Method for electromechanical fabrication

• US 8,551,315 B2
• Filed: 04/06/2012
• Issued: 10/08/2013
• Est. Priority Date: 04/04/1997
• Status: Expired due to Fees

• Current Assignee: University of Southern California
• Original Assignee: University of Southern California
• Inventors: Cohen, Adam L.
• Primary Examiner(s): Hendricks, Keith
• Assistant Examiner(s): Sherrill, Stefanie
• Application Number:
  US13/441,573
• Publication Number:
  US 20120228143A1
• Time in Patent Office: 550 Days
• Field of Search: 205/118
• US Class Current: 205/118
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: B81C 1/00126 Static structures not provided for in groups B81C1/00031 - B81C1/00119
• CPC Class Codes: B81C 2201/0181 Physical Vapour Deposition [PVD], i.e. evaporation, sputtering, ion plating or plasma assisted deposition, ion cluster beam technology
• CPC Class Codes: B81C 2201/0197 Processes for making multi-layered devices not provided for in groups B81C2201/0176 - B81C2201/0192
• CPC Class Codes: B81C 2201/032 LIGA process
• CPC Class Codes: C25D 1/00 Electroforming
• CPC Class Codes: C25D 1/003 3D structures, e.g. superposed patterned layers
• CPC Class Codes: C25D 17/06 Suspending or supporting devices for articles to be coated
• CPC Class Codes: C25D 5/022 using masking means
• CPC Class Codes: C25D 5/10 Electroplating with more than one layer of the same or of different metals for bearings C25D7/10
• CPC Class Codes: C25D 5/12 at least one layer being of nickel or chromium
• CPC Class Codes: C25D 5/22 Electroplating combined with mechanical treatment during the deposition
• CPC Class Codes: C25D 5/611 Smooth layers
• CPC Class Codes: H01L 21/2885 using an external electrical current, i.e. electro-deposition
• CPC Class Codes: H05K 3/241 characterised by the electroplating method; means therefor, e.g. baths or apparatus
• CPC Class Codes: Y10T 428/12486 Laterally noncoextensive components [e.g., embedded, etc.]
• CPC Class Codes: Y10T 428/239 Complete cover or casing

Abstract

An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

Claims

1. A method for forming a three-dimensional structure, comprising:

(A) forming a plurality of successively formed layers, wherein each successive layer comprises at least two materials and is formed on and adhered to a previously formed layer, one of the at least two materials is a structural material and the other of the at least two materials is a sacrificial material, and wherein each successive layer defines a successive cross-section of the three-dimensional structure, and wherein the forming of each of the plurality of successive layers comprises;

(i) depositing a first of the at least two materials;

(ii) depositing a second of the at least two materials;

(iii) planarizing the first and second materials to set a boundary level for the layer; and

(B) after the forming of the plurality of successive layers, separating at least a portion of the sacrificial material from multiple layers of the structural material to reveal the three-dimensional structure,

wherein the forming of at least a portion of the plurality of successively formed layers results in the complete encapsulation of at least one deposited core material by at least one deposited structural material different than the core material that is not removed by the separating step as exposed sacrificial material is removed such that the at least one completely encapsulated material becomes a part of the three-dimensional structure, and

wherein at least one of the deposited materials is deposited by electrodeposition.

2. The method of claim 1 wherein during formation of at least one given layer, the step of depositing the first of the at least two materials comprises depositing a sacrificial material.

3. The method of claim 1 wherein during formation of at least one given layer, the step of depositing the first of the at least two materials comprises depositing a structural material.

4. The method of claim 1 wherein during the formation of at least one given layer the at least two materials comprise at least three materials.

5. The method of claim 1 wherein the completely encapsulated material and the removed sacrificial material are the same material.

6. An electroplating method for fabricating a multi-layer three-dimensional structure, comprising:

(i) forming a first layer comprising depositing at least a first structural material and at least a first sacrificial material and planarizing the at least one deposited first structural material and the at least one deposited first sacrificial material to set a boundary level of the first layer;

(ii) forming additional layers with an initial additional layer formed on and adhered to the first layer and with subsequent additional layers formed on and adhered to previously formed additional layers, wherein the forming of each additional layer comprises depositing at least one additional structural material and depositing at least one additional sacrificial material and planarizing the at least one deposited additional structural material and the at least one additional sacrificial material to set a boundary level for each additional layer; and

(iii) removing at least a portion of the at least one sacrificial material deposited on a plurality of layers after formation of the additional layers to at least partially release the three-dimensional structure from the sacrificial material,

wherein the forming of at least a portion of the layers, results in the encapsulation of at least one deposited core material by at least one structural material such that the at least one structural material inhibits an etchant used to remove the at least portion of the at least one sacrificial material from encountering the at least one deposited core material, and wherein the core material and the at least one structural material form at least part of the three-dimensional structure, and

wherein at least one of the deposited materials is deposited by electrodeposition.

7. The method of claim 6 wherein during formation of a given layer, the step of depositing the structural material occurs prior to the step of depositing of the sacrificial material.

8. The method of claim 6 wherein during formation of a given layer, the step of depositing the sacrificial material occurs prior to the step of depositing of the structural material.

9. The method of claim 6 wherein during the formation of a given layer the depositing of the structural material and the depositing of the sacrificial material comprise depositing of at least three materials.

10. The method of claim 9 wherein during the formation of the given layer the at least three materials comprise at least three different electroplated materials.

11. A method for masking a multi-layer three-dimensional structure, comprising:

A. forming a bottom layer including a floor of the structure by depositing a structural material and a surrounding sacrificial material on a substrate;

B. planarizing the bottom layer;

C. forming one or more intermediate layers, including walls of the structure, over the bottom layer, with each intermediate layer formed by depositing at least one sacrificial material and at least one structural material and by planarizing the deposited materials, wherein a portion of the sacrificial material is located above the floor;

D. forming a further layer on an intermediate layer including a roof of the structure by depositing a structural material and a sacrificial material and planarizing the deposited materials, wherein the sacrificial material on the intermediate layers is completely encapsulated by structural material different than the sacrificial material on the floor, the walls, and the roof; and

E. etching the structure from surrounding sacrificial material with an etchant that etches the sacrificial material and that does not substantially etch the structural material of the bottom, intermediate or further layers, and

wherein at least one of the deposited materials is deposited by electrodeposition.

12. The method of claim 11 wherein the structural material deposited in step A is the same material as the structural material deposited in step C.

13. The method of claim 11 wherein the structural material deposited in step A is the same material as the structural material deposited in step D.

14. The method of claim 11 further comprising forming an additional layer on the further layer.

15. The method of claim 11 wherein the bottom layer is formed on sacrificial material on a substrate.