3D integrated microelectronic assembly with stress reducing interconnects
First Claim
1. A microelectronic assembly, comprising:
- a first microelectronic element comprising;
a substrate with first and second opposing surfaces,a semiconductor device, andconductive pads at the first surface which are electrically coupled to the semiconductor device;
a second microelectronic element comprising;
a handler with first and second opposing surfaces,a second semiconductor device, andconductive pads at the handler first surface which are electrically coupled to the second semiconductor device;
the first and second microelectronic elements are integrated to each other such that the second surfaces face each other;
the first microelectronic element includes conductive elements each extending from one of the conductive pads and through the substrate to the second surface of the first microelectronic element;
the second microelectronic element includes conductive elements each extending between the first and second surfaces of the handler; and
each of the conductive elements of the first microelectronics element is electrically coupled to at least one of the conductive elements of the second microelectronics element.
2 Assignments
0 Petitions
Accused Products
Abstract
A microelectronic assembly and method of making, which includes a first microelectronic element (including a substrate with first and second opposing surfaces, a semiconductor device, and conductive pads at the first surface which are electrically coupled to the semiconductor device) and a second microelectronic element (including a handier with first and second opposing surfaces, a second semiconductor device, and conductive pads at the handler first surface which are electrically coupled to the second semiconductor device). The first and second microelectronic elements are integrated such that the second surfaces face each other. The first microelectronic element includes conductive elements each extending from one of its conductive pads, through the substrate to the second surface. The second microelectronic element includes conductive elements each extending between the handler first and second surfaces. The conductive elements of the first microelectronics element are electrically coupled to the conductive elements of the second microelectronics element.
-
Citations
16 Claims
-
1. A microelectronic assembly, comprising:
-
a first microelectronic element comprising; a substrate with first and second opposing surfaces, a semiconductor device, and conductive pads at the first surface which are electrically coupled to the semiconductor device; a second microelectronic element comprising; a handler with first and second opposing surfaces, a second semiconductor device, and conductive pads at the handler first surface which are electrically coupled to the second semiconductor device; the first and second microelectronic elements are integrated to each other such that the second surfaces face each other; the first microelectronic element includes conductive elements each extending from one of the conductive pads and through the substrate to the second surface of the first microelectronic element; the second microelectronic element includes conductive elements each extending between the first and second surfaces of the handler; and each of the conductive elements of the first microelectronics element is electrically coupled to at least one of the conductive elements of the second microelectronics element. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
-
Specification