Semiconductor light-emitting device and manufacturing method of the same

• US 8,552,444 B2
• Filed: 11/13/2008
• Issued: 10/08/2013
• Est. Priority Date: 11/19/2007
• Status: Expired due to Fees

• Current Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Inventors: Ide, Yoshiyuki, Kamei, Hidenori, Yonekura, Isamu, Obara, Kunihiko, Nakahara, Koichi, Nakatsu, Kouji, Tooya, Yoshirou, Kitazono, Toshirou, Maeda, Toshihide, Koya, Kenichi, Shirahata, Takahiro
• Primary Examiner(s): WOJCIECHOWICZ, EDWARD JOSEPH
• Application Number:
  US12/743,330
• Publication Number:
  US 20100258830A1
• Time in Patent Office: 1,790 Days
• Field of Search: 257/98, 313/512, 348/294
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/05111 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/05155 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/05169 Platinum [Pt] as principal constituent
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/0558 being stacked
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05639 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/05666 Titanium [Ti] as principal constituent
• CPC Class Codes: H01L 2224/13 of an individual bump connector
• CPC Class Codes: H01L 2224/14 of a plurality of bump connectors
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12035 : Zener diode
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 33/54 : having a particular shape
• CPC Class Codes: H01L 33/60 : Reflective elements

Abstract

Light from a semiconductor light-emitting element travels in all directions. Thus, light that travels in the directions other than a lighting direction cannot be used effectively. Means for forming a semiconductor light-emitting element having tilted side surfaces, and forming a reflective layer on the tilted side surfaces has been proposed. However, since the tilted surfaces are formed by an etching method or the like, it takes a long time to form the tilted surfaces, and it is difficult to control the tilted surfaces. As a solution to these problems, semiconductor light-emitting elements are placed on a submount substrate and sealed with a sealant, and then a groove is formed in a portion between adjoining ones of the semiconductor light-emitting elements. The grooves formed are filled with a reflective material, and a light-emitting surface is polished. Then, the submount substrate is divided into individual semiconductor light-emitting devices. Thus, a semiconductor light-emitting device having a reflective layer on its side surfaces can be obtained.

Claims

1. A semiconductor light-emitting device, comprising:

a semiconductor light-emitting element;

a submount for placing the semiconductor light-emitting element thereon and having a mounting surface for placing the semiconductor light-emitting element thereon;

a sealant for sealing the semiconductor light-emitting element over the submount; and

a reflective layer provided on a side surface of the sealant, provided that a light-emitting surface of the sealant is an upper surface, wherein;

the submount is a flat plate on a center part of which the semiconductor light-emitting element is mounted, and includes, in at least part of a side wall of the flat plate, a step part in which a surface of the flat plate opposite to the mounting surface outwardly protrudes beyond the mounting surface, and

part of the reflective layer contacts the step part, and fully fills up the step part so as to be flush with an outermost side surface of the submount.

2. The semiconductor light-emitting device of claim 1, wherein

the sealant has a flat surface as the light-emitting surface.

3. The semiconductor light-emitting device of claim 2, wherein

the reflective layer is flush with the light-emitting surface, and is in contact with both the sealant and the submount.

4. The semiconductor light-emitting device of claim 1, wherein

a boundary surface between the sealant and the reflective layer is substantially perpendicular to a surface of the submount.

5. The semiconductor light-emitting device of claim 1, wherein

a boundary surface between the sealant and the reflective layer is at an obtuse angle to a surface of the submount.

6. The semiconductor light-emitting device of claim 1, further comprising:

a fine concavo-convex structure provided on the light-emitting surface.

7. The semiconductor light-emitting device of claim 1, further comprising:

a phosphor layer formed around the semiconductor light-emitting element.