Direct interlayer optical coupler

• US 8,548,287 B2
• Filed: 11/10/2011
• Issued: 10/01/2013
• Est. Priority Date: 11/10/2011
• Status: Active Grant

• Current Assignee: Oracle International Corporation (Oracle Corporation)
• Original Assignee: Oracle International Corporation (Oracle Corporation)
• Inventors: Thacker, Hiren D., Zheng, Xuezhe, Shubin, Ivan, Raj, Kannan, Cunningham, John E., Krishnamoorthy, Ashok V.
• Primary Examiner(s): PAK, SUNG H
• Application Number:
  US13/293,624
• Publication Number:
  US 20130121635A1
• Time in Patent Office: 691 Days
• Field of Search: 385/28
• US Class Current: 385/14
• CPC Class Codes: G02B 6/12002 Three-dimensional structures
• CPC Class Codes: G02B 6/12004 Combinations of two or more optical elements
• CPC Class Codes: G02B 6/1228 Tapered waveguides, e.g. integrated spot-size transformers for coupling with fibres G02B6/305
• CPC Class Codes: G02B 6/26 Optical coupling means G02B6/36, G02B6/42 take precedence
• CPC Class Codes: Y10T 29/49826 Assembling or joining

Abstract

In an MCM, an optical signal is conveyed by an optical waveguide disposed on a surface of a first substrate to an optical coupler having a vertical facet. This optical coupler has an optical mode that is different than the optical mode of the optical waveguide. For example, the spatial extent of the optical mode associated with the optical coupler may be larger, thereby reducing optical losses and sensitivity to alignment errors. Then, the optical signal is directly coupled from the vertical facet to a facing vertical facet of an identical optical coupler on another substrate, and the optical signal is conveyed in another optical waveguide disposed on the other substrate.

Claims

1. A multi-chip module (MCM), comprising:

a first substrate having a first surface, wherein the first substrate includes;

a first optical waveguide disposed on the first surface; and

a first optical coupler, optically coupled to the first optical waveguide, having a first vertical facet, wherein the first optical coupler has a first optical mode that is different than a second optical mode associated with the first optical waveguide; and

a second substrate having a second surface facing the first surface of the first substrate, wherein the second substrate includes;

a second optical waveguide disposed on the second surface; and

a second optical coupler, optically coupled to the second optical waveguide, having a second vertical facet, wherein the second optical coupler has a third optical mode that is different than a fourth optical mode associated with the second optical waveguide;

wherein the second vertical facet is horizontally displaced relative to and faces the first vertical facet, thereby facilitating direct optical coupling of an optical signal from the first vertical facet to the second vertical facet.

2. The MCM of claim 1, wherein the first optical mode has a larger spatial extent than the second optical mode;

and

wherein the third optical mode has a larger spatial extent than the fourth optical mode.

3. The MCM of claim 1, wherein the first vertical facet and the second vertical facet define a cavity;

and

wherein the cavity is filled with air.

4. The MCM of claim 1, wherein the first vertical facet and the second vertical facet define a cavity;

and

wherein the cavity is filled with an index-matching material that has an index of refraction between an index of refraction of the first optical coupler and the second optical coupler and an index of refraction of air.

5. The MCM of claim 1, wherein the first optical coupler includes a taper that expands a cross-sectional area of the first optical waveguide proximate to the first vertical facet;

and

wherein the second optical coupler includes another taper that expands a cross-sectional area of the second optical waveguide proximate to the second vertical facet.

6. The MCM of claim 1, wherein the first substrate includes a first recessed region below the first surface;

wherein the second substrate includes a second recessed region below the second surface; and

wherein the first vertical facet is aligned with the second recessed region and the second vertical facet is aligned with the first recessed region, thereby facilitating vertical alignment of the first vertical facet and the second vertical facet.

7. The MCM of claim 1, wherein the first optical coupler includes a third optical waveguide disposed on the first optical waveguide;

and

wherein the second optical coupler includes a fourth optical waveguide disposed on the second optical waveguide.

8. The MCM of claim 7, wherein the first optical waveguide ends before the cavity and the first vertical facet is associated with the third optical waveguide;

and

wherein the second optical waveguide ends before the cavity and the second vertical facet is associated with the fourth optical waveguide.

9. The MCM of claim 7, wherein the first vertical facet is associated with the first optical waveguide and the third optical waveguide;

and

wherein the second vertical facet is associated with the second optical waveguide and the fourth optical waveguide.

10. The MCM of claim 9, wherein vertical overlap of the first vertical facet and the second vertical facet is associated with the third optical waveguide and the fourth optical waveguide.

11. The MCM of claim 1, wherein the first optical waveguide in the first optical coupler is untapered, and wherein the second optical waveguide in the second optical coupler is untapered.

12. The MCM of claim 1, wherein the first substrate includes first negative features recessed below the first surface;

wherein the second substrate includes second negative features recessed below the second surface; and

wherein the MCM further includes alignment features aligned with and mechanically coupled to pairs of the first negative features and the second negative features, thereby facilitating alignment and maintaining relative positions of the first vertical facet and the second vertical facet.

13. The MCM of claim 1, wherein the first negative features and the second negative features include etch pits.

14. The MCM of claim 1, wherein the alignment features include spherical balls.

15. The MCM of claim 1, wherein at least one of the first negative features and the second negative features includes redundant negative features.

16. The MCM of claim 1, wherein the first substrate and the second substrate include mechanical stops.

17. The MCM of claim 1, wherein a given substrate, which is one of the first substrate and the second substrate, includes:

a buried-oxide layer disposed on the given substrate; and

a semiconductor layer disposed on the buried-oxide layer, wherein a given optical waveguide, which is one of the first optical waveguide and the second optical waveguide, is defined in the semiconductor layer.

18. The MCM of claim 1, wherein a given substrate, which is one of the first substrate and the second substrate, includes a semiconductor.

19. A method for direct optical coupling an optical signal from a first substrate to a second substrate, the method comprising:

transporting the optical signal in a first optical waveguide disposed on a first surface of the first substrate;

optically coupling the optical signal from the first optical waveguide to a first optical coupler having a first vertical facet which is disposed on the first substrate, wherein the first optical coupler has a first optical mode that is different than a second optical mode associated with the first optical waveguide;

direct optical coupling the optical signal from the first vertical facet to a second vertical facet of a second optical coupler disposed on the second substrate, wherein the first vertical facet faces the second vertical facet;

optically coupling the optical signal from the second optical coupler to a second optical waveguide disposed on a second surface of the second substrate, wherein the second surface faces the first surface, and wherein the second optical coupler has a third optical mode that is different than a fourth optical mode associated with the second optical waveguide; and

transporting the optical signal in the second optical waveguide.

20. A method for assembling an MCM, the method comprising:

placing alignment features in first negative features disposed on a first surface of a first substrate; and

mechanically coupling the alignment features to second negative features disposed on a second surface of a second substrate, thereby aligning and maintaining relative positions of a first vertical facet of a first optical coupler on the first substrate and a second vertical facet of a second optical coupler on the second substrate, wherein the first surface faces the second surface; and

wherein the first vertical facet faces the second vertical facet, thereby facilitating direct optical coupling of an optical signal from the first substrate to the second substrate.