Method for making internally overlapped conditioners

• US 8,547,677 B2
• Filed: 07/04/2011
• Issued: 10/01/2013
• Est. Priority Date: 03/01/2005
• Status: Expired due to Fees

• Current Assignee: X2Y Attenuators, LLC
• Original Assignee: X2Y Attenuators, LLC
• Inventors: Anthony, William M., Anthony, David, Anthony, Anthony
• Primary Examiner(s): Jackson, Stephen W
• Application Number:
  US13/175,918
• Publication Number:
  US 20120000045A1
• Time in Patent Office: 820 Days
• Field of Search: 361/118
• US Class Current: 361/118
• CPC Class Codes: H01G 4/005 Electrodes
• CPC Class Codes: H01G 4/232 electrically connecting two or more layers of a stacked or rolled capacitor
• CPC Class Codes: H01G 4/30 Stacked capacitors H01G4/33 takes precedence
• CPC Class Codes: H01G 4/35 Feed-through capacitors or anti-noise capacitors
• CPC Class Codes: H05K 1/0231 Capacitors or dielectric substances
• CPC Class Codes: H05K 1/113 Via provided in pad; Pad over filled via
• CPC Class Codes: H05K 1/114 Pad being close to via, but not surrounding the via
• CPC Class Codes: H05K 2201/0979 Redundant conductors or connections, i.e. more than one current path between two points
• CPC Class Codes: H05K 2201/10636 Leadless chip, e.g. chip capacitor or resistor
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/43 Electric condenser making
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

The application discloses novel internal structures of energy conditioners, assemblies of external structures of energy conditioners and mounting structure, and novel circuits including energy conditioners having A, B, and G master electrodes.

Claims

1. A method for making an energy conditioning structure with stacked, overlapping conductive layers, said method comprising:

providing a plurality of dielectric layers;

providing a plurality of conductive material layers;

placing a first conductive material layer of said plurality of conductive material layers upon a first dielectric layer of said plurality of dielectric layers;

positioning a first electrode of said first conductive material layer in a first position upon said first dielectric layer such that a first electrode main body portion of said first conductive material layer does not extend to any one of a left side surface edge, a right side surface edge, an upper side surface edge, and a lower side surface edge of a first dielectric surface of said first dielectric layer and also that a first electrode tab of said first conductive material layer extends to at least a portion of said left side surface edge of said first dielectric layer but does not extend to said right side surface edge of said first dielectric layer;

positioning a second electrode of said first conductive material layer in a second position upon said first dielectric layer such that a second electrode main body portion of said first conductive material layer does not extend to any one of said left side surface edge, said right side surface edge, said upper side surface edge, and said lower side surface edge of said first dielectric surface of said first dielectric layer and also that a second electrode tab of said first conductive material layer extends to at least a portion of said right side surface edge of said first dielectric layer but does not extend to said left side surface edge of said first dielectric layer;

electrically isolating said first electrode of said first conductive material layer from said second electrode of said first conductive material layer;

placing a second conductive material layer of said plurality of conductive material layers upon a second dielectric layer of said plurality of dielectric layers;

positioning upon said second dielectric layer a single electrode that is contained in said second conductive material layer and contains at least two electrode tabs;

placing a third conductive material layer of said plurality of conductive material layers upon a third dielectric layer of said plurality of dielectric layers;

positioning a first electrode of said third conductive material layer in a first position upon said third dielectric layers such that a first electrode main body portion of said third conductive material layer does not extend to any one of a left side surface edge, a right side surface edge, a upper side surface edge, and a lower side surface edge of a first dielectric surface of said third dielectric layer and also that a first electrode tab of said third conductive material layer extends to at least a portion of said left side surface edge of said third dielectric layer but does not extend to said right side surface edge of said third dielectric layer;

positioning a second electrode of said third conductive material layer in a second position upon said third dielectric layer such that a second electrode main body portion of said third conductive material layer does not extend to any one of said left side surface edge, said right side surface edge, said upper side surface edge, and said lower side surface edge of said first dielectric surface of said third dielectric layer and also that a second electrode tab of said third conductive material layers extends to at least a portion of said right side surface edge of said third dielectric layer but does not extend to said left side surface edge of said third dielectric layer;

positioning a second electrode of said third conductive material layer in a second position upon said dielectric layer;

electrically isolating said first electrode of said third conductive material layer from said second electrode of said third conductive material layer;

electrically isolating said single electrode of said second conductive material layer from said first and second electrodes of said first conductive material layer;

electrically isolating said single electrode of said second conductive material layer from said first and second electrodes of said third conductive material layer;

stacking said second dielectric layer upon said first conductive material layer of said plurality of conductive material layers and a portion of said first surface of said first dielectric layer;

stacking said third dielectric layer upon said second conductive material layer of said plurality of conductive material layers and a portion of said first surface of said second dielectric layer;

stacking a fourth dielectric layer of said plurality of dielectric layers upon said third conductive material layer of said plurality of conductive material layers and a portion of said first surface of said third dielectric layer;

stacking said second dielectric layer upon said first dielectric layer, stacking said third dielectric layer upon said second dielectric layer, and stacking said fourth dielectric layer upon said third dielectric layer;

positioning a main body portion of said second electrode to completely shield said first electrode main body portion and said second electrode main body portion of said first conductive material layer from said first electrode main body potion and said second electrode main body portion of said third conductive material layer;

positioning said first electrode tab of said first conductive material layer to overlap said first electrode tab of said third conductive material layer;

positioning said second electrode tab of said first conductive material layer to overlap said second electrode tab of said third conductive material layer;

conductively coupling said first electrode tab of said first conductive material layer to said first electrode tab of said third conductive material layer;

conductively coupling said second electrode tab of said first conductive material layer to said second electrode tab of said third conductive material layer;

aligning said first electrode main body portion of said first conductive material layer to overlap said second electrode main body portion of said third conductive material layer; and

aligning said second electrode main body portion of said first conductive material layer to overlap said first electrode main body portion of said third conductive material layer.