first portion disposed along each longitudinal side of the second portion and along each longitudinal edge of the light module, the first portion being more gas-permeable than the second portion.

13. The light module of claim 11, wherein the adhesive layer further comprises:

a second layer between each LED and lens; and

a third adhesive material disposed above the second layer,

wherein the tape layer further comprises;

a plurality of first openings, each first opening configured to be disposed around at least a portion of one of the LEDs; and

a plurality of first apertures, each first aperture in fluid communication with one of the first openings and extending outside of a footprint of the lens disposed over the associated first opening;

wherein the second layer further comprises;

a plurality of second openings, each second opening configured to be disposed around at least a portion of one of the LEDs and substantially vertically aligned with one of the plurality of first openings; and

a plurality of third openings, each third opening vertically aligned with and in fluid communication with at least one of the first apertures;

wherein the first adhesive material is disposed between the tape layer and the circuit board, and adheres the tape layer to the circuit board; and

wherein the second adhesive material is disposed between the tape layer and the second layer, and adheres the tape layer to the second layer.

14. A method of manufacturing a light module, comprising:

providing a plurality of light emitting diode (LED) die packages coupled to a circuit board, wherein the LED die package comprises an LED and a primary lens;

providing at least one secondary lens, each secondary lens disposed over at least one LED of the plurality of LEDs, wherein the secondary lens includes a flange extending from at least one side of the secondary lens;

providing an adhesive layer between the circuit board and the secondary lens, wherein the adhesive layer fixes the secondary lens in an optical alignment over the LED die package.

15. The method of claim 14, wherein the adhesive layer comprises a gas-permeable layer.

16. A light module, comprising:

a plurality of light emitting diodes (LEDs) coupled to a circuit board;

at least one lens, each lens disposed over at least one LED of the plurality of LEDs, wherein the lens includes a flange extending from at least one side of the lens; and

a gas-permeable layer disposed between the circuit board and each lens, wherein the gas-permeable layer further comprises a top side and a bottom side, the bottom side comprising a first adhesive material and the top side comprising a second adhesive material;

wherein the first adhesive material on the bottom side adheres the gas-permeable layer to the circuit board and the second adhesive material on the top side fixes the lens in an optical alignment over the corresponding LED.

17. The light module of claim 16, wherein the gas-permeable layer comprises silicone.

18. The light module of claim 16, wherein the first adhesive material and the second adhesive material are the same.

19. The light module of claim 16, further comprising a gap filler disposed adjacent at least a portion of the flange extending from at least one side of the lens and adhered to the second adhesive material on the top side of the gas-permeable layer.

20. The light module of claim 19, wherein the gap filler is high density polyethylene film.

21. The light module of claim 19, wherein the gap filler is gas-permeable.

22. The light module of claim 16, wherein the gas-permeable layer comprises a deposited adhesive silicone material.

23. The light module of claim 16, wherein the plurality of LEDs comprise an array of LED die packages.

24. The light module of claim 16, wherein the light module is coupled to a light fixture housing.

25. The light module of claim 16, further comprising a cover, the cover comprising one or more apertures, each aperture allowing at least a portion of one or more lenses to extend therethrough.

26. The light module of claim 16, wherein at least one of the first adhesive material and the second adhesive material comprises at least one of a silicone adhesive material and an acrylic adhesive material.

27. A light module, comprising:

a plurality of light emitting diodes (LEDs) coupled to a circuit board;

at least one lens, each lens disposed over at least one LED of the plurality of LEDs, wherein the lens includes a flange extending from at least one side of the lens; and

a tape layer disposed between the circuit board and each lens, wherein the tape layer further comprises a top side and a bottom side, the bottom side comprising a first adhesive material and the top side comprising a second adhesive material;

wherein the first adhesive adheres the tape layer to the circuit board.

28. The light module of claim 27, wherein the tape layer comprises a first portion and a second portion, wherein the first portion is more gas-permeable than the second portion.

29. The light module of claim 28, wherein the second portion extends longitudinally along a generally central portion of the light module and wherein the first portion is disposed along each longitudinal side of the second portion and along each longitudinal edge of the light module.

30. The light module of claim 28, wherein the first portion comprises gas-permeable tape.

31. The light module of claim 30, wherein the first portion comprises TESA tape.

32. The light module of claim 28, wherein the first portion comprises non-woven fabric tape.

33. The light module of claim 28, wherein the second portion comprises glass fiber tape.

34. The light module of claim 27, further comprising a gap filler disposed adjacent at least a portion of the flange extending from at least one side of the lens and adhered to the second adhesive material on the top side of the tape layer.

35. The light module of claim 34, wherein the gap filler comprises high density polyethylene film.

36. The light module of claim 34, wherein the gap filler is gas-permeable.

37. The light module of claim 27, wherein at least one of the first adhesive material and the second adhesive material comprises at least one of a silicone adhesive material and an acrylic adhesive material.

38. The light module of claim 37, wherein the second adhesive material comprises a deposited adhesive silicone material.

39. The light module of claim 27, wherein the tape layer comprises non-woven fabric tape.

40. The light module of claim 27, wherein the tape layer comprises gas-permeable tape.

41. The light module of claim 40, wherein the gas-permeable tape comprises TESA tape.

42. A light module, comprising:

a circuit board comprising a top surface;

a plurality of light emitting diodes (LEDs) coupled to the circuit board;

at least one lens, each lens disposed over at least one LED of the plurality of LEDs, wherein the lens comprises a lens cavity;

an adhesive layer disposed between the circuit board and each lens, wherein the adhesive layer comprises a plurality of first openings, each first opening configured to be disposed substantially around at least a portion of one of the LEDs; and

at least one air channel formed substantially along the top surface of the circuit board, the air channels extending from at least one lens cavity to an edge of the light module, the air channels providing fluid communication between at least one lens cavity and an outside environment located exterior to the light module.

43. The light module of claim 42, wherein one or more air channels are etched into the circuit board.

44. The light module of claim 42, further comprising a conformal coating applied to a portion of the top surface of the circuit board, wherein the application of the coating to only a portion of the circuit board creates at least one of the air channels on the top surface of the circuit board.

45. The light module of claim 42, wherein at least one of the air channels is formed in the adhesive layer and extends from at least one of the first openings to an edge of the adhesive layer.