Stage drive method and stage unit, exposure apparatus, and device manufacturing method

• US 8,553,203 B2
• Filed: 08/05/2009
• Issued: 10/08/2013
• Est. Priority Date: 02/02/2004
• Status: Expired due to Fees

• Current Assignee: Nikon Corporation
• Original Assignee: Nikon Corporation
• Inventors: Shibazaki, Yuichi
• Primary Examiner(s): NGUYEN, HUNG
• Application Number:
  US12/461,244
• Publication Number:
  US 20090296069A1
• Time in Patent Office: 1,525 Days
• Field of Search: 355/30, 355/53, 355 72- 76
• US Class Current: 355/72
• CPC Class Codes: G03F 7/70341 Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply chemical composition of immersion liquids G03F7/2041
• CPC Class Codes: G03F 7/70666 Aerial image, i.e. measuring the image of the patterned exposure light at the image plane of the projection system
• CPC Class Codes: G03F 7/70725 control
• CPC Class Codes: G03F 7/70733 Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

When a transition from a first state where one stage is positioned at a first area directly below projection optical system to which liquid is supplied to a state where the other stage is positioned at the first area, both stages are simultaneously driven while a state where both stages are close together in the X-axis direction is maintained. Therefore, it becomes possible to make a transition from the first state to the second state in a state where liquid is supplied in the space between the projection optical system and the specific stage directly under the projection optical system. Accordingly, the time from the completion of exposure operation on one stage side until the exposure operation begins on the other stage side can be reduced, which allows processing with high throughput. Further, because the liquid can constantly exist on the image plane side of the projection optical system, generation of water marks on optical members of the projection optical system on the image plane side is prevented.

Claims

1. An exposure method of exposing a substrate via a projection optical system and a liquid, the method comprising:

holding the liquid in a space between the projection optical system and one of a first stage and a second stage that are movable independently from each other;

detecting a mark on a substrate mounted on the other of the first stage and the second stage by a mark detection system placed apart from the projection optical system in a first direction; and

driving the first and second stages in a second direction intersecting the first direction so that a transition from a first state where the one of the stages faces the projection optical system to a second state where the other of the stages faces the projection optical system is performed while holding the liquid in the space between the projection optical system and at least one of the stages and while maintaining the liquid in contact with the projection optical system.

2. The exposure method according to claim 1, wherein

prior to the transition operation, scanning exposure of a substrate mounted on the one of the stages is performed via the projection optical system and the liquid, and the one of the stages is driven in the first direction during the scanning exposure.

3. The exposure method according to claim 1, wherein

on each of the first and second stages, when a substrate is mounted on a mounting area, a surface of the substrate is substantially flush with a surface of a surrounding area of the mounting area.

4. The exposure method according to claim 3, wherein

a reference mark whose surface is flush with the surface of the surrounding area, on the other of the stages, is detected by the mark detection system.

5. The exposure method according to claim 3, wherein

during an exposure operation of a plurality of substrates, at least one of the first and second stages constantly faces the projection optical system via the liquid.

6. The exposure method according to claim 1, wherein

during the transition operation, a substrate after exposure is mounted on the one of the stages and a substrate after mark detection by the mark detection system is mounted on the other of the stages.

7. The exposure method according to claim 6, wherein

an exposure operation of a substrate mounted on the one of the stages and a mark detection operation of a substrate mounted on the other of the stages are performed in parallel, and exposure processing is performed alternately to the substrate mounted on the one of the stages and to the substrate mounted on the other of the stages.

8. The exposure method according to claim 1, wherein

during the transition operation, the first and second stages are simultaneously driven while their positional relation is maintained.

9. The exposure method according to claim 8, wherein

the other of the stages is made to approach the one of the stages so that the first and second stages come into contact or come close.

10. A device manufacturing method, comprising:

a lithography process of exposing a substrate with an energy beam by using the exposure method according to claim 1.

11. An exposure method of exposing a substrate via a projection optical system and a liquid, the method comprising:

mounting a substrate on one of a first stage and a second stage that are movable independently from each other;

performing scanning exposure of a substrate mounted on the one of the stages via the projection optical system and the liquid, while moving the one of the stages in a first direction; and

driving the first and second stages in a second direction intersecting the first direction so that a transition from a first state where the one of the stages faces the projection optical system to a second state where the other of the stages faces the projection optical system is performed while holding the liquid in a space between the projection optical system and at least one of the stages and while maintaining the liquid in contact with the projection optical system.

