Methods of operating electronic devices, and methods of providing electronic devices
First Claim
1. A packaged microelectronic device comprising:
- a first die received with the package, the first die having first transmit and receive circuitry configured to transmit and receive radio frequency signals via a first antenna;
a second die received within the package, the second die discrete from the first die and having second transmit and receive circuitry configured to transmit and receive radio frequency signals via a second antenna;
wherein at least one of the first die and the second die are void of electrical interconnects that carry communication signals between each other;
wherein the first transmit and receive circuitry and the second transmit and receive circuitry are configured to establish a wireless communications link between the first and second die, and wherein there is no communication between the first and second die other than via a wireless communications link; and
wherein power or ground connections are the only physical electrical connections to at least one of the first and second die.
1 Assignment
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Accused Products
Abstract
Some embodiments include a method disposing an integrated circuit die within a housing, the integrated circuit die having integrated circuitry formed thereon, the integrated circuitry including first transponder circuitry configured to transmit and receive radio frequency signals, wherein the integrated circuit die is void of external electrical connections for anything except power supply external connections; and disposing second transponder circuitry, discrete from the first transponder circuitry, within the housing, the second transponder circuitry being configured to transmit and receive radio frequency signals, wherein the first and second transponder circuitry are configured to establish wireless communication between one another within the housing, the second transponder circuitry being disposed within 24 inches of the first transponder circuitry within the housing.
63 Citations
18 Claims
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1. A packaged microelectronic device comprising:
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a first die received with the package, the first die having first transmit and receive circuitry configured to transmit and receive radio frequency signals via a first antenna; a second die received within the package, the second die discrete from the first die and having second transmit and receive circuitry configured to transmit and receive radio frequency signals via a second antenna; wherein at least one of the first die and the second die are void of electrical interconnects that carry communication signals between each other; wherein the first transmit and receive circuitry and the second transmit and receive circuitry are configured to establish a wireless communications link between the first and second die, and wherein there is no communication between the first and second die other than via a wireless communications link; and wherein power or ground connections are the only physical electrical connections to at least one of the first and second die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A packaged electronic device, comprising:
a microelectronic package; a plurality of die mounted within the microelectronic package, each of the plurality of die having a processor and transceiver circuitry coupled to the processor, wherein an antenna is coupled to the transceiver circuitry; and physical connections to each of the plurality of die, wherein the physical connections provide only power connections to the die; wherein the transceiver circuitry on each of the die is configured to establish wireless communications links among individual ones of the die, and wherein there is no communication among the plurality of die other than via the wireless communications links. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
Specification