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Wireless IC device

  • US 8,552,870 B2
  • Filed: 05/14/2012
  • Issued: 10/08/2013
  • Est. Priority Date: 07/09/2007
  • Status: Active Grant
First Claim
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1. A wireless IC device comprising:

  • a high-frequency device defined by an electromagnetically coupled module or a wireless IC chip, the electromagnetically coupled module including the wireless IC chip and a feed circuit board coupled to an external circuit and electrically connected to or electromagnetically coupled to the wireless IC chip;

    a loop electrode coupled to the high-frequency device;

    an insulation sheet on which the high-frequency device and the loop electrode are arranged; and

    a radiation electrode coupled to the loop electrode, said radiation electrode defining a radiator;

    whereinthe insulation sheet has a plane bonded to a plane of the radiation electrode by being separated into different directions at one end such that a loop plane of the loop electrode is perpendicular or inclined relative to the plane of the radiation electrode by being bonded to the plane of the radiation electrode; and

    the loop electrode is provided near inside an area of the radiation electrode.

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