Light emitting diode structure
First Claim
Patent Images
1. A structure comprising:
- a substrate layer;
an array of posts, wherein each of the posts has a height between 0.2-4 μ
m, and the array of posts and the substrate layer are integrally formed from a single piece of material comprising a polymer material;
a corresponding array of laterally separate metallization layers directly over the array of posts; and
a semiconductor device layer directly over the array of laterally separate metallization layers, wherein the semiconductor device layer has a uniform thickness across the substrate layer.
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Abstract
A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.
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Citations
26 Claims
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1. A structure comprising:
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a substrate layer; an array of posts, wherein each of the posts has a height between 0.2-4 μ
m, and the array of posts and the substrate layer are integrally formed from a single piece of material comprising a polymer material;a corresponding array of laterally separate metallization layers directly over the array of posts; and a semiconductor device layer directly over the array of laterally separate metallization layers, wherein the semiconductor device layer has a uniform thickness across the substrate layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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Specification