Light-emitting diode packaging structure of low angular correlated color temperature deviation

• US 8,552,456 B1
• Filed: 06/07/2012
• Issued: 10/08/2013
• Est. Priority Date: 03/14/2012
• Status: Active Grant

• Current Assignee: National Central University
• Original Assignee: National Central University
• Inventors: Sun, Ching-Cherng, Chen, Ching-Yi, Chiu, Chih-Yu
• Primary Examiner(s): HO, TU TU V
• Application Number:
  US13/491,255
• Publication Number:
  US 20130240926A1
• Time in Patent Office: 488 Days
• Field of Search: 257/98, 257/100, 257/E33.059, 257/E33.061, 257/E33.068
• US Class Current: 257/98
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/58 Optical field-shaping elements

Abstract

A light-emitting diode (LED) packaging structure having low angular correlated color temperature deviation includes: a substrate, a LED chip, a phosphor body, and a transparent lens. The LED chip is disposed on the substrate, and the phosphor body includes a hemisphere body and an extension part extended from the bottom of the hemisphere body. The phosphor body is disposed on the substrate and covers the LED chip. Besides, the transparent lens is disposed outside the phosphor body to cover the phosphor body to increase light extraction efficiency. With the implementation of the present invention, the setup of the extension part makes a longer vertical distance between the LED chip and the top of the phosphor body, so that the light in the normal direction of the LED chip can have a longer optical length, thereby to reduce the angular correlated color temperature deviation.

Claims

1. A light-emitting diode (LED) packaging structure of low angular correlated color temperature deviation, comprising:

a substrate;

an LED chip disposed on the substrate;

a phosphor body, comprising;

a hemisphere body having a bottom surface; and

an extension portion formed by extending from the bottom surface toward the substrate and disposed on the substrate to cover the LED chip, wherein the surface of the extension portion is perpendicular to the substrate; and

a transparent lens disposed outside the phosphor body to cover the phosphor body;

wherein the bottom surface has a radius of 0.5˜

5 mm, and an axis of the hemisphere body coincides with a vertical central line of the LED chip, wherein a vertical distance between the bottom surface and an upper surface of the substrate is 0.05˜

3 mm.

2. The LED packaging structure of claim 1, wherein the substrate is one of an aluminum circuit substrate, a ceramic circuit substrate, and a PCB circuit substrate.

3. The LED packaging structure of claim 1, wherein the LED chip is a blue LED chip and the phosphor body contains yellow phosphor materials.

4. The LED packaging structure of claim 1, wherein the bottom surface has a radius of 1.5 mm, and the vertical distance between the bottom surface and the upper surface of the substrate is 0.3 mm.

5. The LED packaging structure of claim 1, wherein the bottom surface has a radius of 1.5 mm, and the vertical distance between the bottom surface and the upper surface of the substrate is 0.2 mm.

6. The LED packaging structure of claim 1, wherein the transparent lens is bullet-shaped.

7. The LED packaging structure of claim 1, wherein the transparent lens is made of glass, epoxy resin, or silicone.