Waveguide-based packaging structures and methods for discrete lighting elements

• US 8,550,684 B2
• Filed: 11/26/2008
• Issued: 10/08/2013
• Est. Priority Date: 12/19/2007
• Status: Active Grant

• Current Assignee: Oree Advanced Illumination Solutions Ltd.
• Original Assignee: Oree, Inc.
• Inventors: Meir, Noam, Zimmermann, Micha, Fine, Eran
• Primary Examiner(s): Truong, Bao Q
• Application Number:
  US12/324,544
• Publication Number:
  US 20090290380A1
• Time in Patent Office: 1,777 Days
• Field of Search: 362/631, 362608-610, 362/628, 362/616, 362/615, 362/612, 362/23.07, 362/23.09, 362/23.16, 362/555
• US Class Current: 362/610
• CPC Class Codes: G02B 6/0065 Manufacturing aspects; Material aspects
• CPC Class Codes: G02B 6/0068 Arrangements of plural sources, e.g. multi-colour light sources
• CPC Class Codes: G02B 6/0073 Light emitting diode [LED]
• CPC Class Codes: G02B 6/008 of the partially overlapping type
• CPC Class Codes: G02B 6/0088 of the light guide or other optical sheets in the package

Abstract

In one aspect, an illumination source includes a socket formed by the union of a sub-assembly platform and a light-guide element, and a discrete light source received in the socket. In another aspect, the light-guide element includes a concentration region proximate an in-coupling region opposite an out-coupling region, the concentration region directing multidirectional light from the in-coupling region toward the out-coupling region.

Claims

1. An illumination source comprising:

a socket formed by the union of a sub-assembly platform and a light-guide element;

a discrete light source received in the socket, the discrete light source comprising a bare LED die disposed over and electrically connected to the sub-assembly platform; and

an encapsulation material disposed between and in direct contact with the LED die and the light-guide element,

wherein a portion of the light-guide element disposed above the LED die is substantially planar.

2. The illumination source of claim 1, wherein the light-guide element is disposed over and in direct contact with the sub-assembly platform and functions as at least a portion of a package for the LED die.

3. The illumination source of claim 1, wherein the sub-assembly platform comprises a contour electrical connection.

4. The illumination source of claim 1, wherein the discrete light source is thermally connected to the sub-assembly platform.

5. The illumination source of claim 1, wherein the sub-assembly platform comprises a mechanical interface for connecting the illumination source to a structure.

6. The illumination source of claim 1, wherein the light-guide element comprises spatially distinct in-coupling and out-coupling regions, light injected into the in-coupling region by the discrete light source being substantially retained within the light-guide element for emission from the out-coupling region.

7. The illumination source of claim 1, wherein the discrete light source is top-emitting.

8. The illumination source of claim 1, wherein the discrete light source is a Lambertian source.

9. The illumination source of claim 1, wherein the sub-assembly platform comprises a printed circuit board in direct contact with the LED die.

10. The illumination source of claim 6, wherein the light-guide element comprises a planar concentration region for directing light toward the out-coupling region, a sidewall of the concentration region being substantially parabolic.

11. The illumination source of claim 6, wherein the out-coupling region comprises a plurality of sections each comprising a different density of out-coupling elements.