Method for reducing stress in epitaxial growth
First Claim
1. A method for fabricating a semiconductor device, said method comprising:
- depositing a precursor stress relief layer on a substrate characterized by a first TEC;
epitaxially depositing a first semiconductor layer on said precursor stress relief layer, said first semiconductor layer being characterized by a second TEC, different from said first TEC; and
converting said precursor stress relief layer to a stress relief layer comprising a stress relief material that relieves stress between said substrate and said first semiconductor layer arising from differences in said first and second TECs at a growth temperature at which layers are grown epitaxially on said first semiconductor layer, said stress relief material being non-crystalline at said growth temperature.
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Abstract
A device and method for making the same are disclosed. The device includes a substrate having a first TEC, a stress relief layer overlying the substrate, and crystalline cap layer. The crystalline cap layer overlies the stress relief layer. The cap layer has a second TEC different from the first TEC. The stress relief layer includes an amorphous material that relieves stress between the crystalline substrate and the cap layer arising from differences in the first and second TECs at a growth temperature at which layers are grown epitaxially on the cap layer. The device can be used to construct various semiconductor devices including GaN LEDs that are fabricated on silicon or SiC wafers. The stress relief layer is generated by converting a layer of precursor material on the substrate after the cap layer has been grown to a stress-relief layer.
57 Citations
15 Claims
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1. A method for fabricating a semiconductor device, said method comprising:
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depositing a precursor stress relief layer on a substrate characterized by a first TEC; epitaxially depositing a first semiconductor layer on said precursor stress relief layer, said first semiconductor layer being characterized by a second TEC, different from said first TEC; and converting said precursor stress relief layer to a stress relief layer comprising a stress relief material that relieves stress between said substrate and said first semiconductor layer arising from differences in said first and second TECs at a growth temperature at which layers are grown epitaxially on said first semiconductor layer, said stress relief material being non-crystalline at said growth temperature. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method for fabricating a semiconductor device, comprising:
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depositing a precursor stress relief layer on a substrate, the precursor stress relief layer having a first TEC; epitaxially depositing a first semiconductor layer on said precursor stress relief layer, said first semiconductor layer having a second TEC different from said first TEC; and converting said precursor stress relief layer to a stress relief layer comprising a stress relief material that relieves stress between said substrate and said first semiconductor layer arising from differences in said first and second TECs by heating said precursor material at a growth temperature at which layers are grown epitaxially on said first semiconductor layer, said stress relief material being non-crystalline at said growth temperature. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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Specification