Semiconductor device
First Claim
1. A semiconductor device comprising:
- an oxide semiconductor layer;
an insulating layer in contact with the oxide semiconductor layer;
an electrode in contact with the oxide semiconductor layer and the insulating layer;
a gate electrode overlapping with the oxide semiconductor layer; and
a gate insulating layer between the oxide semiconductor layer and the gate electrode,wherein the oxide semiconductor layer is in direct contact with the electrode only at a side surface of the oxide semiconductor layer, andwherein the insulating layer is provided between the oxide semiconductor layer and the electrode.
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Accused Products
Abstract
An object is to provide a semiconductor device including an oxide semiconductor in which miniaturization is achieved while favorable characteristics are maintained. The semiconductor includes an oxide semiconductor layer, a source electrode and a drain electrode in contact with the oxide semiconductor layer, a gate electrode overlapping with the oxide semiconductor layer, a gate insulating layer provided between the oxide semiconductor layer and the gate electrode, and an insulating layer provided in contact with the oxide semiconductor layer. A side surface of the oxide semiconductor layer is in contact with the source electrode or the drain electrode. An upper surface of the oxide semiconductor layer overlaps with the source electrode or the drain electrode with the insulating layer interposed between the oxide semiconductor layer and the source electrode or the drain electrode.
144 Citations
22 Claims
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1. A semiconductor device comprising:
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an oxide semiconductor layer; an insulating layer in contact with the oxide semiconductor layer; an electrode in contact with the oxide semiconductor layer and the insulating layer; a gate electrode overlapping with the oxide semiconductor layer; and a gate insulating layer between the oxide semiconductor layer and the gate electrode, wherein the oxide semiconductor layer is in direct contact with the electrode only at a side surface of the oxide semiconductor layer, and wherein the insulating layer is provided between the oxide semiconductor layer and the electrode. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A semiconductor device comprising:
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a gate electrode over a substrate; a gate insulating layer over the gate electrode; an oxide semiconductor layer over the gate insulating layer; an insulating layer in contact with the oxide semiconductor layer; and an over the insulating layer and the gate insulating layer, wherein the oxide semiconductor layer is in direct contact with the electrode only at a side surface of the oxide semiconductor layer. - View Dependent Claims (9, 10, 11, 12)
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13. A semiconductor device comprising:
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an oxide semiconductor layer over a substrate; an insulating layer in contact with the oxide semiconductor layer; an electrode over the substrate and the insulating layer; a gate insulating layer over the insulating layer and the electrode; and a gate electrode over the gate insulating layer, wherein the oxide semiconductor layer is in direct contact with the electrode only at a side surface of the oxide semiconductor layer. - View Dependent Claims (14, 15, 16, 17)
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18. A semiconductor device comprising:
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a gate electrode over a substrate; a gate insulating layer over the gate electrode; an electrode over the gate insulating layer, the electrode comprising a first conductive layer and a second conductive layer having higher resistance than the first conductive layer; an oxide semiconductor layer which overlaps with the gate electrode; and an insulating layer between the first conductive layer and the oxide semiconductor layer, and wherein the oxide semiconductor layer is in direct contact with the second conductive layer only at a side surface of the oxide semiconductor layer. - View Dependent Claims (19, 20, 21, 22)
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Specification