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Stacked package including spacers and method of manufacturing the same

  • US 8,546,938 B2
  • Filed: 12/06/2011
  • Issued: 10/01/2013
  • Est. Priority Date: 02/15/2011
  • Status: Active Grant
First Claim
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1. A stacked package comprising:

  • a first semiconductor package;

    a second semiconductor package stacked on the first semiconductor package;

    a molding member comprising a plurality of plug holes formed therein, each plug hole comprising a plug configured to electrically connect the first semiconductor package with the second semiconductor package; and

    a plurality of spacers formed on an upper surface of the molding member and configured to prevent an electrical short between the plugs, the spacers interposed between the first semiconductor package and the second semiconductor package and supporting the second semiconductor package to form a gap between the first semiconductor package and the second semiconductor package.

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