12. The exposure method according to claim 11, wherein

each of the first and second stages is movable in a predetermined area that includes a first area where the projection optical system is placed and a second area located on one side in the first direction with respect to the first area.

13. The exposure method according to claim 12, wherein

a mark present on the other of the stages is detected by a mark detection system placed in the second area.

14. The exposure method according to claim 11, wherein

on each of the first and second stages, when a substrate is mounted on a mounting area, a surface of the substrate is substantially flush with a surface of a surrounding area of the mounting area.

15. The exposure method according to claim 14, further comprising:

detecting a mark on a substrate mounted on the other of the stages and a reference mark whose surface is substantially flush with the surface of the surrounding area on the other of the stages, by a mark detection system.

16. The exposure method according to claim 14, wherein

during an exposure operation of a plurality of substrates, at least one of the first and second stages constantly faces the projection optical system via the liquid.

17. The exposure method according to claim 11, further comprising:

detecting a mark on a substrate mounted on the other of the stages by a mark detection system, wherein

during the transition operation, a substrate after exposure is mounted on the one of the stages and a substrate after mark detection by the mark detection system is mounted on the other of the stages.

18. The exposure method according to claim 17, wherein

an exposure operation of a substrate mounted on the one of the stages and a mark detection operation of a substrate mounted on the other of the stages are performed in parallel, and exposure processing is performed alternately to the substrate mounted on the one of the stages and to the substrate mounted on the other of the stages.

19. The exposure method according to claim 11, wherein

during the transition operation, the first and second stages are simultaneously driven while their positional relation is maintained.

20. The exposure method according to claim 19, wherein

the other of the stages is made to approach the one of the stages so that the first and second stages come into contact or come close.

21. A device manufacturing method, comprising:

a lithography process of exposing a substrate with an energy beam by using the exposure method according to claim 11.

22. An exposure method of exposing a substrate via a projection optical system and a liquid, the method comprising:

holding the liquid in a space between the projection optical system and one of a first stage and a second stage that are movable independently from each other in a predetermined area that includes a first area where the projection optical system is placed and a second area located on one side in a first direction with respect to the first area; and

driving the first and second stages in a second direction intersecting the first direction so that a transition from a first state where the one of the stages faces the projection optical system to a second state where the other of the stages faces the projection optical system is performed while holding the liquid in the space between the projection optical system and at least one of the stages and while maintaining the liquid in contact with the projection optical system.

23. The exposure method according to claim 22, wherein

a mark present on the other of the stages is detected by a mark detection system placed in the second area.

24. The exposure method according to claim 22, wherein

on each of the first and second stages, a substrate is mounted on a mounting area so that a surface of the substrate is substantially flush with a surface of a surrounding area of the mounting area.

25. The exposure method according to claim 24, further comprising:

detecting a mark on the substrate mounted on the other of the stages and a reference mark whose surface is substantially flush with the surface of the surrounding area on the other of the stages, by a mark detection system placed in the second area.

26. The exposure method according to claim 24, wherein

during an exposure operation of a plurality of substrates, at least one of the first and second stages constantly faces the projection optical system via the liquid.

27. The exposure method according to claim 22, further comprising:

detecting a mark on a substrate mounted on the other of the stages by a mark detection system placed in the second area, wherein

during the transition operation, a substrate after exposure is mounted on the one of the stages and a substrate after mark detection by the mark detection system is mounted on the other of the stages.

28. The exposure method according to claim 27, wherein

an exposure operation of a substrate mounted on the one of the stages and a mark detection operation of a substrate mounted on the other of the stages are performed in parallel, and exposure processing is performed alternately to the substrate mounted on the one of the stages and to the substrate mounted on the other of the stages.

29. The exposure method according to claim 22, wherein

during the transition operation, the first and second stages are simultaneously driven while their positional relation is maintained.

30. The exposure method according to claim 29, wherein

the other of the stages is made to approach the one of the stages so that the first and second stages come into contact or come close.

31. A device manufacturing method, comprising:

a lithography process of exposing a substrate with an energy beam by using the exposure method according to claim 22.