Prediction strategy for thermal management and protection of power electronic hardware
First Claim
1. A method for managing thermal energy in a power electronics device for a hybrid powertrain system comprising an engine and an electric machine, the power electronics device including a plurality of electric circuit layers and a cooling system, the method comprising:
- monitoring a plurality of temperature sensors in the power electronics device;
monitoring electric power into and out of the power electronics device;
predicting temperatures for the plurality of electric circuit layers;
controlling the hybrid powertrain system based upon the predicted temperatures for the plurality of electric circuit layers and modulating electric signals within the power electronics device based upon the predicted temperatures for the plurality of electric circuit layers, wherein a first electric circuit layer comprises a plurality of electric filter-capacitors and a second electric circuit layer comprises a plurality of semiconductor power modules; and
increasing a switching frequency of the semiconductor power modules when the predicted temperature of the first electric circuit layer exceeds a predetermined temperature threshold.
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Accused Products
Abstract
A hybrid powertrain system includes an engine, an electric machine, a power electronics device including a plurality of electric circuit layers, and a cooling system. A method for managing thermal energy in the power electronics device includes monitoring a plurality of temperature sensors in the power electronics device, monitoring electric power into and out of the power electronics device, predicting temperatures for the plurality of electric circuit layers, and controlling the hybrid powertrain system based upon the predicted temperatures for the plurality of electric circuit layers.
251 Citations
16 Claims
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1. A method for managing thermal energy in a power electronics device for a hybrid powertrain system comprising an engine and an electric machine, the power electronics device including a plurality of electric circuit layers and a cooling system, the method comprising:
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monitoring a plurality of temperature sensors in the power electronics device; monitoring electric power into and out of the power electronics device; predicting temperatures for the plurality of electric circuit layers; controlling the hybrid powertrain system based upon the predicted temperatures for the plurality of electric circuit layers and modulating electric signals within the power electronics device based upon the predicted temperatures for the plurality of electric circuit layers, wherein a first electric circuit layer comprises a plurality of electric filter-capacitors and a second electric circuit layer comprises a plurality of semiconductor power modules; and increasing a switching frequency of the semiconductor power modules when the predicted temperature of the first electric circuit layer exceeds a predetermined temperature threshold. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method for managing thermal energy in a power electronics device for a hybrid powertrain system comprising a plurality of torque generative devices, the power electronics device including a plurality of electric circuit layers and a cooling system, the method comprising:
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monitoring a plurality of temperature sensors in the power electronics device; monitoring electric power into and out of the power electronics device; predicting temperatures for the plurality of electric circuit layers; controlling the hybrid powertrain system based upon the predicted temperatures for the plurality of electric circuit layers and modulating electric signals within the power electronics device based upon the predicted temperatures for the plurality of electric circuit layers, wherein a first electric circuit layer comprises a plurality of electric filter-capacitors and a second electric circuit layer comprises a plurality of semiconductor power modules; and controlling the plurality of torque generative devices based upon the predicted temperatures for the plurality of electric circuit layers including increasing a switching frequency of the semiconductor power modules when the predicted temperature of the first electric circuit layer exceeds a predetermined temperature threshold. - View Dependent Claims (15, 16)
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Specification